JPH05152779A - Circuit board - Google Patents

Circuit board

Info

Publication number
JPH05152779A
JPH05152779A JP13464092A JP13464092A JPH05152779A JP H05152779 A JPH05152779 A JP H05152779A JP 13464092 A JP13464092 A JP 13464092A JP 13464092 A JP13464092 A JP 13464092A JP H05152779 A JPH05152779 A JP H05152779A
Authority
JP
Japan
Prior art keywords
circuit board
dew condensation
resistor
showing
refrigerator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13464092A
Other languages
Japanese (ja)
Inventor
Toru Hasegawa
徹 長谷川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP13464092A priority Critical patent/JPH05152779A/en
Publication of JPH05152779A publication Critical patent/JPH05152779A/en
Pending legal-status Critical Current

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  • Parts Printed On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PURPOSE:To provide a dew condensation preventing circuit board which does not require any dew condensation preventing measure and is excellent in maintainability. CONSTITUTION:This circuit board 1 is constituted in such a way that an electric resistor 10 which generates heat when it is energized is printed on the board 1 so that the board 1 can be maintained at a temperature higher than the dew- point temperature of the board 1 by the heat generated from the resistor 10. Therefore, the circuit board does not require any dew condensation preventing measure and becomes excellent in maintainability.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は,結露の発生を防止する
ための回路基板に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board for preventing dew condensation.

【0002】[0002]

【従来の技術】図4は冷蔵庫の全体構成の概略を示す斜
視図,図7は従来の回路基板の一例3を冷蔵庫に配置し
た状態を示す部分断面図,図8は従来の回路基板の他の
例3′を冷蔵庫に配置した状態を示す部分断面図であ
る。一般に,図4に示す様に,冷蔵庫本体2の扉部分2
0には,表示部21や操作部22などが設けられてい
る。この表示部21や操作部22などを制御する電子部
品5を接続した回路基板3は,図7に示すように,扉部
分20に設けられた配置部23に配置される。しかし,
この配置部23は,発泡ウレタン断熱層24に形成され
るため,当該部のウレタン断熱層24の厚みが薄くな
り,回路基板3に結露が発生しやすくなる。そこで,従
来は,回路基板3に結露が発生するのを防止するため
に,配置部23の近傍の発泡ウレタン断熱層24にヒー
タ4を埋設し,このヒータ4の放熱によって,回路基板
3が結露するのを防止するようになされていた。また,
図8に示すように回路基板3′の表面に酸化金属抵抗9
(以下抵抗と略す)を挿入して,この抵抗9の放熱によ
って,上記と同様の結露防止を行うことも知られてい
た。
2. Description of the Related Art FIG. 4 is a perspective view showing an outline of the entire structure of a refrigerator, FIG. 7 is a partial sectional view showing a state in which an example 3 of a conventional circuit board is arranged in a refrigerator, and FIG. FIG. 3 is a partial cross-sectional view showing a state in which the example 3 ′ of FIG. Generally, as shown in FIG. 4, the door portion 2 of the refrigerator body 2 is
At 0, a display unit 21 and an operation unit 22 are provided. The circuit board 3 to which the electronic components 5 for controlling the display unit 21 and the operation unit 22 are connected is arranged in the arrangement unit 23 provided in the door portion 20 as shown in FIG. 7. However,
Since the arrangement portion 23 is formed on the urethane foam heat insulating layer 24, the thickness of the urethane heat insulating layer 24 at that portion is thin, and dew condensation easily occurs on the circuit board 3. Therefore, conventionally, in order to prevent the occurrence of dew condensation on the circuit board 3, the heater 4 is embedded in the urethane foam heat insulating layer 24 in the vicinity of the arrangement portion 23, and the heat radiation of the heater 4 causes dew condensation on the circuit board 3. It was designed to prevent you from doing so. Also,
As shown in FIG. 8, a metal oxide resistor 9 is formed on the surface of the circuit board 3 '.
It has also been known to insert a resistor (hereinafter abbreviated as “resistor”) to prevent dew condensation similar to the above by radiating heat from the resistor 9.

