JPH0514864B2 - - Google Patents
Info
- Publication number
- JPH0514864B2 JPH0514864B2 JP60105006A JP10500685A JPH0514864B2 JP H0514864 B2 JPH0514864 B2 JP H0514864B2 JP 60105006 A JP60105006 A JP 60105006A JP 10500685 A JP10500685 A JP 10500685A JP H0514864 B2 JPH0514864 B2 JP H0514864B2
- Authority
- JP
- Japan
- Prior art keywords
- dispersion
- humidity
- moisture
- resistive film
- conductive powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 claims description 30
- 239000000843 powder Substances 0.000 claims description 18
- 239000003795 chemical substances by application Substances 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- 235000019445 benzyl alcohol Nutrition 0.000 claims description 10
- 229920001577 copolymer Polymers 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 claims description 4
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 claims description 4
- 238000007650 screen-printing Methods 0.000 claims description 4
- 239000006230 acetylene black Substances 0.000 claims description 3
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 claims description 3
- 238000010304 firing Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 1
- 239000006185 dispersion Substances 0.000 description 27
- 238000010438 heat treatment Methods 0.000 description 6
- 230000035945 sensitivity Effects 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910021382 natural graphite Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
- Non-Adjustable Resistors (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は湿度又は結露等を検出するために使用
する再現性が高く、高感度で、寿命特性の優れた
湿度センサの製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for manufacturing a humidity sensor that is used to detect humidity, dew condensation, etc. and has high reproducibility, high sensitivity, and excellent longevity characteristics.
従来の技術
従来、この種の湿度センサの製造方法として
は、数多く知られている。例えば特願昭52−
151890号公報、特公昭56−13362号公報、特公昭
60−8458号公報に示されているように、ガラス基
板、アルミナ基板等の絶縁基板上にカーボンや金
属の材料で一対のくし形電極を設ける。次に吸湿
性樹脂として、２−ヒドロキシエチルメタクリレ
ートとグリシジルメタクリレートの共重合体をメ
チルセロソルブやエチルセロソルブ等の溶剤で溶
かし、これに天然黒鉛粉ASPやカーボンブラツ
ク等の導電性粉末と硬化剤ジアミノジフエニルメ
タンを加え、さらにメチルセロソルブやエチルセ
ロソルブを加え、ボールミルで混合しよく分散さ
せる。この分散液を先の電極を設けた絶縁基板上
に塗布して感湿抵抗膜を形成し、100℃で１時間
加熱して湿度センサが製造されていた。2. Description of the Related Art Many methods for manufacturing this type of humidity sensor are known. For example, the patent application in 1977-
Publication No. 151890, Publication No. 56-13362, Publication No. 13362, Publication No. 13362, Special Publication No.
As shown in Japanese Patent No. 60-8458, a pair of comb-shaped electrodes made of carbon or metal are provided on an insulating substrate such as a glass substrate or an alumina substrate. Next, as a hygroscopic resin, a copolymer of 2-hydroxyethyl methacrylate and glycidyl methacrylate is dissolved in a solvent such as methyl cellosolve or ethyl cellosolve, and this is mixed with a conductive powder such as natural graphite powder ASP or carbon black and a hardening agent diaminodiph. Add enylmethane, then methyl cellosolve and ethyl cellosolve, and mix with a ball mill to disperse well. A humidity sensor was manufactured by applying this dispersion onto an insulating substrate provided with the electrodes described above to form a humidity-sensitive resistive film, and heating the film at 100° C. for 1 hour.
発明が解決しようとする問題点
このような従来の方法では、感湿抵抗膜形成時
には、周囲温度湿度によりなる分散液の溶剤の蒸
発、導電性粉末粒子間の安定性、吸湿性樹脂と導
電性粉末の分散状態に変化等があり、しかも分散
液は保存がきかず再現性に問題があつた。叉、
120℃以上で加熱すると湿度特性の感度が低下し、
高温に放置されると寿命特性が劣化するという問
題があつた。Problems to be Solved by the Invention In such conventional methods, when forming a moisture-sensitive resistive film, evaporation of the solvent in the dispersion due to ambient temperature and humidity, stability between conductive powder particles, and hygroscopic resin and conductive There were changes in the dispersion state of the powder, and the dispersion liquid could not be stored, causing problems in reproducibility. Fork,
When heated above 120℃, the sensitivity of humidity characteristics decreases,
There was a problem that the life characteristics deteriorated when left at high temperatures.
