JPH05154584A - Method and device for positioning metal die in printed board press - Google Patents

Abstract

PURPOSE:To position a lower die without enlarging the lower die by projecting the lower die for a printed board press vertically on a lower die fixing surface and fixing the lower die when the projected center agrees with the fixing center of the lower die. CONSTITUTION:The lower die 18 of the printed board press 10 is moved along the lower die fixing surface of a lower die fixing part and maintaining such a state that a projection center O2 obtained by projecting the lower die 18 vertically on the lower die fixing surface is superimposed on a prescribed straight line L1 passing the fixing center O1 in the lower die fixing surface. When the lower die 18 is moved to a position where its projecting center 02 agrees with the fixing center O1 of the lower die fixing surface, the lower die 18 is stopped and the lower die 18 is fixed there.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for positioning a mold in a printed circuit board press.

[0002]

2. Description of the Related Art A conventional mold positioning device for a printed circuit board press is shown in FIGS. In the mold positioning device for the printed circuit board press shown in this figure, guide pins 54 and 56 are fixed to a bolster 52 of the printed circuit board press 50, and the surface part 60 and the V groove part 62 of the lower mold 58 are pressed against these. As a result, the lower die 58 is positioned at a predetermined position of the bolster 52. In the bolster 52, a stepped groove 64 having a wider inner side is formed on the mounting surface of the lower die 58, and two clampers 66 are slidably fitted in the groove. The lower die 58 is fixed to the bolster 52 via a clamper 66. Thereby, the lower die 58 can be positioned and fixed at a predetermined position of the printed board press 50.

[0003]

However, the guide pins 54 and 56 of the bolster 52 are included in the mold positioning device for the conventional printed circuit board press as described above.
However, since it serves as a reference for positioning, the distance between the center axis O of the lower die 58 in the vertical direction in FIG. 9 and the center axis passing through the center of both guide pins 54 (56) and the distance between the guide pins 54 and 56 are determined. It is necessary to unify the related dimensions of the corresponding surface portion 60 and the V groove portion 62 to constant values. Generally, the above-mentioned relational dimensions are based on the assumed maximum size of the mold, so that even if the mold has a small processing size, the external size becomes large and the mold becomes expensive. There is a point. In addition, the existing lower mold not set to the above-described related dimensions needs to be replaced with the dedicated bolster 52 to perform the positioning work, which causes a problem that the positioning work of the mold is troublesome. .. The present invention aims to solve such problems.

[0004]

The present invention solves the above problems by utilizing a guide portion such as a groove for mounting a clamper for positioning. That is, the method of positioning the mold in the printed circuit board press according to the present invention is performed by vertically projecting the lower mold of the printed circuit board press along the lower mold mounting surface of the lower mold mounting portion and the lower mold on the lower mold mounting surface. The obtained projection center (O2) is moved so as to maintain a state in which it overlaps with a predetermined straight line (L1) passing through the attachment center (O1) in the lower die attachment surface, and the lower die becomes the projection center (O2) of this. The lower die is stopped when it moves to a position where the attachment center (O1) of the lower die attachment surface coincides, and the lower die is fixed at this position. Further, the apparatus for carrying out the above method includes a bolster (12) in which a lower mold (18) of a printed circuit board press is arranged, and a guide part (14) formed on the bolster (12) so that the lower mold (18) is movably fitted. ) And clampers (16) respectively arranged on both ends of the), and the clamper (16) can fix the lower mold (18) to the bolster (12). Guide (1) of bolster (12)
4) has its axis formed along a straight line (L1) passing through the mounting center (O1) of the lower die mounting surface of the bolster (12), and the bolster (12) is provided with a clamper (16). A clamper moving device (20, 22) capable of moving along the guide portion (14) is provided, and at least one of the clamper moving devices (20, 22) has a clamper moving device (20). A moving distance detecting section (20c) for detecting the moving amount of the clamper (16) from the reference position is provided. The guide portion includes a first groove portion (14a) that guides the moving direction of the clamper (16), and a second groove portion (14c) that guides the clamper (16) so as not to come out of the bolster (12). Both grooves (14a ・ 1
4c) and a connecting groove portion (14b) for connecting the connecting groove portion (4b) and the connecting groove portion (14b), and the clamper (16) has a groove fitting portion corresponding to the connecting double groove (14). It should have been done. Further, the clamper (16) and the lower mold (18) are preferably formed with a contact portion (16d) and a contact portion (18a) which are fitted and contact each other at the time of positioning. The reference numerals in parentheses indicate the corresponding members of the embodiment.

[0005]

The one of the two clamper moving devices is moved along the center line of the mounting portion of the bolster via the one clamper moving device. The movement amount of one clamper from the reference position is detected by the movement amount detection device of the one clamper moving device, which positions the one clamper at a predetermined position corresponding to the length or width dimension of the lower die. be able to. The lower die is positioned in contact with one clamper, and in this state, the other clamper is pressed against the lower die via the other clamper moving device. The lower mold is fixed to the bolster by both clampers. As a result, the mold can be positioned and fixed.

