JPH0513785A - Manufacture of optical semiconductor device - Google Patents
Manufacture of optical semiconductor deviceInfo
- Publication number
- JPH0513785A JPH0513785A JP3160352A JP16035291A JPH0513785A JP H0513785 A JPH0513785 A JP H0513785A JP 3160352 A JP3160352 A JP 3160352A JP 16035291 A JP16035291 A JP 16035291A JP H0513785 A JPH0513785 A JP H0513785A
- Authority
- JP
- Japan
- Prior art keywords
- optical semiconductor
- semiconductor element
- brazing material
- stem
- center
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Light Receiving Elements (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、光半導体装置の製造方
法、特に、光半導体素子パッケージのステムの中心部に
光半導体素子を固着する方法の改良に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an optical semiconductor device, and more particularly to an improvement of a method of fixing an optical semiconductor element to the center of a stem of an optical semiconductor element package.
【０００２】[0002]
【従来の技術】例えば、モジュール構造の受光装置の場
合、図３に示すように光ファイバ11とレンズ12とが組み
込まれたモジュールＡと受光素子パッケージ13が組み込
まれたモジュールＢとが相互に連結されるが、光ファイ
バ11によって導かれる光の中心と受光素子パッケージ13
の中心とが相互に一致するように高精度をもって組み立
てられている。2. Description of the Related Art For example, in the case of a light receiving device having a module structure, as shown in FIG. 3, a module A in which an optical fiber 11 and a lens 12 are incorporated and a module B in which a light receiving element package 13 is incorporated are connected to each other. However, the center of the light guided by the optical fiber 11 and the light receiving element package 13
It is assembled with high precision so that the center of each of them coincides with each other.
【０００３】図４に受光素子パッケージ13のステム部分
の構成図を示す。図において、１は光半導体素子２を支
持する支持面３を有する支持部材であり、光半導体素子
２の一方のリードの役を兼ねている。４はもう一方のリ
ードであり、ワイヤ５をもって光半導体素子２と接続さ
れている。６は支持部材（リード兼用）１とリード４と
をガラス絶縁材７を介して固定する固定部材である。FIG. 4 is a block diagram of the stem portion of the light receiving element package 13. In the figure, reference numeral 1 is a supporting member having a supporting surface 3 for supporting the optical semiconductor element 2, and also serves as one lead of the optical semiconductor element 2. Reference numeral 4 denotes the other lead, which is connected to the optical semiconductor element 2 through the wire 5. A fixing member 6 fixes the support member (also serving as a lead) 1 and the lead 4 via a glass insulating material 7.
【０００４】前記のように、光ファイバ11によって導か
れる光の中心と受光素子パッケージ13の中心とが一致す
るように精度よく形成されていれば、ステムの支持部材
１の受光素子支持面３の中心に光ファイバ11によって導
かれた光が照射されることになる。したがって、この支
持面３の中心と受光素子２の中心とが一致するように受
光素子２を支持面３上に固着しなければ光結合性が悪く
なる。As described above, if the center of the light guided by the optical fiber 11 and the center of the light receiving element package 13 are accurately formed so as to coincide with each other, the light receiving element supporting surface 3 of the supporting member 1 of the stem can be formed. The light guided by the optical fiber 11 is emitted to the center. Therefore, if the light receiving element 2 is not fixed on the supporting surface 3 so that the center of the supporting surface 3 and the center of the light receiving element 2 coincide with each other, the optical coupling property is deteriorated.
【０００５】そのために、ステムの支持部材１の上部に
設けられた支持面３に予め基準マークを正確に刻印し、
受光素子２をその基準マークに位置合わせして支持面３
上に載置し、鑞付けしている。For that purpose, a reference mark is accurately engraved in advance on the support surface 3 provided on the upper part of the support member 1 of the stem,
The light receiving element 2 is aligned with the reference mark and the supporting surface 3
It is placed on top and brazed.
【０００６】[0006]
【発明が解決しようとする課題】ところで、ステムの受
光素子支持面３上に刻印された基準マークに受光素子２
を精度よく位置合わせして固着するには熟練した作業者
を必要とする。また、自動機を導入する場合には、パタ
ーン認識技術の限界から十分な位置合わせ精度が得られ
ず、かつ、経済的負担が増加し、作業時間も長いといっ
た問題がある。By the way, the light receiving element 2 is attached to the reference mark imprinted on the light receiving element supporting surface 3 of the stem.
A skilled worker is required to accurately align and fix the. Further, when an automatic machine is introduced, there is a problem that sufficient alignment accuracy cannot be obtained due to the limitation of pattern recognition technology, and the economical burden is increased and the working time is long.
【０００７】本発明の目的は、この欠点を解消すること
にあり、簡便に、迅速に、かつ、高い精度をもって光半
導体素子をステムの光半導体素子支持面中央に固着する
方法を提供することにある。An object of the present invention is to eliminate this drawback, and to provide a method of simply, quickly and highly accurately fixing an optical semiconductor element to the center of the optical semiconductor element supporting surface of the stem. is there.
