JPH05160338A - Substrate structure of apparatus using single-phase diode bridge - Google Patents

Abstract

PURPOSE:To mount a single-phase diode bridge easily and securely and to prevent the deformation of terminal accompanied by connecting operation. CONSTITUTION:A single-phase diode bridge 3 is mounted between a substrate 4 and a body 1. The substrate 4 comprises a through hole 9 corresponding to a mounting hole 2 of the single-phase diode bridge 3 for screwing the body 1 acting as a heat sink, and a plurality of terminal holes 10 which respectively correspond to a plurality of terminals 5 of the single-phase diode bridge 3 and through which the terminals 5 pass respectively. The substrate 4 and the body 1 are integrated by inserting each terminal 5 into the terminal holes 10 without soldering the substrate 4 to the terminals 5 of the single-phase diode bridge 3. Thus, the single-phase diode bridge 3 is positioned and mounted in a proper condition.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate structure of a device using a single phase diode bridge using a Faston terminal.

[0002]

2. Description of the Related Art FIG.
FIG. 1 is a perspective view showing a substrate structure of an inverter control type high frequency heating device disclosed in Japanese Patent Publication (Kokai). The prevention capacitor and the resonance capacitor are placed on the printed circuit board 23 and housed in the box frame 24 made of an insulating material on the heat dissipation plate 22. The printed circuit board 23 on which the circuit components are placed is placed on the heat sink 22 other than the portion where the single-phase diode bridge 20 and the power transistor 21 are placed.

In the substrate structure of the inverter-controlled high-frequency heating device having the above-mentioned structure, that is, the device using the single-phase diode bridge, the area of the heat sink 22 may be larger than that of mounting all the circuit components on the printed board 23. As a result, an efficient heat dissipation effect can be obtained.

[0004]

In the conventional board structure as described above, the printed board 23 has a different shape because it needs to have a shape avoiding the single-phase diode bridge 20 and the power transistor 21 attached to the heat sink 22.
Substrate area is limited. Further, when the single-phase diode bridge 20 generally having a mounting hole for mounting a screw in the center is screwed to the heat dissipation plate 22, the single-phase diode bridge 20 is tightened with the screw.
Is easy to rotate and the mounting position is likely to be unstable. If the single-phase diode bridge 20 is erroneously attached due to rotation while maintaining a posture with a displacement of 90 degrees or 180 degrees,
It may lead to incorrect connection. Furthermore, when the terminals of the single-phase diode bridge 20 and the lead wires are connected by Faston terminals instead of being soldered, stress is applied to the terminals in connection with the connection operation or disconnection operation, which causes deformation or the like. It contains some challenges.

The present invention has been made in order to solve the above-mentioned conventional problems, and a first object thereof is to mount a single-phase diode bridge easily and surely and to prevent misconnection in advance. It is to obtain a substrate structure of a device using a diode bridge, and a second object is to obtain a substrate structure of a device using a single-phase diode bridge capable of preventing deformation of terminals due to connection operation and the like.

[0006]

A substrate structure of a device using a single-phase diode bridge according to the present invention has a through hole corresponding to a mounting hole of a single-phase diode bridge for screwing to a main body which also serves as a heat sink. , A single-phase diode bridge is mounted between the substrate and the main body, each of which corresponds to a plurality of terminals of the single-phase diode bridge and has a plurality of terminal holes that allow each terminal to pass through. The terminals are integrated by engaging the terminals with the terminal holes without soldering.

Further, the substrate structure of the device using another single-phase diode bridge according to the present invention is particularly made of an insulating vinyl tube attached to the Faston terminal for connecting each terminal hole to each terminal of the single-phase diode bridge. It is a rectangular hole with a size that allows passage.

[0008]

In the substrate structure of the device using the single-phase diode bridge according to the present invention, since it is not necessary to avoid the single-phase diode bridge, the substrate is not deformed, the substrate area can be sufficiently secured, and the single-phase diode bridge can be secured. Can be attached to the main body through the through hole of the substrate. Then, when the single-phase diode bridge is mounted, since each terminal passes through the terminal hole, the single-phase diode bridge does not rotate, and the mounting in a displaced state that causes a wrong connection is eliminated.

Further, in the substrate structure of the device using another single-phase diode bridge according to the present invention, each terminal hole is
The rectangular square hole that has a size that allows passage of an insulating vinyl tube attached to the Faston terminal that is connected to each terminal of the single-phase diode bridge, so the terminal can be connected or disconnected by connecting or disconnecting the Faston terminal. It becomes difficult to bend.

[0010]

1 is a perspective view of a substrate structure of a device using a single-phase diode bridge showing an embodiment of the present invention, FIG. 2 is a front view from the direction of arrow A in FIG. 1, and FIG. It is a top view of a part.

