JPH051364Y2 - - Google Patents

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a mold, particularly a mold temperature measuring device for measuring the temperature inside the mold cavity of the mold.

(Prior Art) A conventional molding die temperature measuring device is, for example, as shown in FIG. 2 or FIG.
A conventional mold temperature measuring device 100 is shown in Fig. 3. This mold temperature measuring device 100 measures the temperature inside a molding cavity 101 and controls the vulcanization temperature suitable for the material to be vulcanized in the molding cavity 101. This mold temperature measuring device 100 is installed in an upper mold 102 or a lower mold 103.
The mold temperature measuring device 100 is inserted into a hole 104 provided on approximately the central axis of the molding cavity 101 of the mold cavity 103. The tip of the hole 104 is spaced from the molding cavity 101 by a distance of 1 mm to several mm. Therefore, when the mold temperature measuring device 100 is inserted into the hole 104, the junction for detecting heat arranged at the tip of the protective tube-equipped thermocouple is located 1 mm to several mm away from the molding cavity 101 to be measured.
It is now placed in the location.

(Problems to be Solved by the Invention) However, when such a mold temperature measuring device is used, it has the following drawbacks. That is,
Since the distance T between the molding cavity 101 and the temperature measuring part of the molding mold temperature measuring device 100 inserted into the hole 104 is 1 mm to several mm, there is no heat while the heat is being conducted from the molding cavity 101 to the temperature measuring device 100. Losses occur and the heat within mold cavity 101 is not accurately transferred to temperature measuring device 100 .

Furthermore, since there is a distance between the aforementioned molding cavity 101 and the molding mold temperature measuring device 100, if a change in temperature occurs in the molding cavity 101, the temperature change cannot be detected immediately; However, since the change is detected only after that, there is a delay in detecting the detected temperature.

The present invention was made in order to solve the above-mentioned problems of the conventional technology, and its purpose is to make it possible to measure the temperature of the temperature measurement object as close as possible to the temperature measurement object in the molded cavity. It is an object of the present invention to provide a mold temperature measuring device that can accurately and quickly detect the temperature inside a molding cavity, improve the precision of vulcanization and molding operations, and improve the quality of products.

(Means for Solving the Problems) According to the present invention having the above object, a plating layer formed in a molding cavity of a mold, and a hole communicating from the outside of the mold to the plating layer. and a thermocouple disposed within the plating layer, the strands of which are in contact with the plating layer.

(Function) A hole is provided that communicates from the outside of the mold to the molding cavity. Insert the thermocouple with the joint section cut into the hole. Polish the inner surface of the molded cavity. Thereafter, a chrome layer is plated on the inner surface of the molded cavity. The wire of the thermocouple contacts the plating layer, and the thermocouple circuit is formed by the wire and the plating layer.
Since the plating layer is extremely thin, no heat loss occurs in the temperature of the vulcanized and molded material housed in the molding cavity and whose temperature is to be measured. Furthermore, when the temperature of the vulcanized/molded material changes, heat conduction occurs only through the thin plating layer, so the speed at which heat is transferred becomes much faster than in the past.

(Example) The present invention will be explained below based on the illustrated example. Figure 1 shows a mold temperature measuring device 1 according to the present invention.
shows. In this embodiment, the mold temperature measuring device 1 provided in the lower mold 20 will be particularly described.

The main body of the temperature measuring device 1 is composed of a thermocouple 2. Thermocouple 2 is preferably a chromel-alumel thermocouple. The outer cylinder portion of the thermocouple 2 is protected by a cylindrical protection tube 3. An insulating layer 4 formed of ceramic or the like inside the protective tube 3
is located. The wire 5 of the thermocouple 2 is arranged inside the insulating layer 4. The wire 5 is cut at the joint at one end. Therefore, at one end, the protective tube 3, the insulating layer 4, and the wire 5 are arranged concentrically, and in particular, the wire 5 is exposed. The other end of the wire 5 is connected to a lead wire (not shown), and the lead wire is guided to the outside of the mold through a hole 6 provided in the lower mold 20 and connected to the temperature measuring device 1. The generated voltage change is transmitted to an externally located meter (not shown). The tip of the protection tube 3 is fitted into a bush 7 that accommodates the tip of the protection tube 3. A bushing hole 8 into which the bushing 7 to which the protective tube 3 is attached is press-fitted is formed in the lower die 20 at the same time as the hole 6 is formed. Next, the bush 7 into which the thermocouple 2 with the tip end cut off is fitted is press-fitted into the bush hole 8. After polishing the mold cavity side surface 9 of the mold, a hard chrome plating layer 10 is formed. When the chrome plating layer 10 is formed, the surface of the chrome plating layer 10 on the lower die side, the lower die 20, the bush 7, the protection tube 3, the insulating layer 4, the wire 5
one end of the two contacts. The electrical circuit of the thermocouple 2 is constructed by the contact between the chrome plating layer 10 and the wire 5. As a result, when the temperature of the chrome plating 10 changes due to a temperature change inside the molded cavity, the temperature change at the end of the chrome plating layer 10 and the wire 5 can be detected by the temperature measuring device 1, and the temperature change in the molded cavity It becomes possible to measure the temperature at the interface between the temperature measurement target and the plating layer.

