JPH05154799A - Machining method of ceramic composite body for electronic circuit - Google Patents

Abstract

PURPOSE:To provide the machining method generating no crack on a ceramic composite body, capable of extending the life of a drill, and capable of reducing the cost of a ceramic board for an electronic circuit as a whole when mechanical machining such as drilling by a drill is applied to the ceramic composite body. CONSTITUTION:When a hole or a notch section 12 required for an electronic circuit board is to be formed on a ceramic composite body 10 filled with resin in the open pores of a porous sintered body made of ceramic, a small drill 21 having the diameter smaller than the size of the hole or the notch section 12 is used, and many holes are continuously bored at the pitch 1/20-1/2 of the diameter of the small drill 21 at the portion slightly apart from the hole or the notch section 12 of the ceramic composite body 10. The hole or the notch section 12 is finish-machined by a large drill 22 having the diameter corresponding to the size of the hole or the notch section 12.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for processing a ceramic composite body, and more particularly to a method for forming a hole or a notch for positioning or mounting on a ceramic composite body used as a circuit board.

[0002]

2. Description of the Related Art Ceramics are used in many fields as industrial materials because they have excellent chemical stability and heat resistance, but attention is also paid to their low coefficient of thermal expansion. It has also been used as a material for a circuit board on which a semiconductor element is mounted. However, although it is such an excellent ceramic, it is not easy to mechanically process it.Therefore, it is necessary to form a molded body in a size in consideration of firing shrinkage. Therefore, an electronic circuit excellent in dimensional accuracy is required. It was difficult to form a substrate for use.

Therefore, the applicant of the present invention has disclosed, for example, Japanese Patent Publication No. 3-50429 as a ceramic for an electronic circuit board which can fully exhibit the advantages of ceramics and can be easily machined.
A ceramic composite has already been proposed in Japanese Patent Publication No. This ceramic composite is obtained by filling the open pores of a ceramic porous sintered body with resin, and is capable of being machined, especially drilled. Therefore, with such a ceramic composite, it becomes possible to easily manufacture an electronic circuit board having excellent dimensional accuracy.

However, even with such a ceramic composite having excellent machinability, when it is made small and thin according to the miniaturization of electronic parts such as semiconductor elements to be mounted, it is drilled with a hole. It was found that cracking may occur around the hole when processing such as opening. In order to avoid such cracks, the feed speed of the drill may be slowed down, but this increases the cost of the electronic circuit board made of this ceramic composite, and loses its value as an industrial product. is there. Not only that, but slowing down the feed speed of the drill will increase the wear of the drill to be used, so the drill must be replaced frequently, and from this point also the cost of the completed electronic circuit board increases. It will end up.

Therefore, the inventors of the present invention have examined how to efficiently perform the following mechanical processing such as drilling of a ceramic composite body without causing cracks in the ceramic composite body. As a result of the repeated accumulation, the present invention has been completed.

[0006]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and the problem to be solved is to further improve the efficiency of machining a ceramic composite for electronic circuits by a drill. And prevention of cracking in the ceramic composite.

It is an object of the present invention to prevent the ceramic composite from cracking and to prolong the life of the drill when machining the ceramic composite by drilling or the like. An object of the present invention is to provide a processing method capable of reducing the cost of the ceramic substrate for electronic circuits as a whole.

[0008]

Means and Actions for Solving the Problems In order to solve the above problems, the means adopted by the present invention will be described with reference to the reference numerals used in the examples. In forming the holes 11 and the notches 12 required when the ceramic composite body 10 in which the open pores are filled with the resin is used as an electronic circuit substrate, the hole 1
1 or a small drill 21 having a diameter smaller than the size of the cutout 12 is used, and at a portion slightly deviated from the hole 11 or the cutout 12 of the ceramic composite 10, the diameter of the small drill 21 is
After performing a large number of continuous drilling operations at a pitch of 20 to 1/2, finish the hole 11 or the notch 12 with a large drill 22 having a diameter corresponding to the size of the hole 11 or the notch 12. The method for processing a ceramic composite for an electronic circuit, characterized in that That is, in the machining method of the present invention, as shown by the solid line in FIG. 1, first, a large number of small holes 21 are formed along the pre-processing line 13 of the hole 11 or the notch 12 by the small drill 21. The diameter of
It is necessary to form the outline of the hole 11 or the notch 12 by continuously forming at a pitch of / 20 to 1/2. The pre-machining line 13 in this case is determined so that the end face machined by the small drill 21 is slightly removed from the final machining line 14 finished by the large drill 22. Even if there is a crack on the body 10 side, the final processing line 1
4 is determined in order to prevent cracks from remaining in the product when the finishing work is performed by the large drill 22 along the line 4. In other words, even if a crack is caused by the small drill 21, this crack is short because the small drill 21 is small, and the pre-processing line 13 should be determined at a position where this short crack can be absorbed. It's good.

