JPH05160606A - Microwave module - Google Patents

Abstract

PURPOSE:To miniaturize a microwave module where a microwave circuit, for example, a resonator is formed with a micro strip line by overlapping a porcelain having a high dielectric constant in the forming position of the strip line from above or below. CONSTITUTION:A wiring pattern 2 and a resonator 3 consisting of the micro strip line are formed on a substrate 1 made of glass, epoxy resin, or the like. A transistor 4 and chip parts 5 are mounted on the substrate 1, and a porcelain material 8 which is provided with an overall pattern 8a on one face or one side face and has a high dielectric constant is mounted on the resonator 3. At this time, the pattern 8a is connected to a ground pattern 6 on the rear face through a part of the strip line forming the resonator 3 and a through hole 7. Thus, the dielectric constant of the porcelain material 8 is allowed to have an effective influence upon the dielectric constant on dimension calculation of the resonator 3 to raise the dielectric constant of the substrate, whose dielectric constant is 4 to 8, becoming about 10 times.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microwave module using a microstrip line.

[0002]

2. Description of the Related Art FIG. 3 shows an example of a conventional microwave module. As a module, a voltage-controlled oscillator (VC
It will be described in outline of O).

A wiring pattern 2 and a resonator 3 by a microstrip line are formed on a glass epoxy substrate 1 having a plate thickness of 1 mm. An oscillator is configured by mounting the transistor 4 and the chip component 5 on the substrate 1.
Further, in this substrate 1, the back surface of the microstrip line formation is the entire ground pattern 6, and one end of the microstrip line (resonator) 3 is connected to this ground pattern 6 by a through hole 7.

Note that the stripline resonator 3 has an inductance of 10 nH and an oscillation frequency of 1.9 G.
Under the conditions of Hz and substrate dielectric constant = 4.8, the approximate dimensions are length = 12.7 mm and width = 0.5 mm.

[0005]

However, the conventional structure has the following problems.

A large area is required to form the resonator 3 by the microstrip line on the substrate 1.

If a microstrip line is formed on the substrate 1 in an attempt to reduce the size of the substrate 1, a high dielectric constant porcelain material must be used as the material of the substrate 1, which significantly increases the material cost. I will end up.

[0008]

The present invention is characterized in that a high dielectric constant porcelain material is superposed at the same position as the formation position of the microstrip line.

[0009]

By the above, the permittivity in forming the strip line is substantially increased, the strip line can be miniaturized, and the cost increase factor can be minimized when miniaturizing.

[0010]

1 is a view showing a microwave module according to an embodiment of the present invention.

A voltage-controlled oscillator (V
This will be described in comparison with the resonator part of (CO).

A wiring pattern 2 and a resonator 3 formed by a microstrip line are formed on a glass epoxy substrate 1 having a plate thickness of 1 mm.
To form. The transistor 4 and the chip component 5 are mounted on the same substrate 1, and the resonator 3 by the microstrip line is mounted.
A high dielectric constant porcelain material 8 having a solid pattern 8a on one surface and one side surface is mounted on the top. At this time, the solid pattern 8a is a part of the microstrip line forming the resonator 3,
And the ground pattern 6 on the back surface via the through hole 7.

By being connected to the ground pattern 6 of the glass epoxy substrate 1, the permittivity of the high-permittivity porcelain material 8 effectively affects the permittivity in the dimension calculation of the microstrip line (resonator 2). The glass-epoxy substrate has a dielectric constant of, for example, about 4.8, but it can be easily obtained about 10 times or more by stacking the high-dielectric-constant ceramic materials 8. In calculating the dimensions of the microstrip line, the dielectric constant is a large factor that determines the size of the dimensions.

In order to obtain the oscillation frequency of 1.9 GHz, the inductance of the resonator is set to 10 nH in view of the circuit configuration. The dimensions of the resonator 3 formed by the microstrip line at this time are as follows: the dielectric constant of the high dielectric constant porcelain material 8 is 40, and the plate thickness is 0.63.
Assuming 5 mm, length = 4.0 mm, width = 0.16 mm
Therefore, the required area is about 1/4.

As described above, it becomes possible to manufacture a small voltage-controlled oscillator using a resonator having a small area microstrip line.

FIG. 2 shows another embodiment according to the present invention, in which the basic structure is the same as that described above, but a flexible substrate 9 is used as the insulating substrate of the base, and the mounting surface of the high dielectric constant porcelain material 8 is It is when changing.

The wiring pattern 2 is formed on the flexible substrate 9.
Then, the resonator 3 is formed by the microstrip line. At this time, the flexible substrate 9 does not have the ground pattern 6 on the back surface of the microstrip forming portion, and is connected to the surface ground through the through hole 7. The high-permittivity porcelain material 8 is not formed with any conductor, is made a little larger than the area of the microstrip line, and is attached directly below.

The resin case 10 for mounting the module substrate has a metal plating 11 on the entire inner surface so as to have a shielding effect. By attaching the flexible module substrate to the case 10, the ground of the flexible substrate 9 and the plated portion of the case 10 are brought into conduction, and the high dielectric constant porcelain material 8 is sandwiched between the resonator 3 and the ground by the microstrip line. Become.

Therefore, the value of the high-permittivity porcelain material 8 is effective as the permittivity for calculating the inductance. The dimensions of the resonator 3 by the microstrip line of this embodiment are the same as those of the previous embodiment, and conductors, electrodes, etc. are not processed on the high dielectric constant porcelain material 8.

[0020]

As described above, according to the present invention, the microstrip line formation can be made extremely small.
Also, the material cost for miniaturization is kept to a minimum.

Since the area of the microstrip line has conventionally been large due to the miniaturization of the microstrip line, it has been difficult to be adopted even if it has a thin feature, but the present invention can contribute to the thinness and miniaturization of the module.

[Brief description of drawings]

FIG. 1 is a top view (a) and a side view (b) showing an embodiment of the present invention.

FIG. 2 is a top view (a) and a side view (b) showing another embodiment of the present invention.

FIG. 3 is a top view (a) and a side view (b) showing a conventional example.

[Explanation of symbols]

 1 substrate 3 resonator by microstrip line 8 high dielectric constant porcelain material 9 flexible substrate 10 resin case

Claims (1)

[Claims] 1. A microwave module for forming a microwave circuit by a microstrip line, wherein a high dielectric constant porcelain material is superposed at the same position as the formation position of the microstrip line.