JPH05167334A - Antenna for moving body communication - Google Patents

Abstract

PURPOSE:To easily protect a plating layer of a through-hole and a via hole without necessitating gold plating. CONSTITUTION:By a multi-layer laminated plate 7 formed by laminating a patch antenna element layer 11 and a circuit pattern layer 10, respectively, and also, laminating an earth pattern layer 4 between the patch antenna element layer 11 and the circuit pattern layer 11, an antenna base body is manufactured. By providing a through-hole 13 and a via hole 8 on the multi-layer laminated plate 7, and also, providing plating layers 9, 14 in the inside periphery of the through-hole 13 and the via-hole 8, the antenna for a moving body communication is formed. By a solder resist 16 deposited on the surface of the multi-layer laminated plate 7, an opening of the through-hole 13 and the via hole 8 is closed up. By the solder resist 16 for processing the surface of the multilayer laminated plate 7, the plating layers 9, 14 of the through-hole and the via hole 8 are shut off from the atmosphere and protected.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mobile communication antenna mounted on a mobile body such as a mobile phone or a car phone.

[0002]

2. Description of the Related Art Cellular phones, car phones, and GPS
(Global Positioning System
m) An antenna used for a receiving system or the like is required to be compact and have a thin shape in order to be mounted on a moving body such as an automobile. Therefore, a printed antenna formed as a microstrip antenna is provided. This printed antenna is manufactured by using a laminated plate on which a metal foil is stretched. For example, as shown in FIG.
The following are considered by the applicant.

This is a patch antenna element layer 11 formed by printing a metal foil such as a copper foil.
The antenna base body is formed by the multilayer laminated plate 7 in which the circuit pattern layer 10 and the earth pattern layer 4 are laminated. By plating the through hole 13 by forming the through hole 13 in the multilayer laminated plate 7 so as to pass through the hole 15 provided in the central portion of the ground pattern layer 4 and forming the plating layer 14 on the inner periphery of the through hole 13. The antenna element layer 11 and the circuit pattern layer 10 are conductively connected by the layer 14, and the multilayer laminated plate 7 is provided with a non-penetrating via hole 8 to form the plated layer 9 on the inner periphery of the via hole 8. The circuit pattern layer 10 and the earth pattern layer 4 are electrically connected by the plated layer 9 in the hole 8 to complete the antenna for mobile communication.

[0004]

However, as described above, the plated layer 14 is provided in the through hole 13 and the plated layer 9 is provided in the via hole 8, so that the circuit pattern layer 1 is formed.
0 and the patch antenna element layer 11 and the earth pattern layer 4 are connected, the plated layer 1 of the through hole 13
4 and the plated layer 9 of the via hole 8 are generally formed by copper plating, and therefore may be corroded and deteriorated in connection reliability when exposed to the atmosphere. Therefore, Ni plating or Au plating is applied to the plated layer 14 of the through hole 13 and the via hole 8.
It is under study to protect the plating layers 14 and 9 by applying them to the surface of the plating layer 9 of
When these plating layers 14 and 9 are formed in independent patterns, Ni plating or Au plating cannot be performed by electroplating, so electroless plating must be performed, which complicates the process and increases costs. There was a problem that led to.

The present invention has been made in view of the above points, and provides a mobile communication antenna capable of easily protecting a plated layer of a through hole or a via hole without requiring protection by plating. The purpose is.

[0006]

A mobile communication antenna according to the present invention has a patch antenna element layer 11 on one surface.
The circuit pattern layer 10 is laminated on the other surface, and the patch antenna element layer 11 and the circuit pattern layer 1
The antenna substrate is made of the multilayer laminated plate 7 in which the ground pattern layer 4 is laminated between 0 and the through hole 1 is formed in the multilayer laminated plate 7.
3 and the via hole 8 and the through holes 13 and the plated holes 9 and 14 formed on the inner periphery of the via hole 8 in the mobile communication antenna, the solder resist 16 applied to the surface of the multilayer laminate 7 Through hole 1
3 and the opening of the via hole 8 are closed.

Further, in the present invention, the through holes 13 and the via holes 8 may be closed by the solder 17 adhered to the surface of the multilayer laminated plate 7.

[0008]

By blocking the through holes 13 and the via holes 8 with the solder resist 16 or the solder 17 attached to the surface of the multilayer laminate 7, the plated layers 9 and 14 of the through holes 13 and the via holes 8 are shielded from the atmosphere. Can be prevented from being exposed to the atmosphere.