【０００８】[0008]
【課題を解決するための手段】上記の目的は、上部に光
半導体素子（２）を支持する支持面（３）が形成され、
中心部に貫通孔（10）が形成されている支持部材（１）
を有する光半導体素子パッケージ用ステムの前記の支持
面（３）上に鑞材（９）を溶融させて載置し、この溶融
状態の鑞材（９）上に光半導体素子（２）を浮遊的に載
置し、次いで、前記の貫通口（10）を介して前記の溶融
状態の鑞材（９）を吸引して冷却・固化し、前記の光半
導体素子（２）を前記の支持面（３）の中心部に固着す
る工程を有する光半導体装置の製造方法によって達成さ
れる。The above-mentioned object is to provide a supporting surface (3) for supporting an optical semiconductor element (2) on the upper portion,
Support member (1) having a through hole (10) formed in the center
The brazing material (9) is melted and placed on the supporting surface (3) of the stem for optical semiconductor element package having the optical semiconductor element package, and the optical semiconductor element (2) is floated on the brazing material (9) in the molten state. And then the molten brazing material (9) is sucked through the through hole (10) to cool and solidify the optical semiconductor element (2) to the supporting surface. This is achieved by the method for manufacturing an optical semiconductor device including the step of fixing to the center of (3).
【０００９】[0009]
【作用】図１を参照して作用を説明する。図１（ａ）に
示すように、ステムの支持部材１の上部に形成されてい
る光半導体素子支持面３上に鑞材を載置してヒータ８を
もって溶融すると、溶融した鑞材９は表面張力によって
支持面３上に盛り上った状態となる。The operation will be described with reference to FIG. As shown in FIG. 1A, when the brazing material is placed on the optical semiconductor element supporting surface 3 formed on the support member 1 of the stem and melted by the heater 8, the molten brazing material 9 is It is in a state of being raised on the support surface 3 due to the tension.
【００１０】この盛り上っている鑞材９の上に光半導体
素子２を載置する場合、図１（ｂ）に破線で示すよう
に、中心を外れて載置したとしても、表面張力によって
実線で示すように支持面３の中心上に自動的に移動す
る。When the optical semiconductor element 2 is mounted on the raised brazing material 9, even if the optical semiconductor element 2 is mounted off the center as shown by the broken line in FIG. It automatically moves to the center of the support surface 3 as shown by the solid line.
【００１１】ステムの支持部材１の中心に形成されてい
る貫通孔10を介して吸引すると図１（ｃ）に示すよう
に、光半導体素子支持面３上の鑞材９は中心孔10内に吸
引され、光半導体素子２は支持面３の中央部に密接す
る。その状態で加熱を停止すれば鑞材は固化し、光半導
体素子２はステムの光半導体素子支持面３の中央に精度
よく固着される。When suction is performed through the through hole 10 formed in the center of the support member 1 of the stem, the brazing material 9 on the optical semiconductor element supporting surface 3 is inserted into the center hole 10 as shown in FIG. 1 (c). As a result, the optical semiconductor element 2 comes into close contact with the central portion of the support surface 3. If heating is stopped in that state, the brazing material is solidified, and the optical semiconductor element 2 is accurately fixed to the center of the optical semiconductor element supporting surface 3 of the stem.
【００１２】[0012]
【実施例】以下、図面を参照して、本発明の要旨に係る
光半導体素子パッケージのステムに形成された光半導体
素子支持面中央に光半導体素子を固着する方法について
説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method of fixing an optical semiconductor element to the center of an optical semiconductor element supporting surface formed on a stem of an optical semiconductor element package according to the gist of the present invention will be described below with reference to the drawings.
【００１３】図２に、光半導体素子用パッケージ（ＣＡ
Ｎタイプ）のステム部分の構成図を示す。図中、図４で
示したものと同一のものは同一記号で示してあり、10は
支持部材１の中心に形成された貫通孔である。このステ
ムの光半導体素子支持面３上に十分な量の鑞材を載置し
てヒータ加熱または誘導加熱によって溶融する。図１
（ｂ）に示すように、表面張力によって盛り上っている
溶融状態の鑞材９の上に光半導体素子２を載置すると、
表面張力によって光半導体素子２は盛り上っている溶融
状態の鑞材９の中央に自動的に移動する。FIG. 2 shows a package for an optical semiconductor device (CA
The structural drawing of the stem part of (N type) is shown. In the figure, the same components as those shown in FIG. 4 are designated by the same symbols, and 10 is a through hole formed in the center of the supporting member 1. A sufficient amount of brazing material is placed on the optical semiconductor element supporting surface 3 of this stem and melted by heater heating or induction heating. Figure 1
As shown in (b), when the optical semiconductor element 2 is mounted on the brazing material 9 in a molten state which is raised by surface tension,
Due to the surface tension, the optical semiconductor element 2 automatically moves to the center of the raised molten brazing material 9.