Next, a method of manufacturing the mold temperature detection device according to the present invention will be explained. The protective tube 3 of the thermocouple 2 is cut near the tip to expose the strands 5 of the thermocouple 2 inside the protective tube 3.

On the other hand, communication holes 6 communicating from the outside of the mold to the mold cavity of the mold are formed in the upper and lower molds 20 of the mold, and at the same time, bush holes 8 are formed at the ends of the communication holes 6.

Next, the tip of the protective tube 3 of the thermocouple 2 is fitted into a bush 7 which has been processed in advance, and is press-fitted into the bush hole 8 while being fitted. Bushiyu 7 is Bushiyu 7
When the end face of the bushing hole 8 comes into contact with the end face of the bushing hole 8, the entry into the bushing hole 8 is stopped.

After the bush 7 is press-fitted into the bush hole 8, in order to make the end face of the bush 7 on the forming cavity side and the end face of the lower mold on the mold cavity side flat, a surface 9 of the bush 7 and the mold cavity side of the lower mold 20 is made. Polish.

After that, a thickness of 10 μm was applied to the surface 9 on the side of the molding cavity.
A plating layer 10 is formed by applying hard chrome plating to a certain degree. As a result, the plating layer 10 fixes the bushing 7 fitted with the protective tube 3 in the bushing hole 8, and also contacts the lower die 20, the bushing 7, the protective tube 3, the insulating layer 4, and the wire 5. The wire 5 and the thermocouple 2 constitute an electric circuit. Although the temperature measuring device 1 attached to the lower die 20 has been described so far, the structure and manufacturing method of the temperature measuring device 1 attached to the upper die are exactly the same.

In addition, since the plating layer 10 is made of hard chrome,
Since high rigidity is obtained, the plating layer 10 will not be deformed even if the molding pressure in the mold cavity increases during vulcanization and molding. Therefore, no force is applied to the joint of the thermocouple 2,
It can withstand use over a long period of time, and can perform stable temperature measurements over a long period of time.

In this way, since the wire of the thermocouple is in contact with the plating layer, heat loss and delays in heat conduction occur when there is a gap between the thermocouple's temperature measuring part and the molded cavity. Never. Therefore, since accurate temperature control suitable for the material to be vulcanized can be performed, molded products with improved quality can be provided.

(Effects of the invention) According to the invention, the strands are formed in the cavity of the mold and have a plating layer in the hole communicating from the outside of the mold to the molding cavity so that the strands come into contact with the plating layer. Because it has a thermocouple placed at
Since the temperature of the object to be measured inside the molding cavity can be measured accurately and quickly, the accuracy of vulcanization and molding operations can be increased depending on the vulcanized and molded products placed in the mold, thereby improving product quality. can be done.

[Brief explanation of the drawing]

Fig. 1 is a longitudinal sectional view of a mold temperature measuring device according to the present invention, Fig. 2 is a longitudinal sectional view showing the position of a mold temperature measuring device according to the prior art in a mold, and Fig. 3 is a longitudinal sectional view of a mold temperature measuring device according to the prior art. FIG. 3 is an enlarged longitudinal cross-sectional view of the mold temperature measuring device. Explanation of symbols, 1... Molding mold temperature measuring device, 2...
...Thermocouple, 3...Protection tube, 4...Insulating layer, 5...
Element wire, 6...hole, 7...button, 8...button hole, 10...chrome plated layer.

Claims (1)

[Claims for Utility Model Registration] (1) The strands are arranged in a plating layer formed in the molding cavity of the mold and in a hole communicating from the outside of the mold to the plating layer. A mold temperature measuring device comprising: a thermocouple in contact with a layer. (2) The mold temperature measuring device according to claim 1, wherein the plating layer is formed of hard chromium. (3) The mold temperature measuring device according to claim 1 or 2, wherein the thermocouple is a chromel-alumel thermocouple.