JPH05177478A - Plate working and checking method - Google Patents

Abstract

PURPOSE:To fix a plate stably during working or checking by sticking a film sheet to one side surface of the plate, and making the film sheet subject to air suction. CONSTITUTION:When a substrate 1 is locked on a working table 11, a film sheet 2 is stuck to a setting surface of the substrate 1, and the backside of this film sheet 2 is mounted on top of a vacuum chuck 18 and attracted by suction force. With this air suction, a through hole 3 of the substrate 1 is closed by the film sheet 2, so that suction force of the vacuum chuck 18 will in no case go down at all, and in addition, the film sheet 2 is not situated on a working surface 4 of the substrate 1, through which it is not broken by the working, whereby the substrate 1 can be surely locked in a stable manner during operation. Moreover, since the film sheet 2 is bonded over the whole setting surface of the substrate 1, there is no effect on flatness or the like of a surface of the substrate 1, thus highly accurate working can be done in this way.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for processing or inspecting a plate material such as a printed circuit board having holes.

[0002]

2. Description of the Related Art In the case of producing a test circuit or a small lot of electronic circuits, a method is used in which an electronic circuit is formed on a substrate having a copper-clad surface by using a cutting tool, laser light or the like.

In the processing of such a printed board, one surface of the board is fixed to a table of a processing machine and the other surface is processed, but the thin and rigid board is accurately fixed without being deformed. In order to do so, usually, as shown in FIG. 3, a vacuum chuck 22 is attached on the table 21, and the substrate 23 is sucked and fixed by the vacuum chuck 22.

The printed circuit board on which the electronic circuit is formed is fixed on a table of the same processing machine or an inspection table by using a vacuum chuck, and the pattern of the electronic circuit is inspected.

[0005]

However, the printed circuit board may be provided with a through hole 24 for mounting wiring, mounting components, etc.
The air suction force by the vacuum chuck 22 is greatly reduced,
There is a problem that the substrate 23 cannot be fixed.

On the other hand, conventionally, a method of covering the surface of the substrate 23 with a film-like thin film sheet 25 as shown in FIG. 4 to enhance the air suction force has been considered. If the sheet 25 is broken during processing, the degree of vacuum inside the sheet 25 is reduced, and there is a problem that stable fixation of the substrate cannot be obtained.

Therefore, the present invention is intended to provide a method for stably and accurately fixing a plate material having a through hole, such as the above-mentioned printed circuit board.

[0008]

In order to solve the above problems, the present invention employs a method of adhering a thin film sheet to one surface of a plate material and sucking the thin film sheet by air.

[0009]

In the above method, since the thin film sheet closes the holes of the plate material, the suction force does not decrease, and the air can be reliably sucked. Further, since the thin film sheet is not on the processed surface or the inspection surface of the plate material, the sheet is not broken.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENT FIG. 1 shows a processing apparatus for carrying out the method of the invention. This processing apparatus is movably attached to a processing table 11 movably installed on a base 10 and a guide shaft 13 extending in parallel above the processing table 11 via a gate-shaped support member 12. And a lift table 15 attached to the slide table 14.
A tool spindle 16 is attached to the.

The processing table 11 and the slide table 14 are orthogonal to each other on the horizontal plane (X-axis and Y-axis directions).
The vertical movement of the lifting table 15 is combined with the vertical movement of the lifting table 15, so that the tool 17 mounted on the tool spindle 16 can be freely moved to an arbitrary position on the processing table 11.

A vacuum chuck 18 for fixing the substrate 1 is attached to the processing table 11. The vacuum chuck 18 has an upper surface 18a as shown in FIG.
A suction chamber 19 is formed in the suction chamber 19, and an air suction means (not shown) such as a vacuum pump is connected to the suction passage 20 formed inside, and the air in the suction chamber 19 is sucked to make a negative pressure in the chamber. As a result, the substrate 1 is attracted to the upper surface 18a.

In the processing apparatus having the above structure, in order to fix the substrate 1 on the processing table 11, the thin film sheet 2 is adhered to the mounting surface of the substrate 1 as shown in FIG. The back surface is placed on the top surface of the vacuum chuck 18 and is adsorbed.

The thin film sheet 2 is made of a synthetic resin film or the like having a thickness of 0.1 mm or less. An adhesive layer is provided on one surface or both surfaces of the thin film sheet 2 and is bonded to the substrate 1 or the substrate 1 and the upper surface of the vacuum chuck 18. Further, the thin film sheet 2 is formed in the same shape as the surface shape of the substrate 1 so as to cover all the through holes 3 formed in the substrate 1.

In the fixing method described above, since the through hole 3 of the substrate 1 is closed by the thin film sheet 2, the suction force of the vacuum chuck 18 does not decrease, and the thin film sheet 2 is attached to the substrate 1.
Since it is not on the processed surface 4 and is not broken by the processing, the substrate can be stably and reliably fixed during the processing.

Further, since the thin film sheet 2 is adhered to the entire mounting surface of the substrate 1, the flatness of the surface of the substrate 1 is not affected, and high-precision processing can be performed.

In the above embodiment, an example of processing the substrate has been shown, but it can also be used for the work of inspecting an electronic circuit or the like formed on the substrate.

Further, the plate material to be processed or inspected is not limited to the above-mentioned printed circuit board, and any plate material having a relatively thin plate thickness can be applied.

[0019]

As described above, according to the present invention, since the thin film sheet is adhered to the mounting surface of the plate material so as to close the hole of the plate material, there is no decrease in the suction force due to the air suction, and during processing or inspection. The plate material can be stably fixed.

[Brief description of drawings]

FIG. 1 is a perspective view showing a substrate processing apparatus.

FIG. 2 is a sectional view showing a fixing structure of a substrate.

FIG. 3 is a sectional view showing a conventional example.

FIG. 4 is a sectional view showing another conventional example.

[Explanation of symbols]

 1 Substrate 2 Thin Film Sheet 3 Through Hole 11 Processing Table 16 Tool Spindle

Claims (1)

[Claims] 1. A method for processing and inspecting a plate material, wherein one surface of the plate material is air-sucked and fixed to a table, and the other surface of the plate material is processed or inspected, and a thin film is formed on one surface of the plate material. A method for processing and inspecting a plate material, which comprises adhering sheets and sucking the thin film sheet by air suction.