本発明はこのような問題点を解決するもので、
周囲温度湿度によりなる分散液の蒸発が少ない高
沸点の溶剤を使用し、硬化剤の添加量を少なくし
て吸湿性樹脂と導電性粉末の分散状態が安定で長
期保存が可能な分散液を製造することにより、再
現性が高く、高感度で寿命特性に優れた湿度セン
サの製造方法を提供することを目的とするもので
ある。 The present invention solves these problems,
By using a high boiling point solvent that causes less evaporation of the dispersion due to ambient temperature and humidity, and by reducing the amount of curing agent added, we produce a dispersion that has a stable dispersion state of hygroscopic resin and conductive powder and can be stored for a long time. By doing so, it is an object of the present invention to provide a method for manufacturing a humidity sensor that has high reproducibility, high sensitivity, and excellent lifetime characteristics.
問題点を解決するための手段
この問題点を解決するために本発明は、２−ヒ
ドロキシエチルメタクリレートとグリシジルメタ
クリレートとアゾビスイソブチロニトルの共重合
体吸湿性樹脂に対し硬化剤としてジアミノジフエ
ニルメタンを少量加え、導電性粉末としてアセチ
レンブラツクを加えて分散液を製造し、さらに高
沸点の溶剤ベンジルアルコールを加えてペースト
状の分散液を製造することにより、再現性の高い
寿命特性に優れた湿度センサを製造することを特
徴としたものである。Means for Solving the Problem In order to solve this problem, the present invention uses diaminodiphenyl as a curing agent for a copolymer hygroscopic resin of 2-hydroxyethyl methacrylate, glycidyl methacrylate, and azobisisobutyronitrile. By adding a small amount of methane and acetylene black as a conductive powder to produce a dispersion, and then adding benzyl alcohol, a high-boiling point solvent, to produce a paste-like dispersion, we have achieved excellent life characteristics with high reproducibility. It is characterized by manufacturing a humidity sensor.
作 用
この方法により、ペースト状の分散液は、周囲
温度湿度の変化に対しても常に吸湿性樹脂と導電
性粉末の分散状態が安定で、長期保存が可能であ
り、安定で再現性の高い感湿抵抗膜を形成するこ
とができる。叉、硬化剤の添加量が少ないため高
温加熱が可能で、高温に放置された場合の湿度特
性の感度抵下、寿命特性の劣化を小さくすること
となる。Effect: By using this method, the paste-like dispersion liquid has a stable dispersion state of hygroscopic resin and conductive powder even under changes in ambient temperature and humidity, and can be stored for a long period of time.It is stable and highly reproducible. A moisture sensitive resistive film can be formed. Furthermore, since the amount of curing agent added is small, it is possible to heat the product at high temperatures, which reduces the sensitivity drop in humidity characteristics and the deterioration in life characteristics when left at high temperatures.
実施例
第１図は本発明の一実施例の製造方法による湿
度センサの一例を示し、第１図Ａは平面図であ
り、第１図ＢはＸ−X′線に沿つた断面図である。
第１図において、１はアルミナ絶縁基板で、この
アルミナ絶縁基板１の上面にリード線５，６の半
田付け用銀電極２ａ，２ｂを形成する。次にくし
形のカーボン電極３ａ，３ｂを半田付け用銀電極
２ａ，２ｂに接続して形成する。Embodiment FIG. 1 shows an example of a humidity sensor produced by a manufacturing method according to an embodiment of the present invention, FIG. 1A is a plan view, and FIG. 1B is a sectional view taken along the line X-X'. .
