JPH0513640A - Lead pin plating jig for integrated circuit package - Google Patents

Abstract

PURPOSE:To surely perform uniform electric plating by constituting a jig of a thin plate which has openings for inserting the tips of many integrated circuit package lead pins which are arranged and fixed at the fixed intervals longitudinally and latitudinally and composing the thin plate of shape memory alloy. CONSTITUTION:A lead pin plating jig 8 is composed of Ti-Ni monidirectional shape memory alloy which completely inverts the shape at a low temperature and a high temperature. Namely, the lead pin plating jig 8 is composed of a thin plate which has openings 7 for inserting the many tips of the lead pins 3 of an integrated circuit package 2, which are arranged and fixed at the fixed intervals longitudinally and latitudinally. The thin plate is composed of the shape memory alloy. Therefore, since the openings 7 are opened and closed by changing the temperature, the many pins 3 can be inserted and pulled out without load and the operation is facilitated. Thus, uniform current flows to the all lead pins 3 and uniform electric plating is performed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead pin plating jig as a current-carrying electrode used for electroplating Ni, Au or the like on a lead pin of an integrated circuit package.

[0002]

2. Description of the Related Art Lead pins of integrated circuit packages are electroplated with Ni, Au or the like in order to improve corrosion resistance. Conventionally, integrated circuit packages, especially several tens to
When electroplating Ni, Au, etc., on the lead pins of a PGA (pin grid array) type package having several hundreds of lead pins, as shown in FIG. 2 is brazed or soldered to the side surface to form a common electrode, or a thin plate 4 made of Ni, stainless steel, or the like is brazed or soldered to the tip of the lead pin 3 of the package 2 to form a common electrode as shown in FIG. Alternatively, as shown in FIG. 8, the common electrode is pressed against the terminal portion 5 of the package 2 for bonding the Au wire or the Al wire for taking out a signal from the semiconductor chip.

By the way, in the method shown in FIGS. 6 and 7, it takes time and effort to attach and detach the electrodes before and after plating. Moreover, it is necessary to modify the part after removing. In the method of FIG. 8, there is a possibility that the terminal portion 5 of the package 2 that requires the most reliability for bonding the Au wire and the Al wire in the subsequent step may be scratched or soiled, and all the lead pins 3 should be surely supplied with current. It is difficult to make a flowable connection, and lead pins with defective plating may occur.

[0004]

Therefore, according to the present invention, it is possible to surely contact all the lead pins to pass an electric current,
Moreover, it is an object of the present invention to provide a lead pin plating jig as a current-carrying electrode that is easy to insert and remove and does not scratch or stain the lead pin.

[0005]

To solve the above problems, a jig for plating lead pins of an integrated circuit package according to the present invention is an opening for inserting the tips of lead pins of an integrated circuit package in which a large number of fixed and arranged vertical and horizontal arrays are fixed. A thin plate having a portion, and the thin plate is made of a shape memory alloy.

This lead pin plating jig may have a noble metal or an alloy mainly composed of a noble metal coated on the entire surface or a contact portion with the lead pin.

These lead pin plating jigs are
The lead pin contact part of the opening of the shape memory alloy thin plate is bent to the lower surface side, and the bending angle is changed by changing the ambient temperature at the time of lead pin plating from low temperature to high temperature or from high temperature to low temperature. Some are done.

[0008]

