JPH05152724A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPH05152724A JPH05152724A JP3709191A JP3709191A JPH05152724A JP H05152724 A JPH05152724 A JP H05152724A JP 3709191 A JP3709191 A JP 3709191A JP 3709191 A JP3709191 A JP 3709191A JP H05152724 A JPH05152724 A JP H05152724A
- Authority
- JP
- Japan
- Prior art keywords
- disconnection
- inspection
- printed wiring
- wiring board
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は電気機器、電子機器、通
信機器、計算機器等に用いられるプリント配線板の製造
方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board used in electric equipment, electronic equipment, communication equipment, computing equipment and the like.
【0002】[0002]
【従来の技術】従来のプリント配線板においては、内層
材又は外層材の回路パターンの断線修正は、金鍍金付コ
バール線、銅銀合金線等の溶接リボンで、断線修正部を
接続し、接続合否は断線修正部にピンセット、ケガキ針
等で外力を加えることによって、断線修正部の動き、抵
抗程度を拡大鏡による目視等で観察しているが、信頼性
に欠け、作業能率も悪いものであっり。2. Description of the Related Art In a conventional printed wiring board, a circuit pattern of an inner layer material or an outer layer material is repaired by connecting the disconnection repairing portion with a welding ribbon such as a Kovar wire with gold plating or a copper-silver alloy wire. In order to determine whether or not the wire is good or bad, external force is applied to the wire breakage correction section with tweezers or a scriber to observe the movement and resistance of the wire breakage correction section by visual inspection with a magnifying glass, but the reliability is poor and work efficiency is poor. That's it.
【0003】[0003]
【発明が解決しようとする課題】従来の技術で述べたよ
うに、従来のプリント配線板の検査工程における断線修
正は信頼性に欠け、作業能率が悪いという欠点がある。
本発明は従来の技術における上述の問題点に鑑みてなさ
れたもので、その目的とするところは断線修正を高信頼
性、高作業能率でおこなうプリント配線板の製造方法を
提供することにある。As described in the prior art, the conventional wire breakage correction in the inspection process of a printed wiring board has the drawbacks of lacking reliability and poor work efficiency.
The present invention has been made in view of the above problems in the prior art, and an object of the present invention is to provide a method for manufacturing a printed wiring board that can perform disconnection correction with high reliability and high work efficiency.
【0004】[0004]
【課題を解決するための手段】本発明は、プリント配線
板の検査工程に於いて、断線修正部にエアーブローする
ことを特徴とするプリント配線板の製造方法のため、上
記目的を達成することができたもので、以下本発明を詳
細に説明する。The present invention provides a method for manufacturing a printed wiring board, which is characterized in that in the inspection step of the printed wiring board, air is blown to the disconnection correcting portion. Therefore, the above object can be achieved. Now, the present invention will be described in detail.
【0005】本発明に用いるプリント配線板としては、
樹脂にフエノール、エポキシ、不飽和ポリエステル樹
脂、ポリイミド、フッ素樹脂、ポリフエニレンオキサイ
ド等の単独、変性物、混合物を用いることができ、該樹
脂をガラス、アスベスト等の無機質繊維や、ポリエステ
ル、ポリアミド、ポリアクリル、ポリビニルアルコー
ル、ポリイミド、フッ素樹脂等の有機質繊維や、木綿等
の天然繊維からなる織布、不織布、マット、紙等の基材
に含浸してなるプリプレグの所要枚数の上面及び又は下
面に銅、アルミニュウム、真鍮、ニッケル、鉄等の単
独、合金、複合箔等からなる金属箔を配設ー体化してな
る金属箔張り積層板等を用いることができる。検査工程
における断線修正は、金鍍金付コバール線、銅銀合金線
等のように、従来の溶接リボン全般を用いることがで
き、特に限定するものではなく、修正機器としては例え
ば日本アビオニクス株式会社製のMCW−550ELP
等が用いられ、これまた限定するものではない。判定方
法としては拡大鏡による目視、蛍光法や反射法による光
学式パターン検査、電気式検査等が用いられるが、断線
修正部にエアーブローすることが必要である。かくする
ことにより断線修正部にエアー以外の外力を加えること
がないので、断線修正部を傷めることがなく、信頼性が
向上し又検査が容易になるため作業能率を向上させるこ
とができるものである。エアーブローの圧力程度は任意
であり、特に限定するものではない。As the printed wiring board used in the present invention,
Resin, phenol, epoxy, unsaturated polyester resin, polyimide, fluororesin, polyphenylene oxide, etc. alone, modified products, it is possible to use a mixture, the resin, inorganic fibers such as asbestos, polyester, polyamide, On the upper and / or lower surface of the required number of prepregs impregnated with a base material such as woven cloth, non-woven cloth, mat, and paper made of organic fibers such as polyacryl, polyvinyl alcohol, polyimide, and fluororesin, and natural fibers such as cotton. It is possible to use a metal foil-clad laminate obtained by disposing and forming a metal foil made of copper, aluminum, brass, nickel, iron or the like alone, an alloy, or a composite foil. For the disconnection correction in the inspection process, conventional welding ribbons in general can be used, such as Kovar wire with gold plating, copper-silver alloy wire, etc., and there is no particular limitation, and correction equipment is, for example, manufactured by Nippon Avionics Co., Ltd. MCW-550ELP
Etc. are used, but are not limited thereto. As the determination method, visual inspection with a magnifying glass, optical pattern inspection by a fluorescence method or reflection method, electrical inspection, or the like is used, but it is necessary to blow air to the disconnection correction portion. By doing so, since no external force other than air is applied to the disconnection correction portion, the disconnection correction portion is not damaged, reliability is improved, and inspection is facilitated, so that work efficiency can be improved. is there. The degree of air blow pressure is arbitrary and is not particularly limited.