In FIG. 1, reference numeral 1 denotes an alumina insulating substrate, and silver electrodes 2a and 2b for soldering lead wires 5 and 6 are formed on the upper surface of this alumina insulating substrate 1. Next, comb-shaped carbon electrodes 3a, 3b are connected to soldering silver electrodes 2a, 2b.
次に感湿抵抗膜４を形成するための分散液の製
造方法について述べる。２−ヒドロキシエチルメ
タクリレート143ｇとグリシジルメタクリレート
10.4ｇ（モル比15：１）とをエチルセロソルブ
380ｇに溶解し、アゾビスイソブチロニトリル
1.07gを開始剤として加え、窒素気流下、80℃，
５時間加熱して共重合させた。この共重合体100
ｇに対し、硬化剤ジアミノジフエニルメタン0.2
ｇ〜１ｇ、導電性粉末４ｇ〜６ｇを加え、さらに
ベンジルアルコールを10ｇ〜40ｇ加えて三段ロー
ル機で混合して印刷用ペースト状の分散液を製造
する。 Next, a method for producing a dispersion liquid for forming the moisture-sensitive resistive film 4 will be described. 143g of 2-hydroxyethyl methacrylate and glycidyl methacrylate
10.4g (molar ratio 15:1) and ethyl cellosolve
Dissolved in 380g of azobisisobutyronitrile
Add 1.07g as an initiator and heat at 80℃ under nitrogen stream.
Copolymerization was carried out by heating for 5 hours. This copolymer 100
curing agent diaminodiphenylmethane 0.2
g to 1 g, 4 g to 6 g of conductive powder, and further 10 g to 40 g of benzyl alcohol are added and mixed on a three-roll machine to produce a paste-like dispersion for printing.
このようにして製造したペースト状の分散液
を、前記くし形のカーボン電極３ａ，３ｂが形成
されたアルミナ絶縁基板１の上面にスクリーン版
を用いてスクリーン印刷し、感湿抵抗膜４を形成
し、100℃〜180℃，１時間加熱して反応させる。
その後リード線５，６を半田付け用銀電極２ａ，
２ｂに半田付けして湿度センサを作製した。 The paste-like dispersion liquid produced in this way is screen printed on the upper surface of the alumina insulating substrate 1 on which the comb-shaped carbon electrodes 3a and 3b are formed using a screen plate to form a moisture-sensitive resistive film 4. , heat at 100°C to 180°C for 1 hour to react.
After that, the lead wires 5 and 6 are soldered to the silver electrodes 2a,
2b to produce a humidity sensor.
上記実施例の試料の評価は下記の方法で行つ
た。評価結果を第２図〜第７図に示した。 The samples of the above examples were evaluated by the following method. The evaluation results are shown in FIGS. 2 to 7.
抵抗値の測定は、25℃，50％RH，75％RH，
94％RH，100％RHを測定した。 Measurement of resistance value is at 25℃, 50%RH, 75%RH,
94%RH and 100%RH were measured.
第２図は共重合体100ｇ、導電性粉末５ｇ、ベ
ンジルアルコール20ｇに硬化剤をＡは0.2ｇ，Ｂ
は0.5ｇ，Ｃは１ｇ加えて分散液を製造し、100
℃，１時間加熱して感湿抵抗膜を形成した試料の
相対湿度−抵抗値特性を示す。 Figure 2 shows 100g of copolymer, 5g of conductive powder, 20g of benzyl alcohol, and 0.2g of hardening agent for A and 0.2g for B.
Add 0.5g of C and 1g of C to prepare a dispersion,
The relative humidity-resistance value characteristics of a sample formed into a humidity-sensitive resistive film by heating at ℃ for 1 hour are shown.
第３図は共重合体100ｇ、硬化剤0.5ｇ、ベンジ
ルアルコール20ｇに導電性粉末をＡは４ｇ，Ｂは
５ｇ，Ｃは６ｇ加えて分散液を製造し、100℃，
１時間加熱して感湿抵抗膜を形成した試料の相対
湿度−抵抗値特性を示す。 Figure 3 shows a dispersion prepared by adding 4 g of conductive powder for A, 5 g for B, and 6 g for C to 100 g of copolymer, 0.5 g of curing agent, and 20 g of benzyl alcohol.