[0006]

1 and 2 show a first embodiment of the present invention. The bolster 12 of the printed circuit board press 10 has a cross section "H".
A character-shaped connecting double groove 14 is formed. Connection double groove 1
4 is formed along a straight line L1 whose two central axes pass through the mounting center O1 of the bolster 12, respectively.
The first groove portion 14a on the left end side in FIG. 2 of the connecting double groove 14 is open toward the lower die mounting surface. The second groove portion 14c on the right side in FIG. 2 of the connecting double groove 14 communicates with the first groove portion 14a by the communication groove portion 14b. Two clampers 16
Has a groove fitting portion (bottom side) connected to the double groove 14
The cross-sectional shape corresponds to the cross-sectional shape of. That is, the clamper 16 has a first fitting portion 16a, which is fitted to the first groove portion 14a of the connecting double groove 14, and a communication groove portion 14b.
The second fitting portion 16b and the second groove portion 14 which are fitted to each other.
A third fitting portion 16c, which is fitted to c, is formed. As a result, the clamper 16 is slidably fitted in the connecting double groove 14 of the bolster 12. As for the fitting of the bolster 12 and the clamper 16, the clearance between the first groove portion 14a and the first fitting portion 16a is the smallest, the clearance between the communicating groove portion 14b and the second fitting portion 16b, and The size of the gap between the second groove portion 14c and the third fitting portion 16c is set to be larger than this. That is, the first groove portion 14a and the first fitting portion 16a are fitted so that the moving direction of the clamper 16 is guided, and the communication groove portion 14b, the second fitting portion 16b, and the second groove portion 14c.
The third fitting portion 16c and the third fitting portion 16c prevent the first fitting portion 16a of the clamper 16 from coming out of the bolster 12 to the left in FIG. As a result, the connection 2
The heavy groove 14 constitutes a guide portion for guiding the movement of the clamper 16. The bolster 12 has a lower die 1 on its mounting surface.
8 are arranged. As shown in FIG. 3, the lower mold 18 is formed with contact portions 18a having a triangular prism shape at the left and right ends, respectively. A line L2 connecting the V-shaped vertices of the two contact portions 18a passes through the center O2 of the lower mold 18. The contact parts 18 of the lower mold 18 are provided on both clampers 16.
Corresponding convex contact portions 16d are formed on the side facing a, as shown in FIG. Bolster 1
2, clamper moving devices 20 and 22 are arranged on both left and right ends in FIG. The clamper moving device 20 on the right side of the drawing is composed of a female screw member 20a, a screw shaft member 20b screwed into the female screw member 20a, and a scale mechanism 20c capable of displaying a moving distance thereof in the axial direction.
Further, the clamper moving device 22 on the left side of the drawing is a female screw member 2
2a and a screw shaft member 22b screwed into the screw shaft member 22a. The female screw members 20a and 22a are attached to the side surface portions of the bolster 12, respectively. The clamper moving devices 20 and 22 can move the clampers 16 adjacent to each other along the connecting double groove 14 of the bolster 12. Further, the clamper 16 can clamp the lower molds 18, respectively. Thereby, as will be described later, the lower mold 18
Can be positioned and fixed so that the center O2 thereof coincides with the mounting center O1 of the bolster 12.

Next, the operation of this embodiment will be described. In advance, the clamper moving devices 20 and 22 are attached to the bolster 12.
Bolster 12 with two clampers 16 before mounting on
Fit in opposite directions. That is, the clamper 1 is inserted into the first groove portion 14a of the connecting double groove 14 of the bolster 12.
6, the first fitting portion 16a, the second fitting portion 16b in the communicating groove portion 14b, and the third fitting portion 1 in the second groove portion 14c.
6c are fitted together. Next, the clamper moving device 2
Attach 0 and 22 to bolster 12, respectively. The scale of the scale mechanism 20c is adjusted to 0 when the screw shaft member 22b of the clamper moving device 20 is at the arbitrarily determined reference position. By moving the screw shaft member 20b while reading the scale, the clamper 16 on the right side in FIG. 1 is positioned at the mounting position corresponding to the longitudinal dimension of the lower mold 18 used. As a result, the lower mold 18 can be positioned at the illustrated position where the center O2 of the lower mold 18 coincides with the mounting center O1 of the bolster 12. The screw shaft member 22b of the clamper moving device 22 on the left side and the left clamper 16 are sufficiently moved to the left side in advance so that the lower mold 18 can be placed between the clampers 16. The lower die 18 is placed between both clampers 16 and the screw shaft member 22b is screwed in to advance the left clamper 16 to the right, and the contact portion 16d thereof is pressed against the left contact portion 18a of the lower die 18. Contact.
The lower mold 18 is clamped by both clampers 16. This allows the lower mold 18 to be fixed at a predetermined position on the bolster 12. Therefore, even in the case of the existing lower die 18 of another positioning method, the present invention can be used by additionally forming the contact portion 18a having a shape corresponding to the contact portion 16d of the clamper 16 of the present invention. The bolster 12 can be positioned and fixed.