【００１４】図１（ｃ）に示すように、貫通孔10を介し
て吸引すると、余剰の鑞材９は貫通孔10内に吸引され、
光半導体素子２は支持面３の中央に密接する。この状態
で加熱を停止すれば、鑞材は固化し、光半導体素子２は
支持面３の中央に精度よく固着される。最後に、光半導
体素子２とリード４とをワイヤ５をもって接続し光半導
体素子パッケージのステム部分を完成する。As shown in FIG. 1 (c), when suction is performed through the through hole 10, the surplus brazing material 9 is sucked into the through hole 10,
The optical semiconductor element 2 is in close contact with the center of the support surface 3. If the heating is stopped in this state, the brazing material is solidified and the optical semiconductor element 2 is accurately fixed to the center of the supporting surface 3. Finally, the optical semiconductor element 2 and the lead 4 are connected with the wire 5 to complete the stem portion of the optical semiconductor element package.
【００１５】[0015]
【発明の効果】以上説明したとおり、本発明に係る光半
導体装置の製造方法においては、ステムの光半導体素子
支持面上に鑞材を載置して溶融し、溶融状態の鑞材の上
に光半導体素子を浮遊的に載置すると、表面張力によっ
て光半導体素子は光半導体素子支持面の中心上に移動す
る。そこで支持部材に形成されている貫通孔を介して溶
融状態の鑞材を吸引し固化すれば、極めて簡便に、迅速
に、高い精度をもって光半導体素子をステムの光半導体
素子支持面の中心に固着することができ、受光装置の光
結合性向上に寄与するところが大きい。As described above, in the method of manufacturing an optical semiconductor device according to the present invention, the brazing material is placed on the optical semiconductor element supporting surface of the stem and melted, and the brazing material in the molten state is placed on the melting surface. When the optical semiconductor element is placed floating, the optical semiconductor element moves to the center of the optical semiconductor element supporting surface due to the surface tension. Therefore, if the molten brazing material is sucked and solidified through the through hole formed in the support member, the optical semiconductor element is fixed to the center of the optical semiconductor element supporting surface of the stem extremely easily, quickly and with high accuracy. It is possible to improve the optical coupling of the light receiving device.
【図１】本発明の原理説明図である。FIG. 1 is a diagram illustrating the principle of the present invention.
【図２】本発明に係る光半導体素子パッケージのステム
の構成図である。FIG. 2 is a configuration diagram of a stem of an optical semiconductor device package according to the present invention.
【図３】モジュール構造の受光装置の構成図である。FIG. 3 is a configuration diagram of a light receiving device having a module structure.
【図４】従来技術に係る光半導体素子パッケージのステ
ムの構成図である。FIG. 4 is a configuration diagram of a stem of an optical semiconductor device package according to a conventional technique.
１ 支持部材（リード兼用） ２ 光半導体素子 ３ 支持面 ４ リード ５ ワイヤ ６ 固定部材 ７ ガラス絶縁部材 ８ ヒータ ９ 鑞材 10 貫通口 1 Support member (also used as lead) 2 Optical semiconductor element 3 Support surface 4 Lead 5 Wire 6 Fixing member 7 Glass insulating member 8 Heater 9 Brazing material 10 Through hole
Claims (1)
持面（３）が形成され、中心部に貫通孔（10）が形成さ
れてなる支持部材（１）を有する光半導体素子パッケー
ジ用ステムの前記支持面（３）上に鑞材（９）を溶融さ
せて載置し、 該溶融状態の鑞材（９）上に光半導体素子（２）を浮遊
的に載置し、 前記貫通口（10）を介して前記溶融状態の鑞材（９）を
吸引して冷却・固化し、前記光半導体素子（２）を前記
支持面（３）の中心部に固着する工程を有することを特
徴とする光半導体装置の製造方法。Claim: What is claimed is: 1. A support member (1) comprising a support surface (3) for supporting an optical semiconductor element (2) and a through hole (10) in the center thereof. The brazing material (9) is melted and placed on the supporting surface (3) of the stem for optical semiconductor element package, and the optical semiconductor element (2) is floated on the brazing material (9) in the molten state. It is placed, and the molten brazing material (9) is sucked through the through hole (10) to be cooled and solidified, and the optical semiconductor element (2) is fixed to the central portion of the support surface (3). A method of manufacturing an optical semiconductor device, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3160352A JPH0513785A (en) | 1991-07-01 | 1991-07-01 | Manufacture of optical semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3160352A JPH0513785A (en) | 1991-07-01 | 1991-07-01 | Manufacture of optical semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0513785A true JPH0513785A (en) | 1993-01-22 |
Family
ID=15713122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3160352A Withdrawn JPH0513785A (en) | 1991-07-01 | 1991-07-01 | Manufacture of optical semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0513785A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8419308B2 (en) | 2006-03-27 | 2013-04-16 | Sekisui Seikei, Ltd. | Document fastener and file or folder |
-
1991
- 1991-07-01 JP JP3160352A patent/JPH0513785A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8419308B2 (en) | 2006-03-27 | 2013-04-16 | Sekisui Seikei, Ltd. | Document fastener and file or folder |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19981008 |