JPH05144858A - Sealing method of semiconductor - Google Patents
Sealing method of semiconductorInfo
- Publication number
- JPH05144858A JPH05144858A JP30578091A JP30578091A JPH05144858A JP H05144858 A JPH05144858 A JP H05144858A JP 30578091 A JP30578091 A JP 30578091A JP 30578091 A JP30578091 A JP 30578091A JP H05144858 A JPH05144858 A JP H05144858A
- Authority
- JP
- Japan
- Prior art keywords
- sealing
- sealing frame
- circuit board
- printed circuit
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント基板に実装し
た半導体を封止樹脂によって封止する半導体の封止方法
に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor sealing method for sealing a semiconductor mounted on a printed board with a sealing resin.
【０００２】[0002]
【従来の技術】図４はプリント基板に実装した半導体の
封止方法の従来例を示す断面図である。2. Description of the Related Art FIG. 4 is a sectional view showing a conventional example of a method for sealing a semiconductor mounted on a printed circuit board.
【０００３】従来は、プラスチック等で一体成型された
固体状の封止枠１の接合部全体に接着剤７を念入りに塗
布して、プリント基板２に直接実装した未封止状態の半
導体３を囲むよう且つプリント基板２と封止枠１との接
合部に隙間が生じないように該封止枠１の接合部をプリ
ント基板２に接着し、封止枠内に液状の封止樹脂４を流
し込み、該封止樹脂４を硬化させて半導体３の封止を行
っていた。Conventionally, an adhesive 7 is carefully applied to the entire joint portion of a solid sealing frame 1 integrally molded of plastic or the like, and an unsealed semiconductor 3 mounted directly on a printed circuit board 2 is provided. The joint portion of the sealing frame 1 is adhered to the printed circuit board 2 so as to surround the joint portion and the joint portion between the printed circuit board 2 and the sealing frame 1, and the liquid sealing resin 4 is placed in the sealing frame. It was poured and the sealing resin 4 was cured to seal the semiconductor 3.
【０００４】[0004]
【発明が解決しようとする課題】然しながら従来の方法
においては、封止枠１の接合部に接着剤の塗りむらがあ
った場合、封止枠１とプリント基板２との接合部に隙間
が生じ、その隙間から封止樹脂が流れ出してしまうこと
があった。又、封止枠１の接合部全面に接着剤５を塗り
むらなく塗布する作業は、非常に手間がかかるという問
題があった。However, in the conventional method, when there is uneven coating of the adhesive at the joint portion of the sealing frame 1, a gap is generated at the joint portion between the sealing frame 1 and the printed circuit board 2. However, the sealing resin may flow out from the gap. Further, there is a problem that the work of applying the adhesive 5 evenly over the entire joint portion of the sealing frame 1 is very troublesome.
【０００５】本発明は上記の問題点を改善するために成
されたもので、その目的とするところは、液状の封止樹
脂が封止枠とプリント基板との接合部から封止枠外に流
出するのを簡単且つ確実に防止すると共に、プリント基
板への封止枠の搭載を容易にした半導体の封止方法を提
供することにある。The present invention has been made in order to solve the above problems, and an object of the present invention is to cause a liquid sealing resin to flow out from a joint between a sealing frame and a printed circuit board to the outside of the sealing frame. It is to provide a semiconductor encapsulation method which can easily and surely prevent the above-mentioned operation and facilitate the mounting of the encapsulation frame on the printed circuit board.
【０００６】[0006]
【課題を解決するための手段】上記の問題点を解決する
ため本発明は、成型されたゲル状の封止枠を、プリント
基板に実装した半導体を囲むよう且つ該プリント基板に
密着するよう該プリント基板に搭載し、該封止枠内に液
状の封止樹脂を流し込み、該封止樹脂を硬化させること
を特徴とするものである。SUMMARY OF THE INVENTION In order to solve the above problems, the present invention relates to a molded gel-like sealing frame so as to surround a semiconductor mounted on a printed circuit board and to closely adhere to the printed circuit board. It is characterized in that it is mounted on a printed circuit board, a liquid sealing resin is poured into the sealing frame, and the sealing resin is cured.
【０００７】[0007]
【作用】上記方法により、液状の封止樹脂が封止枠とプ
リント基板との接合部から封止枠外に流出するのを簡単
且つ確実に防止出来ると共に、プリント基板への封止枠
の搭載が容易に出来る。According to the above method, the liquid sealing resin can be easily and surely prevented from flowing out of the sealing frame from the joint between the sealing frame and the printed circuit board, and the sealing frame can be mounted on the printed circuit board. Easy to do.
【０００８】[0008]
【実施例】以下、本発明実施例に係る半導体の封止方法
を図に基づいて説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A semiconductor encapsulation method according to an embodiment of the present invention will be described below with reference to the drawings.
【０００９】本発明実施例は、図１の平面図及び図２の
断面図に示すように、先ずゲル状に成型した封止枠６
を、プリント基板２に実装した半導体を囲むよう且つ該
封止枠６の接合部が該プリント基板２に密着するよう該
プリント基板２に搭載する。該封止枠６は、硬化剤を含
有したゾル状のシリコンゴムを成型用金型に流し込んで
或る時間が経過した後、該シリコンゴムが硬化すること
によりゲル状に形成されたものである。該封止枠６はゲ
ル状であるので、該プリント基板２の歪みや導電パター
ン７などによる該プリント基板２上の多少の凹凸が該接
合部にあっても隙間なく密着し、該封止枠６と該プリン
ト基板２との密着性は非常に高い。但し、封止枠６とプ
リント基板２との密着性をより高めるために、該封止枠
６と該プリント基板２との接合部の面積は、少なくとも
従来例における封止枠１の接合部の面積よりも大きくす
る。その後、前記封止枠６内に熱硬化性の液状封止樹脂
４を静かに流し込み、該封止樹脂４を加熱により熱硬化
させる。但し、該封止枠６内に液状封止樹脂４を流し込
む際に該封止枠６が動いてしまうこともあるので、該封
止枠６を該プリント基板２に押圧しながら液状封止樹脂
４を流し込んでも良い。そして該封止樹脂４の硬化後、
必要ならば封止枠６を取り外して図３に示すように封止
部分には硬化した封止樹脂４のみが残るようにする。In the embodiment of the present invention, as shown in the plan view of FIG. 1 and the sectional view of FIG.