[0009]

EXAMPLES The present invention will be described in detail below with reference to examples. The mobile communication antenna is formed by using a multi-layer laminated plate 7 formed by laminating a patch antenna element layer 11, a circuit pattern layer 10 and an earth pattern layer 4 formed by printing a metal foil such as a copper foil as an antenna substrate. It is a thing.
The multilayer laminated plate 7 is drilled so as to pass through the hole 15 provided in the central portion of the ground pattern layer 4, and penetrates from the circuit pattern layer 10 to the patch antenna element layer 11 to form a through hole 13. In addition, a non-penetrating via hole 8 is provided as a blind via hole from the circuit pattern layer 10 to the ground pattern layer 4. By performing electroless copper plating or the like, a plated layer 14 such as copper plated is provided on the inner periphery of the through hole 13 and a plated layer 9 such as copper plated is provided on the inner periphery of the via hole 8. The circuit pattern layer 10 and the patch antenna element layer 11 are electrically connected by the plated layer 14 of the circuit pattern layer 10 and the ground pattern layer 4 by the plated layer 9 of the via hole 8.
Are electrically connected.

As shown in FIG. 1 (a), the antenna substrate is thus formed.
After the multi-layer laminated plate 7 as shown in FIG. 1 is created, the entire surface of both surfaces of the multi-layer laminated plate 7 is solder resist 16 as shown in FIG.
Cover with. A photosensitive photo solder resist is used as the solder resist 16, and either a dry film type solder resist or a liquid photo solder resist can be used as the photo solder resist. The dry film type solder resist is commercially available as DuPont Japan's "Bakurel" and Morton International Inc. Dynachem's "COMFORMASK", and the liquid photo solder resist is manufactured by Taiyo Ink " PSR
A commercially available product such as "-400" can be used. In the case of the dry film type solder resist 16, the surface of the multilayer laminate 7 can be covered with the solder resist 16 by laminating.
In the case of the liquid solder resist 16, the surface of the multilayer laminated plate 7 can be coated with the solder resist 16 by coating the entire surface by screen printing or the like and drying.

As shown in FIG. 1B, after covering the entire surfaces of both surfaces of the multilayer laminate 7 with the solder resist 16, only the portion of the solder resist 16 that is desired to be left is exposed by exposure to light such as ultraviolet rays, and exposed. The portion that has been set is cured. After that, a developing solution such as a solvent or an alkaline solution is used to dissolve and remove the unexposed portion of the solder resist 16 as shown in FIG. The solder resist 16 in a portion of the circuit pattern layer 10 or the patch antenna element layer 11 to which the solder 17 is attached is dissolved and removed, and the openings of the through holes 13 and the openings of the via holes 8 are left closed by the solder resist 16. There is. Then, after that, the multi-layer laminate 7 is dipped in a solder bath and subjected to a solder leveler treatment, so that the circuit pattern layer 10 and the patch antenna are not covered with the solder resist 16 as shown in FIG. 1D. The solder 17 is attached to the surface of the element layer 11 with a thickness of about 10 μm. In the mobile communication antenna thus created, since the through holes 13 and the via holes 8 are closed by the solder resist 16, air is blocked by the solder resist 16 and the through holes are formed. Plating layer 14 on the inner circumference of 13 and plating layer 9 on the inner circumference of the via hole 8
Can be prevented from being exposed to the atmosphere, so that it is not necessary to perform Ni plating or Au plating to protect these plated layers 9 and 14.

When the openings of the through holes 13 and the via holes 8 are closed with the solder resist 16 as in the embodiment shown in FIG. 1, it is difficult to completely cover the openings with the liquid solder resist 16, so that the dry film type is used. It is preferable to use the solder resist 16. However, since the film thickness of the dry film type solder resist 16 is as thick as about 75 μm, it is difficult to cope with it when the circuit pattern of the circuit pattern layer 10 becomes fine. Therefore, in this case, it is preferable to use the liquid solder resist 16. As described above, when the liquid solder resist 16 is used, it is difficult to close the openings of the through holes 13 and the via holes 8 with the solder resist 16, so that as shown in FIG. The plating layer 9 on the inner circumference of the via hole 8 is protected.

