JPH05149586A - Ceiling radiation room-cooling/heating system - Google Patents

Abstract

PURPOSE:To obtain comfortable indoor conditions by circulating chilled air or warm air to a closed space which is formed behind a ceiling material having a special heat resistance and suitably heat insulated. CONSTITUTION:A heat resistant per unit area of a ceiling material 1 of a ceiling radiation room cooling/heating system is 0.01-0.4m<2>.K/W or desirably 0.01-0.2m<2>-K/W. The air cooled or overheated by a heat source 16 such as a heat pump, etc., is circulated to a space 2 behind a ceiling. In the case for the purpose of room cooling, a ceiling surface temperature is set to about 20 deg.C to perform the cooling. In the case for the purpose of room heating, the temperature is set to about 35 deg.C to perform the heating. Thus, comfortable indoor conditions can be obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceiling radiant cooling / heating system for cooling or heating a ceiling surface to cool or heat a room.

[0002]

2. Description of the Related Art A conventional ceiling radiation cooling and heating system is shown in FIG. This is the case where the cooling water from the heat source 16 such as a heat pump or the heating water is supplied to the copper pipe 17 arranged in the ceiling slab 4 by the pump 15 and the ceiling surface temperature is set to 20 for cooling.
If the purpose is to heat the room, the temperature is set to about 35 degrees C to cool or heat the room.

As another embodiment, an actual kaihei 01-22918
There is a system such as that shown in FIG. In this system, an exposed copper pipe 17 is provided above the lattice ceiling material 1 as the ceiling surface, and cold water or hot water is supplied to the copper pipe 17 to perform cooling and heating, as in the system of FIG.
Such cooling and heating using heat transfer by radiation from the ceiling surface makes it possible to obtain comfortable indoor conditions because an unpleasant air flow is unlikely to occur and the vertical temperature distribution in the room is extremely small.

[0004]

However, in the ceiling cooling and heating system according to the prior art shown in FIG. 12, since the copper pipe 17 is piped in the ceiling slab 4, the construction is very difficult, and only a limited number of contractors can do it. It has the drawback that it cannot be installed. Further, since the ceiling slab has a large heat capacity, it takes a very long time to start heating and cooling.

The system shown in FIG. 13 is also difficult to construct. In both of the conventional examples, water is circulated for cooling and heating, and there is a risk of water leakage into the room. The present invention is intended to solve the above-mentioned problems, and an object of the present invention is to reduce the temperature distribution on the ceiling surface and to perform a comfortable air conditioning while using air as a heat medium. To provide air conditioning system.

[0006]

The ceiling radiant cooling and heating system of the present invention has a thermal resistance of 0.01 m ² · K per unit area.
/ W or more and 0.4 m ² · K / W or less, a ceiling surface composed of a ceiling material, a closed space that is formed on the back surface of the ceiling material and is appropriately insulated, and cool air or warm air in the closed space. It is characterized by comprising a heat source for circulation and a blower.

The thermal resistance per unit area is 0.01 m.
Using ² · K / W or 0. 2m ² · K / W or less is ceiling material, to form a closed space A properly insulated to the ceiling material back surface, cool the inside of the closed space by a heat source such as a pump or Cooling and heating are performed by circulating the heated air so that the ceiling surface temperature is about 20 ° C. for the purpose of cooling and about 35 ° C. for the purpose of heating.

[0008]

The ceiling radiant cooling and heating system of the present invention uses air as a heat medium. Compared to the case of performing ceiling radiant cooling and heating using water as a heat medium shown in the conventional example, since the specific heat of air is smaller than that of water, in order to prevent the ceiling surface temperature distribution from increasing, the flow rate to the back of the ceiling must be extremely high. More or
It is necessary to make the temperature difference between the room temperature and the ceiling surface temperature small. Therefore, it is generally said that the air heating medium is not suitable for ceiling cooling. Therefore, in a unit area per heat resistance of the ceiling material is 0. 01m ² · K / W or 0. 4m ² · K / W or less Ceiling radiant heating and cooling system of the present invention,
Preferably ^{0. 2m 2 · 01m 2 · K} / W or higher thermal resistance
It was set to K / W or less, and the problem was solved by circulating air cooled or heated on the back surface of the ceiling material by a heat source such as a heat pump. The principle will be briefly described below.

Assuming that the ceiling radiant cooling and heating system as shown in FIG. 7 was constructed (construction area 8.5 m ² ), a simple simulation was tried. Now, considering cooling and heating, it is assumed that the average temperature of the ceiling is set to 22 ° C. by circulating 400 m ³ / h of cool air in the space on the back side of the ceiling at room temperature of 28 ° C. Table 1 shows a comparison between the case where a 1 mm thick aluminum plate is used as a ceiling material and the case where a 12 mm thick rock wool ceiling material is used.