When a large number of holes are drilled along the pre-machined line 13 by the small drill 21, the pitch is 1
It is necessary to be / 20 to 1/2. The reason is,
If the pitch of each hole by the small drill 21 is smaller than 1/20, the efficiency of the drilling work by the small drill 21 is reduced, while if it is larger than 1/2, the unnecessary portion of the ceramic composite 10 is reliably removed. This is because it cannot be performed, and in particular, this pitch is optimally about 1/7 of the diameter of the small drill 21. The diameter of the small drill 21 is 2.0 mm to 0.
The size is about 5 mm, and the size of about 1.4 ± 0.2 mm is the most efficient at present.

After the outline of the hole 11 or the notch 12 is formed by the small drill 21 as described above, FIG.
As shown in FIG. 2, the hole 11 or the notch 12 is finished by using a large drill 22 having a diameter corresponding to these sizes. This machining with the large drill 22 can be performed quickly because most of the relevant portion on the ceramic composite 10 side is removed by the small drill 21, and cracks are generated in the ceramic composite 10 around the hole 11 or the notch 12. You can do it without doing it.

Further, as described above, the processing by the small drill 21 and the large drill 22 is performed by each ceramic composite body 1.
The relative movement with respect to 0 can be performed within a short time, which can prolong the life of the small drill 21 and the large drill 22. Therefore, it is not necessary to replace the small drill 21 and the large drill 22 so frequently, and this also reduces the cost of the completed ceramic substrate for an electronic circuit.

The above small drill 21 and large drill 2
The processing by 2 is performed simultaneously with the drilling processing for the through holes necessary for the ceramic substrate for electronic circuits.

[0013]

EXAMPLE First, one or several ceramic composites 10 having a thickness of 1.2 mm used as a so-called memory module substrate are stacked and fixed on a surface plate, and holes 11 necessary for these ceramic composites 10 are stacked. Alternatively, the rough shape of the notch 12 was machined using a small drill 21 having a diameter of 1.4 mm. In this case, the pitch of each hole by the small drill 21 is
0.12 mm, and its outline was formed by removing 0.07 mm from the final processing line 14 of the hole 11 or the notch 12 to be finally finished. That is, each small drill 21
The diameter of the pre-processing line 13 whose center is continuously located is 1.6
It was mm.

In this case, the number of times of drilling by the small drill 21 for the notch 12 in FIG. 1 was 23 times. The total processing time was 45 seconds.

As described above, after the cut 12 or the hole 11 is roughly machined by the small drill 21, the diameter is 3.1.
Finishing was performed using a large drill 22 of 4 mm.
When the end face of each ceramic composite 10 after this processing was observed, no cracks were found.

When the above processing is performed, the small drill 21 is used 10,000 times and the large drill 22 is used.
Had to be replaced after being used 3000 times, but the number of times each was used increased by about 30%.

[0017]

As described above, according to the present invention,
As illustrated in the above embodiment, “a ceramic composite body 10 in which resin is filled in open pores of a porous sintered body made of ceramic is provided with a hole 11 and a hole 11 required when using this as a substrate for an electronic circuit. When forming the cutout portion 12, a small drill 21 having a diameter smaller than the size of the hole 11 or the cutout portion 12 is used, and a portion of the small drill 21 is slightly separated from the hole 11 or the cutout portion 12 of the ceramic composite 10. After performing a large number of continuous drilling processes at a pitch of 1/20 to 1/2 of the diameter, a large drill 22 having a diameter corresponding to the size of the hole 11 or the notch 12 is used to cut the hole 11 or the notch 12. The feature is that the finishing process is performed, which allows the ceramic composite to be cracked without causing cracks when machining such as drilling the ceramic composite. It is possible to prolong the life of the drill and to provide a processing method that can reduce the cost of the ceramic substrate for electronic circuits as a whole.

[Brief description of drawings]

FIG. 1 is an enlarged partial plan view showing a portion corresponding to a cutout portion of a ceramic composite body.

FIG. 2 is a side view showing a state in which a ceramic composite is subjected to drilling with a small drill and a large drill.

FIG. 3 is a plan view of a ceramic substrate for an electronic circuit to be formed by a ceramic composite.

[Explanation of symbols]

 10 Ceramic Composite 11 Hole 12 Notch 13 Pre-processing Line 14 Final Processing Line 21 Small Drill 22 Large Drill

Claims (1)

[Claims] 1. When forming holes and notches necessary for using this as a substrate for an electronic circuit in a ceramic composite obtained by filling resin into open pores of a porous sintered body made of ceramic, Using a small drill having a diameter smaller than the size of the hole or notch, 1/20 to 1 of the diameter of the small drill at a portion slightly deviated from the hole or notch of the ceramic composite.
After performing a large number of continuous drilling operations at a pitch of / 2, the hole or notch is finished by a large drill having a diameter corresponding to the size of the hole or notch. And a method for processing a ceramic composite for an electronic circuit.