【0003】[0003]

【発明が解決しようとする課題】しかし,上記図7に示
した従来の回路基板3の場合,ヒータ4を発泡ウレタン
断熱層24中に埋設するといった結露防止対策を施さな
ければならず,その埋設作業が煩わしいといった不都合
を生じる。また,このようにヒータ4を発泡ウレタン断
熱層24中に埋設しているので,ヒータ4に不良や故障
を生じた場合,扉部分20全体を廃棄および交換しなけ
ればならないといった不都合を生じることとなる。一
方,図8に示した回路基板3′の場合,回路基板3′の
単独交換が可能なため,上記不都合は解消される。しか
し,回路基板3′の表面に取り付けられる抵抗9は酸化
金属抵抗のような大型の抵抗であるため,電子部品の設
置スペースを狭める場合があり,又温度上昇が必要な回
路基板裏面(パターン面)近傍への良好な熱伝導がなさ
れない場合があった。本発明は,係る事情に鑑みてなさ
れたもので,他に結露防止対策を施す必要がなく,メン
テナンス性にも優れた結露防止用の回路基板を提供する
ことを目的としている。
However, in the case of the conventional circuit board 3 shown in FIG. 7 described above, it is necessary to take a dew condensation prevention measure such as burying the heater 4 in the urethane foam heat insulating layer 24, and the burying thereof. This causes inconvenience such as troublesome work. In addition, since the heater 4 is embedded in the urethane foam heat insulating layer 24 in this manner, if the heater 4 is defective or malfunctions, the entire door portion 20 must be discarded and replaced. Become. On the other hand, in the case of the circuit board 3'shown in FIG. 8, since the circuit board 3'can be independently replaced, the above inconvenience is eliminated. However, since the resistor 9 attached to the surface of the circuit board 3'is a large resistance such as a metal oxide resistor, the installation space for electronic parts may be narrowed, and the rear surface of the circuit board (pattern surface) that requires a temperature rise. ) In some cases, good heat conduction to the vicinity was not achieved. The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a circuit board for preventing dew condensation that does not require any other dew condensation prevention measures and is excellent in maintainability.

【0004】[0004]

【課題を解決するための手段】上記課題を解決するため
に本発明の回路基板は,環境温度の比較的低い場所に取
り付けられる回路基板において,上記回路基板上に,通
電によって発熱する電気抵抗体が印刷され,該電気抵抗
体の発熱によって回路基板が露点温度以上に保たれるよ
うになされたものである。更には,環境温度の比較的低
い場所に取り付けられる回路基板において,上記回路基
板のパターン面に装着され,通電によって発熱するチッ
プ抵抗体を適宜配設してなる回路基板である。
In order to solve the above-mentioned problems, a circuit board of the present invention is a circuit board mounted in a place where the ambient temperature is relatively low. Is printed, and the circuit board is kept above the dew point temperature by the heat generation of the electric resistor. Furthermore, the circuit board is mounted on the pattern surface of the circuit board in a circuit board mounted in a place where the ambient temperature is relatively low, and a chip resistor that generates heat when energized is appropriately arranged.

【0005】[0005]

【作用】本発明の回路基板によると,回路基板上に印刷
した電気抵抗体に通電することによって,回路基板を結
露温度以上に保ち,結露の発生を防止することができ
る。更に,回路基板のパターン面に装着され,通電によ
って発熱するチップ抵抗体が適宜配設されることによっ
ても,回路基板を露点温度以上に保ち,結露の発生を防
止することができる。その結果,他に結露防止対策を施
す必要がなく,メンテナンス性にも優れた結露防止用の
回路基板を得ることができる。
According to the circuit board of the present invention, by energizing the electric resistor printed on the circuit board, the circuit board can be kept at the dew condensation temperature or higher and the dew condensation can be prevented. Further, the circuit board can be kept above the dew point temperature and the occurrence of dew condensation can be prevented also by mounting the chip resistors that are mounted on the pattern surface of the circuit board and generate heat when energized. As a result, it is possible to obtain a circuit board for preventing dew condensation that is excellent in maintainability without the need to take other dew condensation prevention measures.

【0006】[0006]