Table 1 Ceiling material Thermal resistance per unit area Surface temperature distribution A point Air temperature B point Air temperature Heat conductivity Thickness Aluminum 164W / mk 6.1 × 10 ^-6 m ² k / w 2.6 ℃ 16.1 ℃ 20.3 the ° C. when using a 1mm thick rockwool ^{0.08w / mk 0.15m 2 k / w} 1.4 ℃ 7.7 ℃ 11.9 ℃ 12mm thickness thermal conductivity good aluminum ceiling material, the temperature distribution of the ceiling surface 2. a 6 ° C. On the other hand, when rockwool ceiling material with poor thermal conductivity is used, the temperature distribution is extremely small at 1.4 ° C. On the other hand, it is necessary to lower the temperature of the cold air flowing on the back of the ceiling, but this was solved by the following method.

Considering indoor cooling by a commonly used air conditioner, the air conditioner takes in indoor air, cools it, and discharges it indoors. In this case, the temperature of the cold air blown into the room is generally around 15 ° C. On the other hand, as shown in Fig. 7, a heat source such as a heat pump is placed in a space that is appropriately insulated to circulate cold air in a closed state, so that the low temperature required for cooling using the rock wool ceiling material in Table 1 can be easily achieved. You can get cold air.

Further, according to the present invention, since air is used as the heat medium, the structure can be made very simple as compared with the case where water is used as the refrigerant. In addition, since only the ceiling material is used to increase the heat capacity, the heat capacity is small and cooling or heating starts up quickly.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention is shown in FIGS. The specific contents of these examples will be described below, but the present invention is not limited to the following description. -Example 1-In this example, as shown in FIG. 1, a ceiling material 1 made of rockwool having an aluminum laminate attached to the ceiling portion between 8 tatami mats (heat resistance per unit area is 0.17 m ² · K / W). , Thickness 12m
m), a ceiling is installed, and on the back side thereof, an air conditioner 6 as a heat source is installed in a ceiling space 2 which is a closed space that is appropriately insulated by a heat insulating material 5 to circulate cold air in the ceiling space 2. Warm air 8 is passed. 7 is an outdoor unit.

During cooling, the average ceiling surface temperature of 22 ° C. could be obtained at room temperature of 28 ° C. by keeping the air 2 behind the ceiling at about 8 ° C. Dehumidification during cooling was performed by bringing a dehumidifier into the room 3. At the time of heating, the ceiling space 2 is 55
By setting the temperature to about 0 ° C, the average ceiling surface temperature of 33 ° C could be obtained at room temperature of 20 ° C.

Example 2 In this example, a system as shown in FIG. 2 is installed on the ceiling of an 8-mat room. The same ceiling material as in Example 1 was used. In this system, a flow path having a height of 2 cm is formed by a discarding and bonding plywood 18 and a ceiling material 1, and a field edge 9 having a width of 4 cm and a height of 2 cm is installed in parallel with the flow to partition with each flow channel 10 and discard and bond. It is used as a spacer between the plywood 18 and the ceiling material 1. Headers 11 are provided at the inlet and outlet of the flow channel 10, respectively. Details of the connection between the flow path 10 and the heat source 16 (air conditioner 6) are shown in FIG. Two similar channels are arranged in parallel, and an inlet 13 and an outlet 14 of each channel are connected to a heat source 16 (air conditioner 6) by a duct 12. The header 11
Since the cross-sectional area of is sufficiently large, the pressure loss of the header 11 portion is sufficiently smaller than the pressure loss of the flow path portion. Therefore, the flow velocity of cold air or warm air in each flow path 10 is substantially uniform. FIG. 4 shows data obtained by performing ceiling cooling using this experimental apparatus. Dehumidification in this experiment was performed by bringing a dehumidifier into the room. Further, FIG. 5 shows data obtained by performing ceiling heating.

Example 3 An apparatus similar to the experimental apparatus used in Example 2, having moisture permeability as a ceiling material and a thermal resistance per unit area of 0.17 m ² ·
The same experiment was conducted using a rock wool ceiling material having K / W and a thickness of 12 mm as the ceiling. The moisture permeability of this ceiling material is
It was 8.5 / m ³ h · mmHg. FIG. 6 shows data obtained by performing ceiling cooling using this experimental apparatus. No dehumidifier was used in this experiment. As can be seen from FIG. 6, a comfortable cooling space could be obtained. Furthermore, it should be noted that, although the dehumidifier was not used, dew condensation did not occur on the ceiling material 1 and the drainage water of the air conditioner 6 was about 600 g / h. This indicates that the present apparatus using the moisture-permeable ceiling material has a dehumidifying function.