The substrate structure of the device using the single-phase diode bridge shown in the figure is a main body 1 having a heat dissipation function which also functions as a heat dissipation plate.
The core is composed of a single-phase diode bridge 3 having one mounting hole 2 for screwing in the center and a substrate 4 on which circuit components are mounted. Single phase diode bridge 3
Has four terminals 5 protruding on the opposite side of the mounting surface,
A lead wire 7 is connected to each of them by a Faston terminal 6, and an insulating vinyl tube 8 is attached to a connection portion of the Faston terminal 6. The board 4 is provided with a through hole 9 at a position corresponding to the mounting hole 2 of the single-phase diode bridge 3, and at a position corresponding to each terminal 5, a plurality of terminal holes 10 through which each terminal 5 can be passed. Has been. The terminal hole 10 corresponds to the direction of the terminal 5 (in the single-phase diode bridge, the positive electrode terminal is generally oriented differently from the other terminals as shown in the drawing), and is fastened to the faston terminal 6 connected to each terminal 5. Insulated vinyl tube 8 worn
It is formed in a rectangular hole with a size that allows passage through.

In the substrate structure of the device using the single-phase diode bridge having the above-mentioned structure, the single-phase diode bridge 3 has its mounting surface aligned with the main body 1, and the through hole 9 is provided between the main body 1 and the substrate 4. The mounting holes 2 are made to correspond to, the terminals 5 are sandwiched in a state of passing through the terminal holes 10 and fixed to the main body 1 through screws from the through holes 9 of the substrate 4. That is, the board 4 and the terminal 5 of the single-phase diode bridge 3 are integrated without soldering. Each of the terminals 5 passing through each terminal hole 10 has a lead wire 7
Is connected by a faston terminal 6 so as to be detachable and attachable by inserting and removing, and an insulating vinyl tube 8 is attached to the connecting portion with the original side inserted into the terminal hole 10.

When fixing the single-phase diode bridge 3 with screws, a rotating force acts on the single-phase diode bridge 3 as the screws are tightened, but each terminal 5 of the single-phase diode bridge 3 is inserted into the terminal hole 10. Since they are engaged with each other and rotation and displacement are restricted, the single-phase diode bridge 3 is not rotationally displaced. Therefore, it will not be attached in a posture displaced by 90 degrees or 180 degrees which may cause misconnection. Since the substrate 4 does not need to avoid the single-phase diode bridge 3, it does not become irregular and the substrate area can be sufficiently secured. Single-phase diode bridge 3
Can be attached to the main body 1 using the through holes 9 of the substrate 4, and the single-phase diode bridge 3 can be easily replaced because it is not fixed by soldering. Particularly in the embodiment, since each terminal hole 10 is a rectangular square hole having a size that allows passage of the insulating vinyl tube 8 attached to the faston terminal 6 connected to each terminal 5 of the single-phase diode bridge 3, Even if the faston terminal 6 is connected to or disconnected from the terminal 5, the terminal 5 is less likely to bend and deformation of the terminal 5 is prevented.

The single-phase diode bridge is an example of a power semiconductor module using a faston terminal, and the same action and effect can be obtained when another power semiconductor module having the same structure as the single-phase diode bridge is used.

[0015]

As is apparent from the above description of the embodiments, according to the present invention, when the single-phase diode bridge is fixed by the screw, the single-phase diode bridge is not rotationally displaced, and the single-phase diode bridge is erroneous. In addition to being prevented from being installed in a displaced posture that would cause connection, the board does not have to avoid the single-phase diode bridge, so it does not become irregular and the board area can be secured sufficiently. Will also be easier.

According to another invention, in particular, each terminal hole is
The rectangular square hole that has a size that allows passage of an insulating vinyl tube attached to the Faston terminal that is connected to each terminal of the single-phase diode bridge, so the terminal can be connected or disconnected by connecting or disconnecting the Faston terminal. It becomes difficult to bend and it is possible to prevent deformation of the terminal.

[Brief description of drawings]

FIG. 1 is a perspective view of a substrate structure of an apparatus using a single-phase diode bridge showing an embodiment of the present invention.

FIG. 2 is a view on arrow A in FIG.

FIG. 3 is a plan view of only a substrate showing an embodiment of the present invention.

FIG. 4 is a perspective view showing a configuration of a conventional example.

[Explanation of symbols]

 1 Main body 2 Mounting hole 3 Single phase diode bridge 4 Board 5 Terminal 6 Faston terminal 8 Insulated vinyl tube 9 Through hole 10 Terminal hole

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[Procedure amendment]

[Submission date] August 27, 1992

[Procedure Amendment 1]

[Document name to be amended] Statement

[Correction target item name] Explanation of code

[Correction method] Change

[Correction content]

[Explanation of symbols] 1 Main body 2 Mounting hole 3 Single phase diode bridge 4 Board 5 Terminal 6 Faston terminal 7 Lead wire 8 Insulated vinyl tube 9 Through hole 10 Terminal hole

[Procedure Amendment 2]

[Document name to be corrected] Drawing

[Name of item to be corrected] Figure 1

[Correction method] Change

[Correction content]

[Figure 1]

Claims (2)

[Claims] 1. A through hole corresponding to a mounting hole of a single-phase diode bridge for fixing a screw to a main body having a heat dissipation function of the device, and a plurality of terminals of the single-phase diode bridge, respectively corresponding to each terminal. A single-phase diode bridge is mounted between the substrate having a plurality of terminal holes that can pass through and the main body, and the substrate and the terminals of the single-phase diode bridge are integrated without soldering, Substrate structure of device using single-phase diode bridge. 2. The rectangular hole having a size large enough to allow passage of an insulating vinyl tube attached to a faston terminal connected to each terminal of a single-phase diode bridge. Substrate structure of device using single-phase diode bridge.