JPH05161294A - Holding board for thin type coil - Google Patents

Abstract

PURPOSE:To facilitate an electric connection of each oil to a board while reducing a cost by forming the coil of a thin type coil of the type engaging a coil into a coil insertion unit of a coil frame. CONSTITUTION:A holding board for a thin type coil has a plurality of coil insertion units 10 of a coil shape on one side surfaces of metal pattern plates formed in wiring patterns 2, 12 states, and a coil frame 3 made of resin and molded integrally therewith, and comprises an insulating layer 20 formed on the frame 3 to cover the pattern plates exposed from the frame 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a holding substrate for a thin coil applicable to, for example, a surface-opposed motor.

[0002]

2. Description of the Related Art In order to reduce the thickness of a face-to-face type motor, a slice coil may be used as a drive coil. An example is the one described in Japanese Patent Laid-Open No. 61-73552, in which a conductive plate is wound in a tubular shape to form a winding body, and a plurality of winding bodies are arranged in an annular shape and these are molded with an insulating resin. After molding, the molded product is sliced so as to cross the winding body to obtain a drive coil.

Further, a slice coil is obtained by slicing a winding body formed by winding a conductive plate in a tubular shape in a direction crossing the slice, and the slice coil is provided with a coil frame having a plurality of coil insertion portions. There is also one in which a drive coil is formed by being fitted into each of the coil insertion portions of the body.

[0004]

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention
As described in Japanese Patent No. 2 publication, a thin coil formed by arranging a plurality of winding bodies in an annular shape, molding these with an insulating resin, and slicing this molded product is costly for integral molding. However, there is a problem in that the characteristics are deteriorated due to variations in the resistance value of each coil. Further, the thin coil in which a single slice coil is fitted in the coil insertion portion of the coil frame body has a problem that electrical connection between each coil and the substrate becomes complicated.

The present invention has been made in order to solve the above-mentioned problems of the prior art, and the cost can be reduced by using a thin coil of the type that is fitted in the coil insertion portion of the coil frame. While aiming, it is an object of the present invention to provide a holding substrate for a thin coil which facilitates electrical connection between each coil and the substrate, enables thinning, and has high coil insulation reliability.

[0006]

SUMMARY OF THE INVENTION According to the present invention, a resin-made coil frame body having a plurality of coil-shaped coil insertion portions is integrally formed on one surface of a metal pattern plate processed into a connection pattern. A holding device for a thin coil, which is characterized in that an insulating layer is formed on the coil frame body so as to cover the metal pattern plate exposed from the coil frame body.

[0007]

The coil is inserted and arranged in each coil insertion portion of the coil frame body made of resin. By connecting the winding start and end of each coil to the wiring pattern of the metal pattern plate integrally molded with the coil frame body by soldering, etc., and connecting the wiring pattern to the wiring pattern of the board, the coil can be connected to an external circuit. Can be connected. Since only one surface of the metal pattern plate is integrally molded with the coil frame body, the thickness dimension including the coil frame body can be reduced. The metal pattern plate exposed from the coil frame is insulated by the insulating layer formed on the coil frame.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a holding substrate for a thin coil according to the present invention will be described below with reference to the drawings.

In FIG. 1, a connection pattern 2 is formed on a square metal pattern plate 1 by using a method such as pressing or etching. In this case, if punching is performed so that the finally required complete connection pattern 2 remains, part of the connection pattern 2 is separated from the metal pattern plate 1, so the connection pattern 2 is not the final pattern. The pattern holding portions 4 and 5 are left in place between the main body portion of the metal pattern plate 1 and the connection pattern 2 to form an incomplete pattern, and the main body portion of the metal pattern plate 1 and the connection pattern 2 hold the pattern. The parts 4 and 5 are integrally connected. Further, there is a substantially ring-shaped connection pattern 12 on the inner peripheral side of the connection pattern 2, and the connection pattern 2 and the connection pattern 12 are formed by the terminal portion 8 radially extending from the connection pattern 12 and the pattern holding portion 7 following the terminal portion 8. Are connected together.

As shown in FIG. 2, an insulating resin is injected on one surface side of the wiring pattern 2 of the metal pattern plate 1 on which the wiring patterns 2 and 12 are formed in this manner to be integrated with the wiring pattern 2. The coil frame body 3 is formed. The coil frame 3 is a substantially ring-shaped connection pattern 1 of the metal pattern plate 1.
It also covers the second part. At the time of resin molding, in order to facilitate the placement of the coils in a later step, the number of coils is set at a constant interval in the circumferential direction of the coil frame body 3 at a regular trapezoidal shape corresponding to the planar shape of the coil. Formed in multiple places in total.