In the description of the above-mentioned embodiment, the contact portion 16d of the clamper 16 is a triangular columnar projection, and the corresponding contact portion 18a of the lower die 18 is formed in a triangular prism recessed shape. However, other shapes can be used as long as they can be positioned with respect to each other. For example, the shape shown in FIGS. That is, what is shown in FIG. 5 is one in which the contact portion 16d having a rectangular prism shape is formed on the clamper 16 and the corresponding contact portion 18a having a hollow shape is formed on the lower die 18, and the one shown in FIG. The lower die 18 has a rectangular prism-shaped contact portion 18a, and the clamper 16 has a contact portion 16d on the right side surface in the figure. The contact portion 16d shown in FIG. 16d, and a contact portion 18a having a hollow shape corresponding to the lower die 18
8 is the same as that shown in FIG. 4, but is different from that shown in FIG.
And the corresponding contact portions 18a having a convex shape are formed. Further, in the above description of the embodiment, the connecting double groove 14 is formed in the guide portion of the bolster 12 that guides the movement of the clamper 16, but the connecting double groove 14 is not formed. A guide member capable of guiding the movement of the clamper 16 may be fixedly arranged on the bolster 12, and the movement of the clamper 16 may be guided by the guide member. Further, in the above description of the embodiment, the clamper moving devices 20 and 22 are of screw drive type, and the scale is read by using the scale mechanism 20c as the moving distance detecting mechanism. However, the clamper moving device can be configured by appropriately combining, for example, a linear driving type such as a magnet scale and a moving distance detecting mechanism using an electric signal using a linear potentiometer. Further, both the clamper moving devices 20 and 22 may have a moving distance detecting mechanism.

[0009]

As described above, according to the present invention, since the lower die can be positioned and fixed to the bolster without making it large, the die can be made small and inexpensive. be able to. Even in the case of an existing lower die of another positioning method, by forming a contact portion of a shape corresponding to the contact portion of the clamper by additional machining on this, without replacing the bolster, It can be positioned and fixed.

[Brief description of drawings]

FIG. 1 is a diagram in which a positioning device of the present invention is applied to a printed circuit board press.

FIG. 2 is a side view of FIG.

FIG. 3 is a diagram showing a lower mold.

FIG. 4 is a diagram showing a contact portion of a clamper and a lower die.

FIG. 5 is a view showing a second shape contact portion of the clamper and the lower die.

FIG. 6 is a view showing a third-shaped contact portion of the clamper and the lower die.

FIG. 7 is a view showing a clamper and a fourth-shaped contact portion of the lower mold.

FIG. 8 is a diagram showing a fifth-shaped contact portion of the clamper and the lower die.

FIG. 9 is a view showing a conventional positioning device for a printed circuit board press.

10 is a side view of the positioning device shown in FIG. 9. FIG.

[Explanation of symbols]

 10 Printed Circuit Board Press 12 Bolster 14 Connection Double Groove (Guide) 16 Clamper 16d Contact Part 18 Lower Mold 18a Contact Part 20 Clamper Moving Device 20c Scale Mechanism (Movement Distance Detection Unit) 22 Clamper Moving Device

Claims (4)

[Claims] 1. A projection center (O2) obtained by vertically projecting a lower die of a printed circuit board press along a lower die mounting surface of a lower die mounting portion and a lower die is a lower die. Predetermined straight line (L1) passing through the mounting center (O1) in the mounting surface
When the lower die moves to a position where the projection center (O2) of the lower die and the mounting center (O1) of the lower die mounting surface coincide with each other, the lower die is stopped. A method for positioning a die in a printed circuit board press in which the lower die is fixed to the bottom. 2. A bolster (12) in which a lower mold (18) of a printed circuit board press is arranged, and a lower part (1) movably fitted to a guide part (14) formed on the bolster (12).
Clampers (16) arranged at both ends of 8)
And a clamper (16) capable of fixing the lower mold (18) to the bolster (12) in a mold positioning apparatus for a printed circuit board press, including a guide portion (14) of the bolster (12). ) Is formed along the straight line (L1) passing through the mounting center (O1) of the lower die mounting surface of the bolster (12).
A clamper (16) is provided in each of the guide portions (14) in 2).
Clamper moving device (2
0, 22) are provided, and the clamper moving device (2
0,22) at least one clamper moving device (2
0) is a device for positioning a mold in a printed circuit board press, which is provided with a moving distance detecting section (20c) for detecting a moving amount of the clamper (16) from a reference position. 3. The guide portion includes a first groove portion (14a) for guiding the moving direction of the clamper (16) and a second groove portion (14c) for guiding the clamper (16) so as not to come out from the bolster (12). ) And a connecting groove portion (14b) for connecting both grooves (14a, 14c) to each other, the clamper (16) has a groove fitting portion having a connecting double groove. The mold positioning device for a printed circuit board press according to claim 2, which has a shape corresponding to (14). 4. The clamper (16) and the lower mold (18) have a contact portion (16) which is fitted and brought into contact with each other during positioning.
The die positioning device for a printed circuit board press according to claim 2 or 3, wherein d) and the contact portion (18a) are respectively formed.