JPH05167283A - Electronic equipment unit - Google Patents

Abstract

PURPOSE:To enable an electronic equipment unit to be enhanced in reliability by shutting off a power supply from it when coolant stops circulating by a method wherein a temperature sensor which outputs signals at a certain temperature is fixed to a cooling module, and the supply of power to the electronic equipment is shut off basing on the outputted signal of the sensor. CONSTITUTION:A temperature sensor 4 is fixed to a plate 1A which serves as a component part of a cooling module 1 and where a coolant is made to circulate, and a power supply control 5A shuts off a power PW supplied from a power supply device from a semiconductor element 2B mounted on a printed board 2A basing on the output signal of the temperature sensor 4. A thermostat or the like so set as to output a signal S at a certain temperature is used as the temperature sensor 4, whereby the semiconductor element 2B is prevented from exceeding an element breakdown temperature when a coolant 3 stops circulating. Even if coolant stops circulating through a cooling module due to troubles, a large number of semiconductor elements can be protected against damage.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic equipment unit formed by superposing electronic equipment to be cooled on a cooling module in which a refrigerant is circulated.

In recent years, semiconductor elements widely used in electronic devices have been able to achieve higher speeds and higher packaging density, and the amount of heat generated by semiconductor elements tends to increase. Therefore, an electronic device unit is formed by stacking an electronic device formed by mounting a large number of semiconductor elements on a printed circuit board on a cooling module in which a cooling medium is circulated. And is formed so as to come into contact with the surface of the semiconductor element of the printed circuit board.

Therefore, the semiconductor element is forcibly cooled by circulating the refrigerant through the cooling module.

[0004]

2. Description of the Related Art Conventionally, as shown in the conventional configuration diagram of FIG. 7, as shown in FIG. 7, a cooling module 1 in which a refrigerant 3 supplied from a refrigerant supply device 10 is circulated is printed. The electronic device 2 formed by mounting the semiconductor element 2B on the substrate 2A is closely attached, and the power supply PW for operating the semiconductor element 2B is supplied from the power supply control unit 11.

Further, in the cooling module 1, the cooling elements 1B are arranged on the plate 1A, each cooling element 1B is formed so as to correspond to the mounting position of the semiconductor element 2B, and the cooling medium supply device 10 is connected to the plate via the pipe 12A. Refrigerant returned from 1A
A tank 10A that stores 3 and a heat exchanger that cools the refrigerant 3 that flows from the tank 10A through a pipe 12B to a predetermined temperature.
Pump that supplies 10B and the refrigerant 3 discharged from the heat exchanger 10B through the pipe 12C to the plate 1A through the pipe 12D.
It is formed by 10C and.

Therefore, the coolant 3 cooled to a predetermined temperature by driving the pump 10C circulates in the plate 1A, and the semiconductor element 2B operated by the power PW supplied from the power controller 11 is cooled.

In such a structure, normally, water at room temperature (about 10 ° C to 40 ° C) is used as the coolant 3, and the semiconductor element 2B is used.
The junction temperature of 80 ℃ ~ 90 ℃ or less is considered to maintain high reliability of the semiconductor device.

[0008]

However, cooling the semiconductor element 2B by circulating the coolant 3 cooled to a predetermined temperature by driving the pump 10C in this way cools the semiconductor element 2B. If the temperature of the semiconductor element 2B is extremely reduced or the refrigerant 3 is no longer circulated, the junction temperature of the semiconductor element 2B will exceed the guaranteed reliability temperature (80 ° C to 90 ° C), and the semiconductor element destruction risk temperature of 120 ° C. become.

Therefore, the refrigerant 3 is no longer circulated,
Alternatively, there is a risk that a large number of semiconductor elements 2B mounted on the printed circuit board 2A may be broken or burned due to a decrease in the flow rate.

Therefore, it is an object of the present invention to form a semiconductor element mounted on an electronic device so as not to be broken or burnt out even if the circulation of the refrigerant is stopped.

[0011]

FIG. 1 is a diagram illustrating the principle of the first invention, FIG. 2 is a diagram illustrating the principle of the second invention, and FIG.
FIG. 4 is a principle explanatory diagram of the present third invention.