FIG. 3 shows the metal pattern plate 1 as described above.
FIG. 3 is a cross-sectional view of one surface of which is integrally molded with a coil frame body 3 made of resin. As shown in FIG. 3, the connection pattern 2 of the metal pattern plate and the substantially ring-shaped connection pattern 12 on the inner peripheral side are covered with the molding resin of the coil frame 3 on the upper surface and both side surfaces thereof, and The lower surface of 12 is exposed from the coil frame 3.

As shown in FIG. 1, a large number of protrusions 11 are provided on a portion of the metal pattern plate 1 which is integrally formed with the coil frame body 3, particularly the connection pattern 2. The protrusions 11 are formed on both sides of the connection pattern 2. Therefore, when the resin is injected to form the coil frame body 3 integrated with the wiring pattern 2 as described above, the molding resin surrounds the periphery of the protrusion 11, and the wiring pattern 2 of the metal pattern plate 1 and the coil frame body. The adhesion strength with 3 becomes stronger. However, if the surface of the connection pattern 2 is roughened, the adhesion strength between the connection pattern 2 and the coil frame 3 can be increased without providing the protrusion 11.

After the coil frame 3 is molded with resin as described above, the pattern holding portions 4, 5 of the metal pattern plate 1 are formed.
Are separated by a press punch, and the coil frame body 3 is separated from the metal pattern plate 1. The coil frame 3 is a metal pattern plate 1
Since the portions of the wiring patterns 2 and 12 are insert-molded, the coil frame 3 holds the wiring pattern 2 integrally. Thus, the holding substrate for the thin coil is completed.

Since the coil frame body 3 is integrally molded with resin only on one side of the metal pattern plate 1 in the holding substrate for the thin coil, as shown in FIG. The other surface of the connection patterns 2 and 12 that constitute the position portion of the pattern plate 1 is exposed. Coil frame 3
The bottom side is fixed to a substrate such as a motor, and the wiring pattern 2 is connected to the wiring pattern formed on this substrate. Therefore, the connection patterns 2, 1 are formed on the bottom surface of the coil frame body 3.
When 2 is exposed, there is a possibility that the connection patterns 2 and 12 and the wiring pattern on the substrate are short-circuited. Therefore, as shown in FIG. 3, an insulating layer 20 is formed on the bottom surface side of the coil frame body 3 so as to cover the surfaces of the connection patterns 2 and 12 exposed from the bottom surface side of the coil frame body 3 and to form a coil holding substrate. The board is insulated from the board. The insulating layer 20 may be formed by applying a resin coat by printing or by pasting an insulating sheet material. The insulating layer 20 is
It is sufficient even if the thickness is as thin as 0.1 mm or less.

The holding substrate of the thin coil is formed by bending the terminal portion 8 in the coil insertion portion 10 which is in contact with the beginning of winding of each coil and the terminal portion 9 in the coil insertion portion 10 which is in contact with the end of winding of each coil. Forming is easy to implement. A coil wound into a predetermined shape is inserted and arranged in each coil insertion portion 10. At this time, the insulating coatings at the beginning and end of the coil are stripped off, and then reflow soldering is performed. The beginning of winding is soldered to the terminal portion 8 and the end of winding of the coil is soldered to the terminal portion 9 to complete the connection of the coil. By the way, in the illustrated example, each coil is connected in a three-phase Y shape. By coupling each coil to the wiring patterns 2 and 12 by reflow soldering, each coil is substantially integrated with the coil frame body 3, but each coil is more firmly integrated with the coil frame body 3. Each coil may be bonded to the coil frame body 3 in order to realize the above.

The coil applied to the present invention is inserted into the coil insertion portion 10 of the coil frame body 3, and accordingly,
The manufacturing method is not particularly limited as long as it is wound in a flat space in the plane direction, but it is obtained by winding a copper foil around a winding core with an insulating layer interposed and then cutting it into slices. It is desirable to use a coil. FIG. 4 shows an example of the manufacturing process of such a coil. As shown in FIG. 4A, a copper foil 16 is used as a material and an insulating coating is applied to this, and then this one side edge is fixed to the core 15. And copper foil 1
6 is coated with an adhesive and then wound around the core 15 a predetermined number of times to form a tube. After the layers of the copper foil 16 are completely adhered to each other, the core 15 is removed, and then, as shown in FIG. A large number of coils 17 are obtained by slicing the copper foil 16 wound into a strip into a predetermined thickness.