The relative humidity-resistance value characteristics of a sample formed by heating for 1 hour to form a humidity-sensitive resistive film are shown.
第４図は共重合体100ｇ、硬化剤0.5ｇ、導電性
粉末５ｇにベンジルアルコールをＡは10ｇ，Ｂは
20ｇ，Ｃは30ｇ，Ｄは40ｇ加えて分散液を製造
し、100℃，１時間加熱して感湿膜を形成した試
料の相対湿度−抵抗値特性を示す。 Figure 4 shows 100g of copolymer, 0.5g of curing agent, 5g of conductive powder, and 10g of benzyl alcohol for A and 10g for B.
20g, 30g for C, and 40g for D were added to prepare a dispersion liquid, and the sample was heated at 100°C for 1 hour to form a moisture sensitive film.
第５図ａは共重合体100ｇ、硬化剤0.2ｇ、導電
性粉末５ｇにベンジルアルコールを10ｇ加えて分
散液を製造したものであり、第５図ｂは共重合体
100ｇ、硬化剤0.5ｇ、導電性粉末５ｇにベンジル
アルコールを30ｇ加えて分散液を製造したもので
ある。それぞれ焼成温度をＡは100℃，Ｂは150
℃，Ｃは180℃，１時間加熱して感湿抵抗膜を形
成した試料の相対湿度−抵抗値特性を示す。 Figure 5a shows a dispersion prepared by adding 10g of benzyl alcohol to 100g of copolymer, 0.2g of curing agent, and 5g of conductive powder, and Figure 5b shows a dispersion of copolymer.
A dispersion was prepared by adding 30 g of benzyl alcohol to 100 g, 0.5 g of curing agent, and 5 g of conductive powder. The firing temperature is 100℃ for A and 150℃ for B.
℃ and C indicate the relative humidity-resistance value characteristics of a sample which was heated at 180℃ for 1 hour to form a moisture-sensitive resistive film.
第６図は第２図Ｂで製造した分散液の保存性を
確認するもので、１は分散液製造日、２は冷暗所
放置３日間、３は冷暗所５日間放置後スクリーン
印刷し、100℃，１時間加熱して感湿抵抗膜を形
成した試料の相対湿度−抵抗値特性を示す。 Figure 6 confirms the storage stability of the dispersion prepared in Figure 2B, where 1 is the day the dispersion was manufactured, 2 is left in a cool and dark place for 3 days, and 3 is screen printed after being left in a cool and dark place for 5 days. The relative humidity-resistance value characteristics of a sample formed by heating for 1 hour to form a humidity-sensitive resistive film are shown.
第７図は第２図Ｂの試料を85℃中に放置した後
の相対湿度−抵抗値特性を示す。 FIG. 7 shows the relative humidity-resistance characteristics after the sample in FIG. 2B was left at 85°C.
第２図〜第５図に示すように、相対湿度−抵抗
値特性は、硬化剤の量とベンジルアルコールの量
をコントロールすることにより大きく変えること
ができる。硬化剤の量は吸湿性樹脂の吸湿率に影
響すると思われる。ベンジルアルコールの量は吸
湿性樹脂と導電性粉末の分散状態および導電性粉
末の粒子間の安定性に影響する。高温での熱処理
でも湿度特性の感度が低下しないのは、硬化剤の
添加量が少ないことと高沸点の溶剤を使用してい
るために共重合体吸湿樹脂が完全に硬化していな
いためと考えられる。第６図に示すように、分散
液を長期冷暗所に放置していても再現性があるこ
とが確認された。第７図に示すように高温放置特
性でも安定している。 As shown in FIGS. 2 to 5, the relative humidity-resistance characteristics can be greatly changed by controlling the amount of curing agent and the amount of benzyl alcohol. The amount of curing agent appears to affect the moisture absorption rate of the hygroscopic resin. The amount of benzyl alcohol affects the dispersion state of the hygroscopic resin and the conductive powder and the interparticle stability of the conductive powder. The reason why the sensitivity of humidity characteristics does not decrease even after heat treatment at high temperatures is thought to be because the copolymer hygroscopic resin is not completely cured due to the small amount of curing agent added and the use of a high boiling point solvent. It will be done. As shown in FIG. 6, it was confirmed that the dispersion was reproducible even if it was left in a cool, dark place for a long period of time. As shown in FIG. 7, it is stable even when left at high temperatures.