As shown in FIG. 1, a cooling module 1 in which a refrigerant 3 is circulated, an electronic device 2 to be superposed on the cooling module 1, and a power supply controller 5A for controlling a power supply PW supplied to the electronic device 2. And an electronic device unit in which the electronic device 2 is cooled by circulation of the refrigerant 3, which is fixed to the cooling module 1 and outputs an output signal S 1 when the cooling module 1 reaches a predetermined temperature. A temperature sensor 4 for sending to the power supply control unit 5A is provided so that the supply of the power PW is cut off by sending the output signal S 2.
Further, as shown in FIG. 2, a cooling module 1 in which the refrigerant 3 is circulated, an electronic device 2 superposed on the cooling module 1, and a power supply controller 5B for controlling a power supply PW supplied to the electronic device 2. A first temperature sensor 4A which is an electronic equipment unit which is provided with a cooling means for cooling the electronic equipment 2 by circulating the refrigerant 3 and which is fixed to the cooling module 1 and sends out temperature information D1 of the cooling module 1. And the temperature information
D1 is received, the temperature information D1 is compared with a predetermined set temperature,
A detection unit 6A that sends a disconnection command M to the power supply control unit 5B when the temperature according to the temperature information D1 reaches the set temperature is provided, and the supply of the power supply PW is cut off when the disconnection command M is sent. As shown in FIG. 3, or as shown in FIG.
Cooling module 1 in which 3 is circulated, and the cooling module
The electronic device 2 to be superposed on the electronic device 1 and a power supply control unit 5B for controlling the power PW supplied to the electronic device 2 are provided, and the refrigerant 3
Is an electronic device unit in which the electronic device 2 is cooled by the circulation of, and is fixed to the cooling module 1,
A first temperature sensor 4A for sending the temperature information D1 of the cooling module 1 and a second temperature sensor for sending the temperature information D2 of the refrigerant 3 which is fixed in the flow passage on the supply side of the refrigerant 3.
4B, the temperature information D of the cooling module 1 and the refrigerant 3
Upon receiving 1, D2, the relative temperature difference between the cooling module 1 and the refrigerant 3 is calculated, and when the relative temperature difference reaches a predetermined set temperature, the disconnection command M is sent to the power supply control unit 5B. A detector 6B is provided, and the supply of the power supply PW is cut off when the disconnection command M is sent.

The above-mentioned problems can be solved by such a configuration.

[0014]

In the first aspect of the present invention, when the cooling module 1 reaches a predetermined temperature, the temperature sensor 4 for outputting the output signal S is fixed, and the output signal S is received by the power supply controller 5A. The power control unit 5A is configured to disconnect the power PW supplied to the electronic device 2.

Therefore, when the circulation of the refrigerant 3 is stopped by setting the temperature sensor 4 to a predetermined temperature, the supply of the power source PW is cut off due to the rise of the temperature of the cooling module 1. In the case of the second invention, the first temperature sensor 4A for outputting the temperature information D1 to the cooling module 1
Is fixed, and the temperature information D1 is received by the detection unit 6A,
The detection unit 6A always uses the temperature information D1 for the cooling module 1
Is monitored, and when the temperature of the cooling module 1 exceeds a predetermined temperature, a disconnection command M is sent to the power supply control unit 5B to disconnect the power supply PW supplied to the electronic device 2.

Therefore, when the circulation of the refrigerant 3 is stopped by setting a predetermined temperature to be cut in the detection section 6A,
The rise of the temperature of the cooling module 1 causes the power supply PW to be cut off.

Further, in the case of the third aspect of the present invention, the first temperature sensor 4A for outputting the temperature information D1 is fixed to the cooling module 1 and the refrigerant supplied to the cooling module 1
The second temperature sensor 4B that outputs the temperature information D2 of 3 is the refrigerant.
It should be installed in the flow path on the supply side of 3 and its temperature information D
1, D2 is received by the detection unit 6B, and the cooling module 1 and the refrigerant are received.
When the temperature difference exceeds a predetermined value, the disconnection command M is sent to the power control unit 5B, and the electronic device 2
The power supply PW to be supplied to is cut off.

Therefore, when the circulation of the refrigerant 3 is stopped by setting a predetermined temperature difference to be cut in the detection unit 6B, the supply of the power supply PW is cut off due to the rise in the temperature of the cooling module 1. ..

In this case, the temperature of the refrigerant 3 supplied to the cooling module 1 is changed on the basis of the temperature of the refrigerant 3, and in the case of the above-mentioned first and second inventions,
It is necessary to set the highest refrigerant temperature as a reference to prevent the power PW from being accidentally disconnected during normal operation.Therefore, if the refrigerant temperature is actually low when the circulation is stopped, the timing for detecting an abnormality may be delayed. However, in the third case, since the abnormality is defined and detected based on the refrigerant temperature that was actually supplied when the circulation was stopped, the timing of detecting the abnormality becomes more accurate and the reliability is improved. Can be improved.

[0020]

The present invention will be described in detail below with reference to FIGS. 4, 5 and 6. FIG. 4 is an explanatory view of an embodiment according to the first aspect of the present invention, (a) is a configuration diagram, (b) is a temperature change graph of the plate and the semiconductor element when the power is turned on when the refrigerant is stopped,
FIG. 5 is an explanatory diagram of an embodiment according to the second aspect of the present invention, (a) is a configuration diagram, (b) is a temperature change graph between the plate and the semiconductor element when the power is turned on when the refrigerant is stopped, 6 is an explanatory view of an embodiment according to the third aspect of the present invention, (a) is a configuration diagram, and (b) is a temperature change graph between a plate and a semiconductor element. Throughout the drawings, the same reference numerals denote the same objects.

