JPH0513925A - Thick film circuit forming method - Google Patents

Abstract

PURPOSE:To shorten the time required for simultaneous manufacture of a plurality of multilayer coating substance when a thick film circuit is formed. CONSTITUTION:A specific interval is maintained between a nozzle 2 and the surface 3 to be coated by stylus, and a multilayer coating operation is conducted simultaneously by moving the nozzle 2 while coating materials 1a and 1b are being discharged.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a thick film circuit which constitutes an electronic circuit or the like.

[0002]

2. Description of the Related Art A conventional method for forming a thick film circuit will be described below with reference to the drawings. FIG. 3 is a schematic view of a drawing apparatus, and FIG. 4 is a process drawing of a conventional drawing method. In FIG. 3, 1c is a coating material for forming a circuit, 2 is a nozzle, 3 is a surface to be coated,
Reference numeral 4c is compressed air, and 5 is a stylus. The stylus 5 keeps the distance between the nozzle 2 and the surface 3 to be coated constant, and the compressed air 4c moves and draws the coating substance 1c while discharging. After drawing, as shown in FIG. 4, a drying process,
After the firing process, the same process is repeated by the number of layers to form a circuit.

[0003]

However, in the above method, as shown in the process diagram of FIG. 4, when a circuit having a plurality of layers is formed, the drawing process, the drying process, and the firing process must be repeated by the number of layers. The problem is that the lead time for circuit formation is long.

In order to solve this problem, the present invention provides a method for forming a thick film circuit which can significantly reduce the lead time.

[0005]

In order to achieve the above object, the present invention comprises a step of simultaneously forming a plurality of coating substances in multiple layers on the surface to be coated.

[0006]

According to the present invention, since a plurality of coating substances can be simultaneously formed in multiple layers on the surface to be coated, the lead time for circuit formation can be greatly shortened.

[0007]

1 is a schematic view of a drawing apparatus according to an embodiment of the present invention. In the figure, 1a and 1b are coating substances for forming circuits, 2 is a nozzle, 3 is a surface to be coated, 4a and 4a.
b is compressed air, and 5 is a stylus. The stylus 5 keeps the distance between the nozzle 2 and the surface 3 to be coated constant, and the compressed air 4a, 4b applies the coating substances 1a, 1b.
Move and draw while ejecting. The inside of the nozzle 2 is divided into two parts, and independent coating substances 1a and 1b and compressed air 4a and 4b can be used. In FIG. 1, the coating substance 1b is applied by compressed air 4b
The applied substance 1a is ejected earlier than a, and the compressed substance 4a is ejected later with the compressed air 4a. Therefore, after drawing the coating substance 1b, the coating substance 1a is drawn on the upper layer.
The coating substances 1a and 1b forming the thick film circuit may be any substance such as thick film conductor paste and resin.

The coated surface may be of any type, such as a ceramic substrate or a TAB tape. The circuit to be formed can be formed in any pattern such as a thick film circuit. Further, in the present embodiment, two layers are formed, but the case of two or more layers can also be achieved by changing the division inside the nozzle 2. According to the present embodiment, the process as shown in FIG. 2 is performed, and a plurality of layers can be formed at the same time, so that the lead time for circuit formation can be significantly shortened.

[0009]

As is apparent from the above description, according to the present invention, since there is a step of simultaneously forming a plurality of substances in multiple layers on the surface to be coated, the lead time for circuit formation is greatly reduced. can do.

[Brief description of drawings]

FIG. 1 is a schematic sectional view of a drawing apparatus in an embodiment of thick film circuit formation according to the present invention.

FIG. 2 is a process diagram in an example of forming a thick film circuit according to the present invention.

FIG. 3 is a schematic sectional view of a conventional drawing apparatus for forming a thick film circuit.

FIG. 4 is a process diagram of conventional thick film circuit formation.

[Explanation of symbols]

 1a Coating substance 1b Coating substance 2 Nozzle 3 Surface to be coated 4a Compressed air 4b Compressed air 5 Stylus

Claims (1)

Claim: What is claimed is: 1. A method for forming a thick film circuit in which a plurality of coating substances are simultaneously ejected from a plurality of nozzles to simultaneously form a plurality of coating substances on a surface to be coated in multiple layers.