JPH0516033A - Parts feed device - Google Patents

Abstract

PURPOSE:To provide a parts feed device enabling a tape carrier package to be reused by recycling a tape. CONSTITUTION:There are provided the first reel 4 to feed a tape 1 having a tape carrier package, dies 2 and 3 to punch the tape carrier package from the tape 1, and the second reel 5 to take up the tape 1 free from package.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component supply device used for punching a semiconductor device mounted on a tape from the tape and mounting it on a circuit board.

[0002]

2. Description of the Related Art In recent years, a taping method has become the mainstream in a semiconductor device component supply mode. This is mainly for the purpose of maintaining the quality of the semiconductor device during the 24-hour operation of the equipment and the mounting process.

A conventional component supply device will be described below. FIG. 3 is a perspective view of a main part of a conventional component supply device. In FIG. 3, 11 is a tape carrier package (hereinafter T
A tape on which CP is mounted, 12 is a tape 11
Among the TCPs mounted on, the upper die for punching a package (hereinafter referred to as TAB package) mounted with tape automated bonding, 13 is a lower die for holding the TAB package, 14 is a cutter, 15
Is a first roll for supplying the tape 11, and 16 is a second roll for sending the punched tape 11 to the cutter 14.

The operation of the conventional component supply apparatus configured as described above will be described below. First, the tape 11 is applied to the first roll 15. Then tape 11
Is passed between the upper die 12 and the lower die 13 and further fed to the cutter 14 through the second roll 16. After aligning the TAB package on the tape 11 thus set in a regular position, it is punched by the upper mold 12 while being held by the lower mold 13. The punched TAB package moves to the next step together with the lower mold 13, and the tape 11
Is fed by the second roll 16 by the amount of TCP, and the unnecessary tape 11 with TCP is cut by the cutter 14.

[0005]

However, in the above-mentioned conventional structure, the tape in which the TAB package is punched out has a T-shape.
Since the CP remains, there is a problem that the blade of the cutter is damaged when cutting with the cutter.

The present invention solves the above-mentioned conventional problems, and an object of the present invention is to provide a parts supply device which enables recycling of a tape obtained by punching out a TAB package with a mold, and collection of TCP. And

[0007]

In order to achieve this object, a component supplying apparatus of the present invention comprises a first reel for supplying a tape having a TCP mounted thereon, a die for punching a tape carrier package from the tape, The tape carrier package has a structure including a second reel for winding the punched tape.

[0008]

[Operation] With this configuration, the tape can be recycled.
TCP can be collected.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of a main part of a component supply device according to an embodiment of the present invention. In FIG. 1, 1 is T
CP mounted tape, 2 is an upper die for punching the TAB package in the tape 1, 3 is a lower die for holding the TAB package when punching the TAB package, and 4 is the tape 1 supplied. The first reel 5 is a second reel for winding the tape 1.

FIG. 2 is a perspective view of a tape used in the component supplying apparatus of this embodiment. In FIG. 2, reference numeral 6 is a TAB package mounting a semiconductor element, and 7 is a TCP mounting a TAB package. TCP is mounted on the tape 1.

The operation of the component feeding apparatus of this embodiment having the above-mentioned structure will be described below with reference to FIGS. 1 and 2. First, the tape 1 is supplied from the first reel 4, and the feed pitch at that time is the pitch on which the TAB package 6 is mounted. Then, the TAB package 6 is punched by the upper mold 2 and the lower mold 3.
The punched TAB package 6 is sent to the next step together with the lower die 3. Then tape 1 is the second reel 5
Wound up by.

[0012]

As described above, the present invention provides a first reel for supplying a tape having a tape carrier package mounted thereon, a die for punching the tape carrier package from the tape, and a tape punched with the tape carrier package. This is a configuration including a second reel for winding, and it is possible to realize a component supply device capable of recycling the tape.

[Brief description of drawings]

FIG. 1 is a perspective view of a main part of a component supply device according to an embodiment of the present invention.

FIG. 2 is a perspective view of a tape used in the component supply device.

FIG. 3 is a perspective view of a main part of a conventional component supply device.

[Explanation of symbols]

 1 tape 2 upper mold (mold) 3 lower mold (mold) 4 first reel 5 second reel

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Satoshi Onakata 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (1)

Claim: What is claimed is: 1. A first reel for supplying a tape carrying a tape carrier package, a die for punching the tape carrier package from the tape, and a tape for punching the tape carrier package. A component supply device having a second reel.