As described above, the jig for plating lead pins according to the present invention is made of a thin plate having an opening into which the tips of a large number of lead pins are inserted. Since the thin plate is made of a shape memory alloy, the opening can be changed by changing the temperature. Since it opens and closes, many lead pins can be inserted and removed without load, making it easy to work, and the lead pins do not get scratched or dirty. In addition, a large number of lead pins can be simultaneously brought into contact with each other with a constant force, an electric current can be evenly applied to all the lead pins, and uniform electroplating can be performed. Further, in the above-mentioned jig for lead pin plating of the present invention, in the case where the entire surface or the contact portion with the lead pin is coated with a noble metal or an alloy mainly containing a noble metal, the contact resistance with the lead pin is small, and at the time of electroplating. Electricity is well supplied and high quality electroplating is performed. The coating may be dry plating, wet plating or the like, or may be a composite with a clad or the like. Further, in the lead pin plating jig of the present invention, the lead pin contact portion of the opening of the shape memory alloy thin plate is bent to the lower surface side, and this bent portion changes the ambient temperature at the time of lead pin plating from low temperature to high temperature or from high temperature. In the case where the bending angle is changed by changing to a low temperature, many lead pins are securely inserted and removed and held in contact with each other, which may damage the lead pins or damage the plating jig. Without doing
Good electroplating.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a jig for plating lead pins of an integrated circuit package of the present invention will be described with reference to the drawings. It consists of a Ti-Ni omnidirectional shape memory alloy whose shape is completely reversed at low and high temperatures, with a thickness of 0.25 mm and a side length of 100 as shown in Fig. 1.
Using a square thin plate 6 of mm, a high temperature storage treatment was carried out at 250 ° C. for 1 hour in a flat state, and then Cu and Ni strike plating was applied to the entire surface, and further Pt plating of 1 μm was applied.
After that, as shown in FIG. 2 and FIG. 3, after forming the H-shaped opening 7 with the middle both sides bent to the lower surface side at a constant interval of 20 in length and 20 in width according to the pitch of the lead pin, 400 in total, A low temperature memory treatment was performed at -40 ° C for 12 hours. The lead pin plating jig 8 thus prepared was prepared in advance at 0 ° C.
After confirming that the opening 7 is fully opened, the lead pin 3 of the PGA type package 2 is inserted and immersed in a 60 ° C warm bath as shown in Figs. The bent portion 7a of 7 was closed, and all the lead pins 3 were completely held and fixed to the bent portion 7a. After that, the plating pretreatment liquid and the plating bath are at 50 to 60 ° C., the lead pin plating jig 8 is energized to all the lead pins 3 to perform Ni plating and Au plating. The contact portion, that is, the portion other than the bent portion 7a was uniformly plated over the entire surface. The lead pin plating jig of the above embodiment is made of an omnidirectional shape memory alloy, but may be made of a unidirectional or bidirectional shape memory alloy.

[0010]

As can be seen from the above description, in the lead pin plating jig of the integrated circuit package of the present invention, since the openings correspond to all the lead pins independently of each other, the lead pins are not affected by other lead pins. Since all the lead pins can be securely held by contact, it is possible to flow current evenly,
Uniform electroplating can be performed. Moreover, by changing the temperature of the plating jig, a large number of lead pins can be inserted / removed without load, making it easy to work, and the lead pins can be securely held and fixed without being scratched or soiled. In addition, since a large number of openings matching the pitch of the lead pins of the PGA type package are provided at regular intervals, regardless of the number of lead pins,
It is possible to electroplate lead pins of various integrated circuit packages with one plating jig. Further, since the plating jig in which the noble metal or an alloy mainly containing noble metal is coated on the entire surface or the contact portion with the lead pin, the contact resistance with the lead pin is small, and the electricity is satisfactorily conducted.
Good quality electroplating. In this plating jig, the plated product is electrodeposited every time, but it can be reused any number of times by dissolving it in the stripping solution, and can be used semipermanently.

[Brief description of drawings]

FIG. 1 is a view showing a material of a jig for lead pin plating of an integrated circuit package of the present invention.

FIG. 2 is an enlarged partial bottom view of a jig for lead pin plating of the integrated circuit package of the present invention.

3 is a cross-sectional view taken along the line AA of FIG.

FIG. 4 is a partially enlarged bottom view showing a state in which a lead pin is inserted into the jig for lead pin plating in FIG.

5 is a sectional view taken along line BB of FIG.

FIG. 6 is a diagram showing a method of attaching a common electrode to a lead pin of a conventional integrated circuit package during electroplating.

FIG. 7 is a diagram showing a method of attaching a common electrode to a lead pin of a conventional integrated circuit package during electroplating.

FIG. 8 is a diagram showing a method of attaching a common electrode to a lead pin of a conventional integrated circuit package during electroplating.

[Explanation of symbols]

2 Integrated circuit package 3 lead pin 6 thin plates 7 openings 7a Bent part (lead pin contact part) 8 Lead pin plating jig

Claims (3)

[Claims] 1. A jig for plating a lead pin of an integrated circuit package, comprising a thin plate having an opening into which a tip of a lead pin of the integrated circuit package is fixed and arranged in a matrix at fixed intervals, and the thin plate is made of a shape memory alloy. 2. The jig for lead pin plating of an integrated circuit package according to claim 1, wherein the entire surface or a contact portion with the lead pin is coated with a noble metal or an alloy mainly containing a noble metal. Jig for lead pin plating of integrated circuit package. 3. The lead pin plating jig for an integrated circuit package according to claim 1, wherein the lead pin contact portion of the opening of the shape memory alloy thin plate is bent to the lower surface side, and this bent portion is lead pin plated. A jig for lead pin plating of an integrated circuit package, wherein the bending angle is changed by changing the ambient temperature from low temperature to high temperature or from high temperature to low temperature.