【0006】以下本発明を実施例に基づいて説明する。The present invention will be described below based on examples.
【0007】[0007]
【実施例1】厚さ1mmの両面銅張りガラス布基材エポ
キシ樹脂積層板の片面に、保護フイルム付ドライフイル
ム、パターンフイルムを重ね、露光機で露光してパター
ンを焼き付けた。同様処理を裏面側にも施してからエッ
チング処理を行い両面に回路を有する内層材を得たが、
断線部があるため該断線部を日本アビオニクス株式会社
製、MCW−550ELP、金鍍金付コバール線溶接リ
ボンで修正した断線修正部に0.5Kg/cm2 のエア
ーブローをおこない断線修正部の確認後、該内層材の上
下に厚さ0.1mmのエポキシ樹脂ガラスプリプレグを
各々2枚配設後、更にその最外側に厚さ0.035mm
の銅箔を配設した積層体を、成形圧力40Kg/c
m2 、170℃で120分間積層成形して4層プリント
配線板を得た。Example 1 A dry film with a protective film and a pattern film were overlaid on one side of a 1 mm thick double-sided copper-clad glass cloth substrate epoxy resin laminate, and exposed by an exposure machine to print a pattern. After performing the same treatment on the back side as well, an etching treatment was performed to obtain an inner layer material having circuits on both sides.
Since there is a disconnection part, the disconnection part was corrected with MCW-550ELP, Kovar wire welding ribbon with gold plating, manufactured by Japan Avionics Co., Ltd., and air was blown at 0.5 kg / cm 2 to the disconnection correction part, and after confirmation of the disconnection correction part After arranging two epoxy resin glass prepregs each having a thickness of 0.1 mm above and below the inner layer material, a thickness of 0.035 mm is further provided on the outermost side thereof.
The laminated body on which the copper foil of
A four-layer printed wiring board was obtained by performing lamination molding at m 2 and 170 ° C. for 120 minutes.
【0008】[0008]
【実施例2】溶接リボンを銅銀合金線に、エアーブロー
圧を1.0Kg/cm2 にした以外は実施例1と同様に
処理して4層プリント配線板を得た。Example 2 A four-layer printed wiring board was obtained in the same manner as in Example 1 except that the welding ribbon was a copper-silver alloy wire and the air blow pressure was 1.0 kg / cm 2 .
【0009】[0009]
【比較例】エアーブローしない以外は、実施例1と同様
に処理して4層プリント配線板を得た。[Comparative Example] A four-layer printed wiring board was obtained in the same manner as in Example 1 except that air blowing was not performed.
【0010】実施例1と2及び比較例のプリント配線板
の性能は、第1表のようである。 注 生産性は従来を100とした場合の比である。The performance of the printed wiring boards of Examples 1 and 2 and Comparative Example is as shown in Table 1. Note: Productivity is the ratio when the conventional value is 100.
【0011】[0011]
【発明の効果】本発明は上述した如く構成されている。
特許請求の範囲に記載した構成を有するプリント配線板
の製造方法においては、回路パターン信頼性、生産性が
向上する効果がある。The present invention is constructed as described above.
In the method for manufacturing a printed wiring board having the configuration described in the claims, there is an effect that circuit pattern reliability and productivity are improved.
Claims (1)
線修正部にエアーブローすることを特徴とするプリント
配線板の製造方法。1. A method of manufacturing a printed wiring board, characterized in that in the step of inspecting the printed wiring board, air is blown to the disconnection correcting portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3709191A JPH05152724A (en) | 1991-03-04 | 1991-03-04 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3709191A JPH05152724A (en) | 1991-03-04 | 1991-03-04 | Manufacture of printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05152724A true JPH05152724A (en) | 1993-06-18 |
Family
ID=12487897
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3709191A Pending JPH05152724A (en) | 1991-03-04 | 1991-03-04 | Manufacture of printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05152724A (en) |
-
1991
- 1991-03-04 JP JP3709191A patent/JPH05152724A/en active Pending
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