【実施例】以下,添付図面を参照して本発明を具体化し
た実施例につき説明し,本発明の理解に供する。尚,以
下の実施例は,本発明を具体化した一例であって,本発
明の技術的範囲を限定する性格のものではない。図1は
本発明の第1の実施例に係る回路基板1の全体構成の概
略を示す斜視図,図2は回路基板1を冷蔵庫に配置した
状態を示す分解斜視図,図3は回路基板1を冷蔵庫に配
設した状態を示す部分断面図,図4は冷蔵庫の全体構成
の概略を示す斜視図(従来例と共用),図5は本発明の
第2の実施例に係る回路基板1′の全体構成の概略を示
す斜視図,図6は回路基板1′を冷蔵庫に配置した状態
を示す部分断面図である。図1に示す如く,本発明の第
1の実施例に係る回路基板1は,該回路基板1上に,通
電によって発熱する電気抵抗体10が印刷されたもので
ある。回路基板1には,各種電子部品5を接続するため
の配線回路(図示省略)が銅箔パターンによって形成さ
れている。電気抵抗体10は,配線回路と反対側の基板
面(部分挿入面)に印刷することができる。この電気抵
抗体10を印刷する位置としては,この配線回路に接続
される各種電子部品5の邪魔にならない位置であれば,
基板上のどこでも印刷することができる。ただし,この
電気抵抗体10の発熱によって結露の発生を防止するの
で,基板上に局部的に印刷するのではなく,全体的に印
刷することが好ましい。このようになる回路基板1は,
図2ないし図4に示すように,例えば,冷蔵庫本体2の
扉部分20へ取り付けられる。すなわち,電子部品5を
接続した回路基板1と,表示部21および操作部22と
を接続し,これら回路基板1,表示部21および操作部
22を,扉部分20に設けられた配置部23に組み込む
ことによって施工される。この場合,配置部23は,発
泡ウレタン断熱層24が,他の部分に比べて薄くなされ
ているので回路基板1に結露の発生を招き易くなるが,
電気抵抗体10に通電することによって,回路基板1を
露点温度以上に保つことができ,結露の発生が防止され
ることとなる。
Embodiments of the present invention will be described below with reference to the accompanying drawings for the understanding of the present invention. The following embodiments are examples of embodying the present invention and are not of the nature to limit the technical scope of the present invention. 1 is a perspective view showing an outline of an overall configuration of a circuit board 1 according to a first embodiment of the present invention, FIG. 2 is an exploded perspective view showing a state in which the circuit board 1 is arranged in a refrigerator, and FIG. 3 is a circuit board 1 4 is a partial cross-sectional view showing a state in which the refrigerator is arranged, FIG. 4 is a perspective view showing the outline of the entire structure of the refrigerator (shared with the conventional example), and FIG. 5 is a circuit board 1 ′ according to a second embodiment of the present invention. FIG. 6 is a perspective view showing the outline of the overall structure of FIG. 6, and FIG. As shown in FIG. 1, the circuit board 1 according to the first embodiment of the present invention is one in which an electric resistor 10 which generates heat when energized is printed on the circuit board 1. A wiring circuit (not shown) for connecting various electronic components 5 is formed on the circuit board 1 by a copper foil pattern. The electric resistor 10 can be printed on the substrate surface (partial insertion surface) opposite to the wiring circuit. The position where the electric resistor 10 is printed is a position where it does not interfere with various electronic components 5 connected to this wiring circuit,
It can be printed anywhere on the substrate. However, in order to prevent the generation of dew condensation due to the heat generation of the electric resistor 10, it is preferable to print the entire surface of the substrate instead of printing it locally. The circuit board 1 thus configured is
As shown in FIGS. 2 to 4, it is attached to the door portion 20 of the refrigerator main body 2, for example. That is, the circuit board 1 to which the electronic component 5 is connected, the display section 21 and the operation section 22 are connected, and the circuit board 1, the display section 21 and the operation section 22 are arranged in the arrangement section 23 provided in the door section 20. It is constructed by incorporating. In this case, since the urethane foam insulation layer 24 is thinner than the other portions in the arrangement portion 23, dew condensation is likely to occur on the circuit board 1, but
By energizing the electric resistor 10, the circuit board 1 can be maintained at the dew point temperature or higher, and the occurrence of dew condensation can be prevented.