結露センサにおいては、常温、94％RHの抵抗
値範囲は2KΩ〜100KΩというのが一般の使用上
の仕様となつている。そのため硬化剤ジアミノジ
フエニルメタンの量は0.2ｇ〜１ｇ、導電性粉末
アセチレンブラツクは４ｇ〜６ｇ、ベンジルアル
コールは10ｇ〜40ｇ（共重合体樹脂100ｇとした
場合）の範囲とする必要がある。ベンジルアルコ
ールの量は、ペースト状の分散液をスクリーン印
刷する場合の作業性にも影響し10ｇ以下になると
不均一な膜ができ、40ｇ以上になるとパターンの
にじみが発生する。以上のように、本実施例によ
れば、感湿抵抗膜をスクリーン印刷を用いて形成
することが出来、これにより湿度センサの小型化
に伴いマスクを用いた塗布、スプレー法で感湿抵
抗膜を形成することが困難となつてきていた問題
が解消されることとなる。 For dew condensation sensors, the resistance value range at room temperature and 94% RH is 2KΩ to 100KΩ for general use. Therefore, the amount of curing agent diaminodiphenylmethane needs to be in the range of 0.2 g to 1 g, the amount of conductive powder acetylene black in the range of 4 g to 6 g, and the amount of benzyl alcohol in the range of 10 g to 40 g (assuming 100 g of the copolymer resin). The amount of benzyl alcohol also affects the workability when screen printing a paste-like dispersion; if it is less than 10 g, an uneven film will be formed, and if it is more than 40 g, the pattern will bleed. As described above, according to this embodiment, it is possible to form a humidity-sensitive resistive film using screen printing, and as a result, with the miniaturization of humidity sensors, the humidity-sensitive resistive film can be formed by coating using a mask or by spraying. This will solve the problem that it has become difficult to form.
発明の効果
以上のように本発明によれば、ペースト状の分
散液の吸湿性樹脂と導電性粉末の分散状態を安定
にし、導電性粉末粒子間の安定が図れ、さらに、
長期保存が可能なため、安定で再現性の高い感湿
抵抗膜をスクリーン印刷法で形成することがで
き、叉、高温加熱でも吸湿性樹脂が完全硬化しな
いので高温放置後の湿度特性の感度が低下せず、
寿命特性の劣化を小さくすることができるなどの
利点を持ち、工業的価値の大なるものである。Effects of the Invention As described above, according to the present invention, the dispersion state of the hygroscopic resin and the conductive powder in the paste-like dispersion can be stabilized, the conductive powder particles can be stabilized, and further,
Since long-term storage is possible, a stable and highly reproducible moisture-sensitive resistive film can be formed by screen printing.Also, since the hygroscopic resin does not completely cure even when heated at high temperatures, the sensitivity of humidity characteristics after being left at high temperatures is reduced. does not decrease,
It has the advantage of being able to reduce deterioration in life characteristics, and is of great industrial value.
第１図は本発明の一実施例の製造方法による湿
度センサを示し、図Ａは平面図、図ＢはＸ−
X′線に沿つた断面図、第２図、第３図、第４図、
第５図、第６図はそれぞれの試料の相対湿度−抵
抗値特性図、第７図は第２図Ｂの試料の試験後の
相対湿度−抵抗値特性およびバラツキを示す図で
ある。
１……アルミナ絶縁基板、２ａ，２ｂ……銀電
極、３ａ，３ｂ……カーボン電極、４……感湿抵
抗膜、５，６……リード線。
FIG. 1 shows a humidity sensor manufactured by a manufacturing method according to an embodiment of the present invention, where FIG. A is a plan view and FIG. B is an X-
Cross-sectional views along the X' line, Figures 2, 3, 4,
5 and 6 are relative humidity-resistance characteristic diagrams of the respective samples, and FIG. 7 is a diagram showing the relative humidity-resistance value characteristic and variation of the sample of FIG. 2B after the test. 1...Alumina insulating substrate, 2a, 2b...Silver electrode, 3a, 3b...Carbon electrode, 4...Moisture-sensitive resistive film, 5, 6...Lead wire.