Fourth Embodiment FIGS. 8 to 11 show a fourth embodiment, which is an air circulation type ceiling.
A schematic cross-sectional view showing the configuration of the well cooling system is shown in FIG.
Figure 9 shows the flow path that forms the ceiling surface, and the upper surface is glass
Field 9 between the plywood 18a and the ceiling material 1 that are insulated by the roof 5a
2cm height with (space between the fields 30cm) as spacer
The air flow path 10 is formed. Top plate material used in this experiment
1 is a 15 mm thick porous material mainly composed of rock wool
The thermal conductivity is 0.04 W / m ・ k (per unit area)
Thermal resistance of 0.38m²・ K / w, moisture permeability is 5.5g /
m²・ It is h · mmHg. Both channels 10 as shown in FIG.
Each end has a cross section of 30 cm x 10 cm.
Is provided as one module. One module
The size of the radiation surface of is 1.5 m × 2.7 m. Headed
-Because the pressure loss of the part is sufficiently smaller than the pressure loss of the flow path part,
The air resistance of each flow path becomes substantially uniform. Module entrance
A sirocco fan is attached to each minute and each flow path is about 2.5 m / s
So that the air is flowing. In the experiment, FIG.
Two identical modules are arranged side by side like 0, and the ceiling in the room
Installed in each part, each entrance 13, 14 is Φ150m
It was connected to the cooler by a duct of m. The area of the radiation surface is
8.1m ²(Laying rate is 62%). Air conditioner (cooling
6) is a package type Airco manufactured by Matsushita Electric Industrial Co., Ltd.
CS-36ZH3 (cooling capacity 3550 kcal / h)
It was used.

Room size: 3.6 ^L x 3.6 m ^W x 2.2
5m ^H (equivalent to 8 tatami mats) Window: 3.2m ^W × 1.8m ^H South facing single-layer glass double sash + lace curtain Heat loss coefficient: 3.3kcal / m ² h ℃ (building heat per unit floor area Flow rate) Assuming 2 people in the room, 160g using ultrasonic humidifier
/ H was humidified. The heat generated by the human body is the heat generated by devices such as personal computers installed indoors (240 kcal / h)
I used it instead.

FIG. 11 shows an example of the temperature and humidity conditions inside the room at the time of the ceiling cooling experiment value. The temperature of the cold air circulating in the ceiling module is 9.6 ° C on average at the inlet and 1 on average at the outlet.
2.3 ℃, the average temperature of the radiant ceiling is 21.3 ℃
Is. The average room temperature and humidity at this time were 27.2 ° C and 43%.
RH and the average outdoor temperature and humidity were 31.8 ° C. and 52% RH. There was no condensation on the ceiling. The amount of drain water coming out from the air conditioner 6 was 580 g / h.

As described above, the average room temperature and humidity is 27.2 ° C,
At 43% RH, it was possible to create a good indoor environment without condensation on the ceiling.

[0021]

According to the ceiling radiant cooling and heating system of the present invention, since air is used as the heat medium instead of the conventional water, there is no fear of water leakage and the entire apparatus can be simplified, so construction is very easy. Can be done to. Moreover, the thermal resistance per unit area of the ceiling material is 0.01 m ² · K / W or more.
4m ² · K / W or less, preferably thermal resistance is 0.0
Since the cooling air or the heating air is circulated in the closed space on the back surface of the ceiling material by setting it to 1 m ² · K / W or more and 0.2 m ² · K / W or less, the ceiling surface temperature necessary for ceiling cooling and heating can be secured, and , The temperature distribution on the ceiling surface can be made very small. Therefore, a comfortable air-conditioned space can be provided even with a device that uses air as a heat medium.

[Brief description of drawings]

FIG. 1 is a schematic sectional view of an embodiment of the present invention.

FIG. 2 (a) is a schematic cross-sectional view of another embodiment of the above.
(B) is a partial expanded sectional view same as the above.

FIG. 3 is a perspective view showing a ceiling structure of the above.

FIG. 4 is a characteristic diagram of experimental data showing the performance of the present invention.

FIG. 5 is a characteristic diagram of experimental data showing the performance of the present invention.

FIG. 6 is a characteristic diagram of experimental data showing the performance of the present invention.

FIG. 7 is a schematic cross-sectional view showing a model obtained by performing the above simulation.

FIG. 8 is a schematic cross-sectional view of still another embodiment of the same.

FIG. 9 is a partially enlarged sectional view of the above.

FIG. 10 is a perspective view showing the ceiling structure of the above.

FIG. 11 is a characteristic diagram of experimental data showing the same performance.

FIG. 12 is a sectional view of a conventional example.

FIG. 13 is a schematic cutaway perspective view of another conventional example.

[Explanation of symbols]

 1 Ceiling material 2 Ceiling space 3 Indoors 6 Air conditioner (indoor unit) 16 Heat source

Claims (2)

[Claims] 1. The thermal resistance per unit area is 0.01 m ² · K.
/ W or more and 0.4 m ² · K / W or less, a ceiling surface composed of a ceiling material, a closed space that is formed on the back surface of the ceiling material and is appropriately insulated, and cool air or warm air in the closed space. A ceiling radiant cooling and heating system consisting of a circulating heat source and a blower. 2. The thermal resistance per unit area is 0.01 m ² · K.
/ W or more and 0.2 m ² · K / W or less, a ceiling surface composed of a ceiling material, a closed space formed on the back surface of the ceiling material and appropriately insulated, and cool air or warm air in the closed space. A ceiling radiant cooling and heating system consisting of a circulating heat source and a blower.