As shown in FIG. 4A, the cooling module
The temperature sensor 4 is fixed to the plate 1A on which the refrigerant 3 forming 1 is circulated, and the output signal S from the temperature sensor 4 causes the power supply control unit 5A to supply the power PW supplied from the power supply device as shown by the arrow A. Semiconductor element mounted on printed circuit board 2A
It is designed to be cut for 2B.

In such a structure, if the refrigerant 3 supplied by the pipe 12D is stopped due to an obstacle, the semiconductor element
As shown by the curve d in FIG. 4B, the temperature of 2B once rises up to 100 ° C., and as shown in the E part, the temperature of the 2B is further raised after the boiling of the refrigerant 3 remaining in the plate 1A. As shown in the curve c, the temperature of the plate 1A having a large heat capacity rises more slowly than the curve d.

Therefore, when the temperature sensor 4 reaches 100 ° C., the semiconductor element 2B has already exceeded the element destruction risk temperature. However, for example, the heat capacity of plate 1A is 1600
Below 0J / deg, the apparent heat capacity of semiconductor element 2B is 20deg
If the heat generation amount from the semiconductor element 2B is 20 W and the heat generation amount of the cooling module 1 is about 2 KW, if the temperature of the plate 1A is set to 50 ° C and the output signal S is output, the refrigerant An abnormality can be detected when the temperature of the semiconductor element 2B is about 100 ° C. within about 150 seconds after the supply of 3 is stopped.

Therefore, the temperature sensor 4 is 50 ° C.
It is possible to prevent the semiconductor element 2B from exceeding the element destruction risk temperature when the refrigerant 3 is stopped by using a thermostat or the like which is set so that the output signal S 2 is output.

Further, in the case of FIG. 5 (a), the first temperature sensor 4A for outputting the temperature information D1 is fixed to the plate 1A, the temperature information D1 is received by the detection unit 6A, and set in the detection unit 6A. Disconnection command from the detection unit 6A to the power supply control unit 5B according to the value
M 2 is sent out, and the power supply control unit 5B is configured to disconnect the power PW supplied from the power supply device as shown by an arrow A with respect to the semiconductor element 2B mounted on the printed board 2A.

With this structure, as shown in FIG. 5B, when the heat capacity of the plate 1A is 16000 J / deg and the total heat generation amount of the cooling module 1 is about 2 KW, the plate is
The temperature rise at 1A is as shown by curve c, but when the heat capacity of plate 1A becomes smaller than 16000J / deg, the temperature rise becomes
Curve c1 shown by the dotted line with a sharper rise than c
Becomes

Therefore, at the point P2 where the temperature of the plate 1A reaches 50 ° C. according to the temperature information D1, the semiconductor element 2B still has a sufficient margin against the element destruction risk temperature, so that when the refrigerant 3 is normally supplied. 6A in the temperature range of the refrigerant 3 of
Needs to be able to change the set temperature according to the heat capacity of the plate 1A.

Therefore, by setting the set temperature for sending the disconnection command M from the detector 6A according to the heat capacity of the plate 1A, in the case of the plate 1A whose temperature rises as shown by the curve c1, the temperature of the plate 1A is F higher than 50 ℃ reaching P3 point
The cutting command M can be output from the detection unit 6A at a temperature of ° C, and the set temperature for outputting the cutting command M can be corrected according to the heat capacity of the plate 1A.

Further, in the case of FIG. 6A, the first temperature sensor 4A for outputting the temperature information D1 is fixed to the plate 1A and the second temperature sensor D2 for outputting the temperature information D2 of the supplied refrigerant 3 is fixed. The temperature sensor 4B is installed in the pipe 12D, the temperature information D1 and D2 is received by the detection unit 6B, and when the temperature difference between the temperature information D1 and D2 reaches the value set in the detection unit 6B, the detection unit 6B outputs The disconnection command M is sent to the power control unit 5B, and the power control unit 5B
The power supply device supplies power PW supplied from the power supply device as shown by arrow A to the semiconductor element 2B mounted on the printed circuit board 2A.

With this structure, as shown in FIG. 6 (b), the temperature of the refrigerant 3 supplied to the plate 1A is normally 30 ° C. of G, but in reality, it is G2. 10 ℃ ~
Since it is supplied in the range of 40 ℃ of G1, the temperature of Refrigerant 3 is 10 ℃.
When, the temperature rise of plate 1A is curve c12,
When the temperature is 40 ° C, the curve becomes c, and when the temperature is 40 ° C, the curve becomes c11.
When the temperature reaches ℃, the time until the disconnection command M is sent and the power supply PW is disconnected is different when the temperature of the refrigerant 3 is 10 ° C, 30 ° C, and 40 ° C. If the temperature is 10 ° C., it takes a long time to detect an abnormality, so that the semiconductor element 2B exceeds the allowable junction temperature.

