JPH05152377A - Ic package and manufacture thereof - Google Patents

Abstract

PURPOSE:To cope with the change of an ASIC or an IC provided with gates in applications by a film carrier tape and a board. CONSTITUTION:A plurality of leads 4 are provided to the underside of a film 1 where a chip insertion hole 2 is bored at its center. An IC chip 30 is inserted into the chip insertion hole 2 and aligned, and the ends of the leads 4 are connected to all the terminals 31 of the IC chip 30. Thereafter, through-holes 7 are punched in the film 1, and disused leads 4 are disconnected.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC package and its manufacturing method. Specifically, TAB (Tape Automated
The present invention relates to a bonding) mounted IC package and a method for manufacturing the same.

[0002]

2. Description of the Related Art FIG. 3 is a plan view showing a conventional TAB-mounted IC package 40. This IC package 4
0 is the one in which the IC chip 30 is aligned in the chip insertion hole 42 of the film 41 having a plurality of leads 44 provided on the lower surface, and the leads 44 of the film 41 are bonded to the terminals 31 of the IC chip 30 by thermocompression bonding. As shown in FIG. 4, the sealing resin 48 is poured into the chip insertion hole 42,
The IC chip 30 is sealed.

This TAB mounted IC package 40
After forming the lead 44,
Of the lead 44 on the electrode 51 of the substrate 50.
Are soldered to the electrodes 51 and mounted on the substrate 50.

[0004]

However, when an ASIC, a multi-function IC, or an IC having a plurality of gates is used as an IC chip, the terminals to be used are different for each application, and the arrangement of leads is different depending on the application. It is necessary to make many types of films (ie film carrier tapes). Alternatively, it is necessary to use a common film (general-purpose film) having leads corresponding to all terminals of the IC as a film, and to use a substrate having a different wiring pattern depending on the application.

Therefore, in any case, a plurality of types or a large number of types of films or substrates are required, and a design cost is required for each application. Therefore, in such applications, the cost is higher than the wire bonding method,
In particular, there was a problem that it was not possible to handle high-mix low-volume production.

The present invention has been made in view of the drawbacks of the above-mentioned conventional examples, and an object of the present invention is to obtain AISIC.
The purpose is to enable one type of film carrier tape and substrate to handle changes in applications such as multi-function IC chips and multi-gate IC chips.

[0007]

In the IC package of the present invention, an IC chip is inserted into a chip insertion hole of a film having a plurality of leads, and the plurality of terminals of the IC chip and the leads of the film are connected to each other. Are joined together, and the film is perforated so as to disconnect one or more of these leads.

The IC package manufacturing method of the present invention is
An IC chip is inserted into a chip insertion hole of a film carrier tape having a plurality of leads for joining to a C package, and all the plurality of terminals of the IC chip are joined to the leads of the tape. At the same time as punching a film on which an IC chip is mounted from a tape, punching a punch hole in this film to break one or more leads.

Another method of manufacturing an IC package according to the present invention is characterized in that I is formed in a chip insertion hole of a film carrier tape having a plurality of leads for joining to the IC package.
After inserting the C chip and joining all the terminals of the IC chip to the leads of the tape, the film on which the IC chip is mounted is extracted from the film carrier tape, and holes are punched in the film by the energy beam. By doing so, one or more leads are disconnected.

As the energy beam, for example, a laser beam can be used.

Alternatively, an electron beam may be used as the energy beam.

[0012]

In the present invention, since the plurality of terminals of the IC chip inserted in the chip insertion holes of the film and the plurality of leads provided on the film are all joined,
It has more mechanical strength than conventional IC packages that do not have leads joined to unnecessary terminals, and is more resistant to external forces. Further, since the number of leads is large, the encapsulating resin is easily held by the leads during resin encapsulation, which facilitates resin encapsulation.

Further, since unnecessary leads of the leads can be disconnected by punching holes, a multifunction IC
The necessary wiring can be obtained by breaking unnecessary leads according to the application such as a chip. Therefore, a common film carrier tape and substrate can be used regardless of the application such as a multifunction IC chip. Therefore, I
This makes it easy to handle high-mix low-volume production of C packages,
The cost of the IC package can be reduced.

In addition, in the method of manufacturing the IC package of the present invention, since the film is punched from the film carrier tape, the punching holes are punched in the film to break the unnecessary leads. However, only one type is required, and the punching operation only needs to be performed once.

Further, the IC chip can be rapidly manufactured by punching a hole with a laser beam or an electron beam to disconnect the lead.

[0016]

EXAMPLE An IC package and a method of manufacturing the same according to an example of the present invention will be described. 1 is a plan view showing a mounting state of the IC chip 30 on the film carrier tape 10, and FIG. 2 is a plan view showing an IC package 20 obtained from the film carrier tape of FIG. The band-shaped film carrier tape 10 is provided with rectangular chip insertion holes 2 at equal intervals on the center line, and trapezoidal holes 3 are opened corresponding to the respective sides of the chip insertion holes 2. Further, the same number of leads 4 as the terminals 31 of the IC chip 30 are provided on the lower surface of the film carrier tape 10. These leads 4 are arranged so as to pass through the trapezoidal holes 3 of the film carrier tape 10, and one ends thereof project inside the chip insertion holes 2.