Is mounted on the printed circuit board 2 so as to surround the semiconductor mounted on the printed circuit board 2 and the bonding portion of the sealing frame 6 is in close contact with the printed circuit board 2. The sealing frame 6 is formed in a gel form by pouring a sol-like silicone rubber containing a curing agent into a molding die and curing the silicone rubber after a certain time has elapsed. . Since the sealing frame 6 is in the form of gel, even if some irregularities on the printed circuit board 2 due to the distortion of the printed circuit board 2 or the conductive pattern 7 and the like are present in the joint portion, the sealing frame 6 closely adheres without any gap, The adhesion between 6 and the printed circuit board 2 is very high. However, in order to further improve the adhesion between the sealing frame 6 and the printed circuit board 2, the area of the joint portion between the sealing frame 6 and the printed circuit board 2 is at least the joint portion of the sealing frame 1 in the conventional example. Make it larger than the area. After that, the thermosetting liquid sealing resin 4 is gently poured into the sealing frame 6, and the sealing resin 4 is heat-cured by heating. However, since the sealing frame 6 may move when the liquid sealing resin 4 is poured into the sealing frame 6, the liquid sealing resin is pressed while pressing the sealing frame 6 against the printed circuit board 2. 4 may be poured. After curing the sealing resin 4,
If necessary, the sealing frame 6 is removed so that only the cured sealing resin 4 remains in the sealing portion as shown in FIG.
【００１０】[0010]
【発明の効果】前述のように本発明の半導体の封止方法
は、成型されたゲル状の封止枠を、プリント基板に実装
した半導体を囲むよう且つ該プリント基板に密着するよ
う該プリント基板に搭載し、該封止枠内に液状の封止樹
脂を流し込み、該封止樹脂を硬化させるため、液状の封
止樹脂が封止枠とプリント基板との接合部から封止枠外
に流出するのを簡単且つ確実に防止出来る。又、プリン
ト基板への封止枠の搭載が容易に出来ると共に、必要な
らば封止枠を容易に取り外すことが出来る。As described above, according to the semiconductor sealing method of the present invention, the molded gel-like sealing frame surrounds the semiconductor mounted on the printed circuit board and adheres to the printed circuit board. The liquid sealing resin flows out from the joint between the sealing frame and the printed circuit board to the outside of the sealing frame in order to cure the sealing resin by pouring the liquid sealing resin into the sealing frame. Can be easily and surely prevented. Further, the sealing frame can be easily mounted on the printed circuit board, and the sealing frame can be easily removed if necessary.
【図１】本発明実施例の封止枠６の取付け状態を示す平
面図。FIG. 1 is a plan view showing a mounting state of a sealing frame 6 according to an embodiment of the present invention.
【図２】本発明実施例の封止枠６の取付け状態を示す断
面図。FIG. 2 is a cross-sectional view showing a mounting state of the sealing frame 6 according to the embodiment of the present invention.
【図３】本発明実施例において、封止樹脂４の硬化後、
封止枠６を取り去った状態を示す断面図。FIG. 3 is a diagram showing an embodiment of the present invention, after the sealing resin 4 is cured,
Sectional drawing which shows the state which removed the sealing frame 6. FIG.
【図４】従来例を示す断面図。FIG. 4 is a sectional view showing a conventional example.
２ プリント基板 ３ 半導体 ４ 封止樹脂 ６ 封止枠 2 Printed circuit board 3 Semiconductor 4 Sealing resin 6 Sealing frame
Claims (1)
基板に実装した半導体を囲むよう且つ該プリント基板に
密着するよう該プリント基板に搭載し、該封止枠内に液
状の封止樹脂を流し込み、該封止樹脂を硬化させる半導
体の封止方法。1. A molded gel-like sealing frame is mounted on the printed circuit board so as to surround a semiconductor mounted on the printed circuit board and in close contact with the printed circuit board, and a liquid sealing is performed in the sealing frame. A semiconductor encapsulation method in which a resin is poured and the encapsulation resin is cured.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30578091A JPH05144858A (en) | 1991-11-21 | 1991-11-21 | Sealing method of semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30578091A JPH05144858A (en) | 1991-11-21 | 1991-11-21 | Sealing method of semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05144858A true JPH05144858A (en) | 1993-06-11 |
Family
ID=17949264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30578091A Pending JPH05144858A (en) | 1991-11-21 | 1991-11-21 | Sealing method of semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05144858A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10624248B2 (en) | 2016-04-08 | 2020-04-14 | Samsung Electronics Co., Ltd. | EMI shielding structure and manufacturing method therefor |
-
1991
- 1991-11-21 JP JP30578091A patent/JPH05144858A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10624248B2 (en) | 2016-04-08 | 2020-04-14 | Samsung Electronics Co., Ltd. | EMI shielding structure and manufacturing method therefor |
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