Therefore, when the difference between the temperature information D1 and D2, that is, the temperature difference between the supplied coolant 3 and the plate 1A reaches T ° C. at which it can be determined that the temperature is abnormal, a disconnection command M is sent. If you do so, what is cut at the above-mentioned P12 point
It can be performed at the point P14, and the semiconductor element 2B can be prevented from exceeding the element destruction risk temperature.

Since the temperature of the refrigerant 3 circulating in the plate 1A as described above actually rises in the range of 3 to 8 ° C. on the supply side and the return side, the disconnection command M from the detection section 6B is sent out. The temperature difference T can be set to 10 to 15 ° C. For example, if the temperature difference T is set to 10 ° C, the temperature of the refrigerant 3 will be 30 ° C.
In the case of, the disconnection command M is sent at P13 point and when the temperature of the refrigerant 3 is 40 ° C, the power supply PW can be surely cut off respectively, and the supplied refrigerant 3
Even if there is a variation in the temperature, the power supply PW can be surely disconnected without damaging or burning the semiconductor element 2B.

[0033]

As described above, according to the present invention,
By fixing the temperature sensor to the plate forming the cooling module, when the temperature of the plate reaches a predetermined temperature,
The power supplied to the electronic device can be cut off to prevent the semiconductor element mounted on the electronic device from being destroyed or burnt.

Therefore, even if the cooling medium circulated in the cooling module is stopped due to an obstacle or the like, it is possible to prevent the damage that destroys or burns out a large number of semiconductor elements, and the practical effect is great.

[Brief description of drawings]

FIG. 1 is an explanatory view of the principle of the first invention.

FIG. 2 is an explanatory view of the principle of the second invention.

FIG. 3 is an explanatory diagram of the principle of the third invention.

FIG. 4 is an explanatory diagram of an embodiment according to the first invention.

FIG. 5 is an explanatory diagram of an embodiment according to the second invention.

FIG. 6 is an explanatory diagram of an embodiment according to the third invention.

[Fig. 7] Conventional configuration diagram

[Explanation of symbols]

1 Cooling Module 2 Electronic Equipment 3 Refrigerant 4 Temperature Sensor 4A First Temperature Sensor 4B Second Temperature Sensor 5A, 5B Power Supply Control Section 6A, 6B Detection Section

Claims (3)

[Claims] 1. A cooling module in which a refrigerant (3) is circulated.
(1) and electronic equipment to be superposed on the cooling module (1)
(2) and a power supply control section (5A) for controlling the power (PW) supplied to the electronic device (2), and the electronic device (2) is cooled by the circulation of the refrigerant (3). An electronic device unit, which is fixed to the cooling module (1),
A temperature sensor (4) is provided for sending an output signal (S) to the power supply control unit (5A) when (1) reaches a predetermined temperature.
An electronic equipment unit, characterized in that the supply of the power source (PW) is cut off by sending (S). 2. A cooling module in which a refrigerant (3) is circulated.
(1) and electronic equipment to be superposed on the cooling module (1)
(2) and a power supply control section (5B) for controlling the power (PW) supplied to the electronic device (2), and the electronic device (2) is cooled by the circulation of the refrigerant (3). An electronic device unit, which is fixed to the cooling module (1),
First temperature sensor (4A) that sends out temperature information (D1) of (1)
When the temperature information (D1) is received, the temperature information (D1) is compared with a predetermined set temperature, and the cutting command (M) is issued when the temperature according to the temperature information (D1) reaches the set temperature. Power control unit (5B)
And a detection unit (6A) for sending the power supply to the power source (PW) is cut off by sending the disconnection command (M). 3. A cooling module in which a refrigerant (3) is circulated.
(1) and electronic equipment to be superposed on the cooling module (1)
(2) and a power supply control section (5B) that controls the power (PW) supplied to the electronic device (2), and the cooling of the electronic device (2) is performed by the circulation of the refrigerant (3). An electronic device unit called a first temperature sensor (4A) which is fixed to the cooling module (1) and sends out temperature information (D1) of the cooling module (1), and a supply of the refrigerant (3). A second temperature sensor (4B) which is fixed to the side flow passage and sends out temperature information (D2) of the refrigerant (3), and the temperature information () of the cooling module (1) and the refrigerant (3). D1, D2), the relative temperature difference between the cooling module (1) and the refrigerant (3) is calculated, and the disconnection command (M) is issued when the relative temperature difference reaches a predetermined set temperature. An electronic device unit comprising a power supply control unit (5B) and a detection unit (6B) for sending out, and the power supply (PW) being cut off by sending out the disconnection command (M).