【0007】次に,本発明の第2の実施例に係る回路基
板1′について説明する。図5に示す如く,回路基板
1′は,該回路基板1′のパターン面の所要箇所にチッ
プ抵抗体8の装着を行ない,発熱体部を形成する。図
中,チップ抵抗体8を繋ぐパターンは表示しているが,
他の回路のパターンは省略している。この回路基板1′
は上記第1の実施例と同様にして,例えば図4の冷蔵庫
本体2の扉部分20に設けられた配置部23に組み込ま
れる。そして,この場合も配置部23はチップ抵抗体8
へ通電することによって,回路基板1′を露点温度以上
に保つことができ,結露の発生が防止されることとな
る。以上のように,本発明の第1,第2の実施例によれ
ば,いずれも配置部23に特別な結露防止構造を設ける
ことなく,施工作業が容易に行え,低コスト化を図るこ
とが可能となる。また,万が一回路基板1の電気抵抗体
10又は回路基板1′のチップ抵抗体8が通電不良や故
障などを起こして回路基板1又は1′に結露を生じるよ
うな場合であっても,図7に示した従来例の如く扉部分
20全体を部品交換することなく,回路基板1又は1′
の交換で容易に修理を行うことができる。また,いずれ
の回路基板1,1′も図8に示した従来例のような大型
の抵抗9を回路基板の表面に設けないため,電子部品の
設置スペースを狭めるおそれがなく,又回路基板1,
1′の裏面を直接昇温して結露防止を効率よく行うこと
ができる。更に,回路基板1の電気抵抗体10又は回路
基板1′のチップ抵抗体8の電源回路(不図示)に温度
制御素子(例えばPTC)を介挿させて,保温の必要の
ないときは電源を断つことにより消費電力を少くし,省
エネルギ対策を図ることもできる。なお,本実施例で
は,扉部分20の表示部21および操作部22と接続さ
れる回路基板1,1′を示しているが,特にこの扉部分
20に限定されるものではなく,結露を生じ易い位置に
配置される各種の回路基板にも用いることができる。ま
た,冷蔵庫以外のものとしても,空調装置や,寒冷地仕
様の電気機器などの各種回路基板にも用いることができ
る。
Next, a circuit board 1'according to a second embodiment of the present invention will be described. As shown in FIG. 5, in the circuit board 1 ′, the chip resistor 8 is mounted at a required position on the pattern surface of the circuit board 1 ′ to form a heating element portion. Although the pattern connecting the chip resistors 8 is shown in the figure,
The other circuit patterns are omitted. This circuit board 1 '
In the same manner as in the first embodiment, for example, is incorporated in the disposing portion 23 provided in the door portion 20 of the refrigerator main body 2 in FIG. In this case, too, the placement unit 23 causes the chip resistor 8
By energizing the circuit board 1 ', the circuit board 1'can be maintained at a dew point temperature or higher, and dew condensation can be prevented. As described above, according to the first and second embodiments of the present invention, the construction work can be easily performed and the cost can be reduced without providing the arrangement portion 23 with the special dew condensation preventing structure. It will be possible. Even if the electric resistor 10 of the circuit board 1 or the chip resistor 8 of the circuit board 1'causes defective conduction or failure to cause dew condensation on the circuit board 1 or 1 ', FIG. The circuit board 1 or 1'without replacing the entire door portion 20 as in the conventional example shown in FIG.
Can be easily repaired by replacing. Further, since neither circuit board 1 nor 1'is provided with the large-sized resistor 9 on the surface of the circuit board as in the conventional example shown in FIG. 8, there is no fear of narrowing the installation space for electronic parts, and the circuit board 1 ,
Condensation can be efficiently prevented by directly raising the temperature on the back surface of 1 '. Further, a temperature control element (for example, PTC) is inserted in a power supply circuit (not shown) of the electric resistor 10 of the circuit board 1 or the chip resistor 8 of the circuit board 1 ', and the power supply is turned on when there is no need of heat retention. By cutting off, power consumption can be reduced and energy saving measures can be taken. In this embodiment, the circuit boards 1 and 1'connected to the display portion 21 and the operation portion 22 of the door portion 20 are shown, but the present invention is not limited to this door portion 20, and dew condensation may occur. It can also be used for various circuit boards arranged at easy positions. In addition to the refrigerator, it can be used for various circuit boards such as air conditioners and electric appliances for cold regions.

【0008】[0008]

【発明の効果】以上述べたように,本発明の回路基板
は,結露の発生を防止することができるので,該回路基
板の配置部に,ヒータなどの結露防止対策を施す必要が
なくなり,低コストで簡単に結露防止を行うことができ
る。また,この結露防止機能に故障などを生じた場合で
あっても,回路基板を交換するだけで容易に修理するこ
とができ,メンテナンス性にも優れたものとなる。ま
た,従来例のような大型の抵抗を回路基板の表面に設け
ないため,電子部品の設置スペースを狭めるおそれがな
く,又回路基板の裏面を直接昇温して結露防止を効率よ
く行うことができる。更に,回路基板の電気抵抗体又は
チップ抵抗体の電源回路に温度制御素子を介挿させて,
保温の必要のないときは電源を断つことにより消費電力
を少なくし,省エネルギ対策を図ることもできる。
As described above, since the circuit board of the present invention can prevent the occurrence of dew condensation, it is not necessary to take a dew condensation prevention measure such as a heater in the portion where the circuit board is arranged, and it is possible to reduce Condensation can be easily prevented at a cost. In addition, even if the dew condensation prevention function fails, it can be easily repaired by simply replacing the circuit board, which is excellent in maintainability. In addition, since a large resistance unlike the conventional example is not provided on the front surface of the circuit board, there is no fear of narrowing the installation space for electronic components, and the back surface of the circuit board can be directly heated to effectively prevent dew condensation. it can. Further, by inserting a temperature control element into the power circuit of the electric resistor or the chip resistor of the circuit board,
When it is not necessary to keep warm, the power consumption can be reduced by turning off the power supply and energy saving measures can be taken.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明の第1の実施例に係る回路基板1の全
体構成の概略を示す斜視図。
FIG. 1 is a perspective view showing an outline of an overall configuration of a circuit board 1 according to a first embodiment of the present invention.