The thin coil 17 is inserted and arranged in each coil insertion portion 10 of the holding substrate formed by insert-molding the connection patterns 2 and 12 on the coil frame 3, and the winding start and the winding end of each coil 17 are connected to the terminal portion 8. , 9 by reflow soldering to complete a thin coil. The thin coil thus obtained is attached to, for example, a stator substrate of a motor and is arranged to face a flat rotor magnet. The connection pattern 2 is connected to the wiring pattern of the stator substrate by soldering or the like, whereby each coil is connected to an external circuit. As described above, the coil frame 3
An insulating layer 20 insulates the coil holding substrate made of, for example, from the stator substrate. The rotor including the rotor magnet can be rotationally driven by switching the power supply to each coil according to the rotational position of the rotor magnet.

In order to reduce the thickness of the entire coil including the coil frame body 3 as much as possible to make the coil thin, and to increase the space factor of the coil as much as possible, the coil insertion formed in the coil frame body 3 is performed. The thickness of the bottom of the portion 10 is as thin as possible, for example, about 0.15 to 0.3 mm. The thickness of the wiring patterns 2 and 12 is 0.05.
Approximately 0.1 mm.

According to the embodiment described above, only one surface of the metal pattern plate 1 processed into the wire connection pattern has the coil frame body 3 made of resin and having a plurality of coil-shaped coil insertion portions 10. Since it is integrally formed, the thickness of the coil insertion portion 10 of the coil frame 3 can be reduced, and when the coil is applied to the motor, the motor can be thinned. Further, the wiring pattern 2 can be arranged at the same time when the coil frame body 3 is formed, and by simply connecting the ends of each coil to the wiring pattern 2 and connecting the wiring pattern 2 to the wiring pattern of the substrate, Connection is complete,
There is also an advantage that the coil connection becomes simple.

On the other hand, when only one surface of the metal pattern plate 1 is integrally molded with the coil frame body 3 as described above in order to reduce the thickness of the coil, the other surface of the metal pattern plate 1 is exposed from the coil frame body 3. However, since the insulating layer 20 is formed on the coil frame body 3 so as to cover the surface of the metal pattern plate 1 exposed from the coil frame body 3, insulation between the coil substrate and the motor board or the like to which the coil substrate is mounted is formed. The thickness of the coil substrate does not increase due to the formation of the insulating layer 20 because the insulating layer 20 is sufficiently thin.

The holding substrate for the thin coil according to the present invention can be applied not only as a driving coil for a motor but also as a holding substrate for coils of various other devices.

[0022]

According to the present invention, since only one surface of a metal pattern plate processed into a wire connection pattern is integrally molded with a coil frame body made of resin having a plurality of coil-shaped coil insertion portions. The thickness of the coil insertion portion of the coil frame can be reduced. The wiring pattern can be placed at the same time when the coil frame is formed, and the wiring of each coil is completed simply by connecting the ends of each coil to the wiring pattern and connecting the wiring pattern to the wiring pattern of the board. This has the effect of simplifying the coil connection.

Further, only one side of the metal pattern plate is formed integrally with the coil frame body so as to make the coil thinner, and the surface of the metal pattern plate exposed from the coil frame body is covered to form an insulating layer on the coil frame body. Since the coil board is formed, the insulation between the coil board and the board of the motor to which it is mounted can be ensured, and since an extremely thin insulating layer is sufficient, the thickness of the coil board is increased by forming the insulating layer. There is nothing to do.

[Brief description of drawings]

FIG. 1 is a plan view showing an example of a metal pattern plate applicable to the present invention.

FIG. 2 is a plan view showing a state in which a coil frame body is integrally molded with the above metal pattern plate.

FIG. 3 is a sectional view showing a state where a coil frame body is integrally formed on a metal pattern plate.

FIG. 4 is a perspective view showing an example of a manufacturing process of a coil applicable to the present invention.

[Explanation of symbols]

 1 Metal Pattern Plate 2 Wiring Pattern 3 Coil Frame 10 Coil Insertion Part 12 Wiring Pattern 20 Insulation Layer

Claims (1)

[Claims] 1. A holding substrate for a thin coil, comprising a resin-made coil frame body integrally formed on one surface of a metal pattern plate processed into a connection pattern shape, the coil frame body having a plurality of coil-shaped coil insertion portions. A holding substrate for a thin coil, characterized in that an insulating layer is formed on the coil frame so as to cover the metal pattern plate exposed from the coil frame.