That is, the liquid solder resist 16 is applied by screen printing or the like and then dried, as shown in FIG.
After coating the entire surfaces of both surfaces of the multilayer laminated plate 7 as shown in FIG. 2B, the portions of the solder resist 16 to be left are exposed by exposure to light such as ultraviolet rays and exposed as in the case of FIG. Harden the part. After that, it is treated with a developing solution such as a solvent or an alkaline solution to dissolve and remove the unexposed portion of the solder resist 16 as shown in FIG. 2C. The solder resist 16 is also removed from the openings of the through holes 13 and the via holes 8 to open the through holes 13 and the via holes 8.
The dam 18 is formed so as to surround the openings 3 and the opening of the via hole 8. Then, after that, the multi-layer laminate 7 is dipped in a solder bath and subjected to a solder leveler treatment, so that the circuit pattern layer 10 and the patch antenna 10 are not covered with the solder resist 16 as shown in FIG. 2D. Solder 17 is adhered to the surface of the element layer 11 with a thickness of about 10 μm, and the through hole 13 and the via hole 8 are filled with the solder 17 from the opening to the inside, so that the through hole 13 and the via hole 8 are soldered. It is to be closed with. The dam 18 of the solder resist 16 facilitates filling the through hole 13 and the via hole 8 with the solder 17. In the mobile communication antenna thus produced, since the through hole 13 and the via hole 8 are closed by the solder 17, the plating layer 1 on the inner circumference of the through hole 13 is soldered.
4 and the plating layer 9 on the inner periphery of the via hole 8 can be prevented from being exposed to the atmosphere. Therefore, in order to protect these plating layers 9 and 14, Ni plating or Au plating is possible. There is no need to do. Further, in this case, the plated layer 14 of the through hole 13 and the plated layer 9 of the via hole 8 are reinforced by the solder 17, and the electrical or mechanical reliability of the plated layers 9 and 14 can be improved. is there.

[0014]

As described above, according to the present invention, the patch antenna element layer is laminated on one surface and the circuit pattern layer is laminated on the other surface, and the ground pattern layer is provided between the patch antenna element layer and the circuit pattern layer. In an antenna for mobile communication, which is formed by forming an antenna base with laminated multi-layer laminates, providing through-holes and via holes in the multi-layer laminate, and providing a plating layer on the inner circumference of the through-holes and via-holes The openings of the through holes and the via holes are closed with the solder resist that adheres to the surface of the board,
Alternatively, since the through holes and the via holes are closed by the solder applied to the surface of the multilayer laminated plate, the plated layer of the through holes and the via holes can be exposed to the atmosphere by using the solder resist or solder that is processed on the surface of the multilayer laminated plate. It is possible to protect the plated layers of the through-holes and the via-holes from each other without exposing them to the atmosphere by blocking them from the outside.

[Brief description of drawings]

FIG. 1 shows each step of manufacturing of one embodiment of the present invention, and (a) to (d) are cross-sectional views, respectively.

FIG. 2 shows each step of manufacturing of another embodiment of the present invention, and (a) to (d) are sectional views, respectively.

FIG. 3 is a sectional view of a conventional example.

[Explanation of symbols]

 4 Earth Pattern Layer 7 Multilayer Laminated Plate 8 Bayer Hole 9 Plating Layer 10 Circuit Pattern Layer 11 Patch Antenna Element Layer 13 Through Hole 14 Through Hole Plating Layer 16 Solder Resist 17 Solder

[Procedure amendment]

[Submission date] March 2, 1992

[Procedure Amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0010

[Correction method] Change

[Correction content]

As shown in FIG. 1 (a), the antenna substrate is thus formed.
After the multi-layer laminated plate 7 as shown in FIG. 1 is created, the entire surface of both surfaces of the multi-layer laminated plate 7 is solder resist 16 as shown in FIG.
Cover with. A photosensitive photo solder resist is used as the solder resist 16, and either a dry film type solder resist or a liquid photo solder resist can be used as the photo solder resist. Dry film type as the solder resist those commercially available as such DuPont Japan Ltd. "Bakureru" and Morton Lee emissions Tha National ink Dainakemu Co. "comforter mask", Taiyo Ink Co. as a liquid photo solder resist Made "PS
A commercially available product such as "R-400" can be used. Dry film type solder resist 16
In this case, the surface of the multilayer laminate 7 can be covered with the solder resist 16 by laminating. In the case of the liquid solder resist 16, the surface of the multilayer laminated plate 7 can be coated with the solder resist 16 by coating the entire surface by screen printing or the like and drying.

Claims (2)

[Claims] 1. A patch antenna element layer on one surface,
An antenna substrate is made of a multilayer laminate in which a circuit pattern layer is laminated on the other surface and an earth pattern layer is laminated between the patch antenna element layer and the circuit pattern layer, and a through hole or a via hole is provided in the multilayer laminate plate. At the same time, in a mobile communication antenna formed by providing a plating layer on the inner periphery of a through hole or a via hole, it is necessary to cover the opening of the through hole or the via hole with a solder resist applied to the surface of the multilayer laminate. Characteristic mobile communication antenna. 2. The mobile communication antenna according to claim 1, wherein the through holes and the via holes are covered with solder adhered to the surface of the multilayer laminated plate.