Claims (1)
シジルメタクリレートとアゾビスイソブチロニト
リルの共重合体吸湿性樹脂100重量部に対し、硬
化剤ジアミノジフエニルメタン0.2〜１重量部と
導電性粉末アセチレンブラツク４〜６重量部を加
え、かつ溶解液ベンジルアルコール10〜40重量部
に溶解して感湿抵抗膜の材料であるペーストと
し、このペーストを少なくとも二対の電極を設け
た絶縁基板上にスクリーン印刷により塗布してか
ら焼成し、感湿抵抗膜を形成することを特徴とす
る湿度センサの製造方法。1 100 parts by weight of copolymer hygroscopic resin of 2-hydroxyethyl methacrylate, glycidyl methacrylate, and azobisisobutyronitrile, 0.2 to 1 part by weight of curing agent diaminodiphenylmethane, and 4 to 6 parts by weight of conductive powder acetylene black. % and dissolve it in 10 to 40 parts by weight of benzyl alcohol to form a paste that is a material for a moisture-sensitive resistive film, and apply this paste by screen printing onto an insulating substrate provided with at least two pairs of electrodes. 1. A method for manufacturing a humidity sensor, the method comprising: forming a moisture-sensitive resistive film by firing the moisture sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60105006A JPS61264244A (en) | 1985-05-17 | 1985-05-17 | Production of humidity sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60105006A JPS61264244A (en) | 1985-05-17 | 1985-05-17 | Production of humidity sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61264244A JPS61264244A (en) | 1986-11-22 |
| JPH0514864B2 true JPH0514864B2 (en) | 1993-02-26 |
Family
ID=14395986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60105006A Granted JPS61264244A (en) | 1985-05-17 | 1985-05-17 | Production of humidity sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61264244A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100449097B1 (en) * | 2001-10-29 | 2004-09-16 | 부산대학교 산학협력단 | method for making humidity sensor with 1,5-diaminonaphthalene polymer to which acetylene carbon black is doped and the sensor made by the method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54149691A (en) * | 1978-05-16 | 1979-11-24 | Matsushita Electric Ind Co Ltd | Moisture detecting element |
| JPS58223739A (en) * | 1982-06-23 | 1983-12-26 | Hitachi Ltd | Humidity-sensitive material for sensor |
| JPS59128439A (en) * | 1983-01-13 | 1984-07-24 | Nisshinbo Ind Inc | Moisture-sensitive resistor |
| JPS59170755A (en) * | 1983-03-16 | 1984-09-27 | Sumitomo Electric Ind Ltd | Humidity detecting sensor element |
| JPS59206753A (en) * | 1983-05-11 | 1984-11-22 | Hitachi Ltd | Humidity sensor |
-
1985
- 1985-05-17 JP JP60105006A patent/JPS61264244A/en active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54149691A (en) * | 1978-05-16 | 1979-11-24 | Matsushita Electric Ind Co Ltd | Moisture detecting element |
| JPS58223739A (en) * | 1982-06-23 | 1983-12-26 | Hitachi Ltd | Humidity-sensitive material for sensor |
| JPS59128439A (en) * | 1983-01-13 | 1984-07-24 | Nisshinbo Ind Inc | Moisture-sensitive resistor |
| JPS59170755A (en) * | 1983-03-16 | 1984-09-27 | Sumitomo Electric Ind Ltd | Humidity detecting sensor element |
| JPS59206753A (en) * | 1983-05-11 | 1984-11-22 | Hitachi Ltd | Humidity sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61264244A (en) | 1986-11-22 |
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