Then, the IC chip 30 is inserted into the film carrier tape 10 and the chip insertion hole 2 for alignment, and all the leads 4 are brought into contact with the terminals 31 of the IC chip 30 and thermocompression bonded. Therefore, all terminals 3
Lead 4 is connected to 1. Then, the sealing resin 8 is poured into the chip insertion hole 2 to seal the IC chip 30, and finally, the film carrier tape 10 is punched with a mold along the alternate long and short dash line 5 in FIG. Obtain the IC package 20. At the time of punching by this press, the punching hole 7 is punched in the film 1 in the same manner, and the unnecessary lead 4 is removed.
To disconnect. As a result, the IC package 20 for a specific application can be easily manufactured by using the general-purpose film carrier tape 10.

Therefore, when the application of the IC chip 30 is different, it can be dealt with by changing the punching position of the punching hole 7, and the film carrier tape 10 (film 1).
Is the IC chip 3 regardless of the use of the IC chip 30.
One type having the same number of leads 4 as the number of terminals 31 of 0 can be used, and the substrate does not need to be changed for each application of the IC chip 30. Therefore, one type of film carrier tape 10 and the substrate can be used for various purposes of the IC chip 30. The cost of changing the punching die is lower than the design cost of the film carrier tape.

Further, the film 1 has the same number of leads 4 as the terminals 31 (maximum number), and all the leads 4 are provided.
Is bonded to the terminal 31 of the IC chip 30,
The C chip 30 is firmly held by the film 1 via the leads 4, and the mechanical strength of the IC package 20 is increased. Moreover, since the holding force of the sealing resin 8 by the leads 4 is also increased, the resin sealing is facilitated.

Film 1 (IC package 20)
The punching from the film carrier tape and the punching of the punching holes 7 may be performed separately, but if the punching is performed simultaneously as described above, only one type of punching die is required, and the punching Only one process is required.

Further, the hole 7 is not limited to punching by a press, but a film such as a laser beam or an electron beam may be used.
Alternatively, the lead hole 4 may be punched and the lead 4 may be disconnected.

Although the shape of the hole is circular in the above embodiment, the shape is not limited to this and may be a square hole or a slit hole.

[0023]

According to the present invention, the IC chip can be firmly held on the film by the leads.
The mechanical strength of the C package can be improved.
Therefore, it becomes stronger against external force and reliability is improved.
Further, since the holding force of the encapsulating resin by the leads is also increased, the encapsulating resin is less likely to fall off before curing, and the resin encapsulation is facilitated.

Further, since the necessary wiring can be obtained by disconnecting the unnecessary leads according to the application of the multifunction IC chip or the like, a common film carrier tape and substrate can be used regardless of the application of the multifunction IC chip. It can be used, and it is easy to handle high-mix low-volume production. This also makes it possible to reduce the cost of the IC package.

Further, according to the method of manufacturing an IC package of the present invention, only one type of die for punching is required,
Mold cost can be reduced. Moreover, since the punching process is performed only once, the manufacturing efficiency of the IC package is improved.

Further, by punching a hole with a laser beam or an electron beam to disconnect the lead, an IC package for a specific application can be easily manufactured.

[Brief description of drawings]

FIG. 1 is an embodiment of the present invention in which an IC chip is a TA
It is a top view which shows the film carrier tape mounted by B.

FIG. 2 is a plan view of an IC package punched from the above film carrier tape.

FIG. 3 is a plan view of an IC package according to a conventional example.

FIG. 4 is a cross-sectional view of the same IC package as that mounted on a substrate.

[Explanation of symbols]

 1 Film 4 Lead 7 Holes 10 Film Carrier Tape 20 IC Package 30 IC Chip

Claims (5)

[Claims] 1. An IC chip is inserted into a chip insertion hole of a film having a plurality of leads, and a plurality of terminals of the IC chip and respective leads of the film are all joined,
An IC package characterized in that a hole is formed in the film so as to disconnect one or more of these leads. 2. An IC chip is inserted into a chip insertion hole of a film carrier tape having a plurality of leads for joining to an IC package, and a plurality of all terminals of the IC chip are joined to the leads of the tape. Thereafter, a film having an IC chip mounted thereon is punched out from the film carrier tape, and at the same time, one or more leads are broken by punching a punch hole in the film. 3. An IC chip is inserted into a chip insertion hole of a film carrier tape having a plurality of leads for joining to an IC package, and a plurality of all terminals of the IC chip are joined to the leads of the tape. After that, a film on which an IC chip is mounted is extracted from this film carrier tape, and one or more leads are disconnected by punching a hole in the film with an energy beam, thereby manufacturing an IC package. 4. The method of manufacturing an IC package according to claim 3, wherein a laser beam is used as the energy beam. 5. The method of manufacturing an IC package according to claim 3, wherein an electron beam is used as the energy beam.