【図2】 回路基板1を冷蔵庫に配置した状態を示す分
解斜視図。
FIG. 2 is an exploded perspective view showing a state in which the circuit board 1 is placed in a refrigerator.

【図3】 回路基板1を冷蔵庫に配設した状態を示す部
分断面図。
FIG. 3 is a partial cross-sectional view showing a state in which the circuit board 1 is arranged in a refrigerator.

【図4】 冷蔵庫の全体構成の概略を示す斜視図(従来
例と共用)。
FIG. 4 is a perspective view showing the outline of the entire configuration of the refrigerator (shared with the conventional example).

【図5】 本発明の第2の実施例に係る回路基板1′の
全体構成の概略を示す斜視図。
FIG. 5 is a perspective view showing the outline of the overall configuration of a circuit board 1 ′ according to a second embodiment of the present invention.

【図6】 回路基板1′を冷蔵庫に配置した状態を示す
部分断面図。
FIG. 6 is a partial cross-sectional view showing a state in which the circuit board 1 ′ is arranged in a refrigerator.

【図7】 従来の回路基板の一例3を冷蔵庫に配置した
状態を示す部分断面図。
FIG. 7 is a partial cross-sectional view showing a state where a third example of a conventional circuit board is arranged in a refrigerator.

【図8】 従来の回路基板の他の例3′を冷蔵庫に配置
した状態を示す部分断面図。
FIG. 8 is a partial cross-sectional view showing a state in which another example 3 ′ of the conventional circuit board is arranged in a refrigerator.

【符号の説明】[Explanation of symbols]

1…回路基板 10…電気抵抗体 1 ... Circuit board 10 ... Electric resistor

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 環境温度の比較的低い場所に取り付けら
れる回路基板において, 上記回路基板上に,通電によって発熱する電気抵抗体が
印刷され,該電気抵抗体の発熱によって回路基板が露点
温度以上に保たれるようになされたことを特徴とする回
路基板。
1. A circuit board mounted in a place where the ambient temperature is relatively low, wherein an electric resistor that generates heat upon being energized is printed on the circuit board, and the heat generated by the electric resistor causes the circuit board to have a dew point temperature or higher. A circuit board characterized by being kept.
【請求項2】 環境温度の比較的低い場所に取り付けら
れる回路基板において, 上記回路基板のパターン面に装着され,通電によって発
熱するチップ抵抗体を適宜配設してなることを特徴とす
る回路基板。
2. A circuit board to be mounted in a place having a relatively low ambient temperature, wherein a chip resistor which is mounted on the pattern surface of the circuit board and generates heat when energized is appropriately arranged. ..
JP13464092A 1991-09-04 1992-05-27 Circuit board Pending JPH05152779A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13464092A JPH05152779A (en) 1991-09-04 1992-05-27 Circuit board

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP3-224236 1991-09-04
JP22423691 1991-09-04
JP13464092A JPH05152779A (en) 1991-09-04 1992-05-27 Circuit board

Publications (1)

Publication Number Publication Date
JPH05152779A true JPH05152779A (en) 1993-06-18

Family

ID=26468690

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13464092A Pending JPH05152779A (en) 1991-09-04 1992-05-27 Circuit board

Country Status (1)

Country Link
JP (1) JPH05152779A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6292365B1 (en) 1998-09-18 2001-09-18 Hitachi, Ltd. Electronic apparatus
US8106333B2 (en) 2007-05-16 2012-01-31 Abb Oy Heated frequency converter assembly
JP2015045429A (en) * 2013-08-27 2015-03-12 株式会社ガスター Hot water supply device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6292365B1 (en) 1998-09-18 2001-09-18 Hitachi, Ltd. Electronic apparatus
US8106333B2 (en) 2007-05-16 2012-01-31 Abb Oy Heated frequency converter assembly
JP2015045429A (en) * 2013-08-27 2015-03-12 株式会社ガスター Hot water supply device

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