JPH0513302A - Semiconductor aligner - Google Patents

Abstract

PURPOSE:To automatically carry all the wafers for which different processes are performed on a passage in which the wafers are carried without interrupting a sequence set for an apparatus by setting up the wafer processes independently per wafer unit on the passage for the wafers to be carried. CONSTITUTION:A base job shared by usual wafer processes and an individual job for a special wafer process are set up on a console 11, respectively. After an apparatus sequence is started, a wafer job for a first wafer 5 is loaded on a memory in a control box 10. Then, the wafer 5 is fetched by a wafer conveying device 8 from a carrier 7 designated by the wafer job, and delivered into a wafer positioning device 9 to align the wafer position. Subsequently, the wafer 5 is conveyed by the wafer conveying device 8 onto an XY stage 6 to perform a positioning and exposure. Thus, the wafer 5 is carried from the XY stage 6 and stored in the carrier 7 designated by the wafer job.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to ICs, LSIs, super LSs.
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a projection exposure apparatus for manufacturing semiconductor elements such as I, and more particularly to an exposure apparatus equipped with an automatic wafer transfer mechanism.

[0002]

2. Description of the Related Art In recent years, in a semiconductor exposure apparatus, it has been desired that various settings relating to wafer processing can be performed on individual wafers to be exposed, as semiconductor production becomes more diverse in quantity and quantity decreases.

Further, as the degree of integration of semiconductors increases, a special wafer for automatically measuring the control accuracy of the apparatus and the change with time is automatically transferred to the exposure apparatus each time the exposure of a predetermined number of wafers is completed. The ability to carry in was desired.

Conventionally, various parameters relating to wafer positioning processing and exposure processing in the exposure apparatus main body (hereinafter referred to as main body job) can be set on a wafer-by-wafer basis. When a plurality of wafers having different carriers for taking out or accommodating wafers or a plurality of wafers requiring different processing are carried, a predetermined number of wafers are processed by a certain main body job (hereinafter, referred to as main body sequence).
Then, the main body sequence was interrupted, the carrier was exchanged, the main body job was reset, and then the main body sequence was executed again.

[0005]

According to the prior art, when a plurality of wafers having different processes on the transfer path are processed, for example, when a special processing wafer is taken out from a carrier different from a normal processing wafer, a predetermined process is performed. After executing the main body sequence that exposes the number of normal processing wafers, the main body sequence is interrupted, the carrier is exchanged for one containing special processing wafers, and the main body job is changed to one for special processing. After setting, the main body sequence that performs the special processing was executed.

Further, for example, when performing wafer peripheral exposure only on a certain wafer, after performing a main body sequence for performing exposure on another wafer which is not subjected to peripheral exposure, the main body sequence is interrupted to perform wafer peripheral exposure. After resetting the main body job for, the main body sequence was executed again.

[0007] Such an operation is more burdensome for the operator as the number of kinds of processing on the wafer on the path for transferring the wafer becomes more complicated, and the operation takes time. The efficiency was significantly hindered.

The object of the present invention is to solve the above-mentioned problems in the prior art.
By independently setting the wafer processing on the wafer transfer path on a wafer-by-wafer basis, it is possible to automatically transfer all wafers that perform different processing on the wafer transfer path without interrupting the main body sequence. A semiconductor exposure apparatus having the same is provided.

[0009]

In order to solve the above problems, in the present invention, in a semiconductor exposure apparatus for printing a circuit pattern on a substrate, the processing on the transfer path for the wafer to be printed is performed individually. A wafer processing setting means for setting the wafer independently is provided.

The wafer processing setting means comprises, for example, means for independently setting a wafer job, which is various parameters relating to processing on the wafer on the wafer transfer path, on a wafer-by-wafer basis, and means for storing this.

Further, there is provided means for automatically expanding the base job, which sets common settings for processing for normal processing wafers, into an individual job which is a job for processing each wafer.

Further, there is provided means for automatically switching the next wafer job at an appropriate timing by comparing the number of processed wafers set in each wafer job with the number of processed wafers in the main body sequence.

The operator, for example, for a special processing wafer whose take-out carrier is different from the normal processing wafer,
Further, for example, for wafers that require peripheral exposure unlike other wafers, a desired number of wafer jobs (individual jobs) are set by specifying parameters to that effect.

For normal processed wafers other than the above, one base job is set which specifies parameters for performing processing common to all the wafers.

According to a specific example, the semiconductor exposure apparatus of the present invention comprises means for setting and storing the wafer job for each processed wafer, means for appropriately developing the wafer job for each processed wafer, and a wafer job. And means for switching at an appropriate timing. Therefore, by using these means, it is possible to automatically transfer all of the plurality of wafers that perform different processes on the wafer transfer path.

[0016]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows a schematic structure of a semiconductor exposure apparatus according to an embodiment of the present invention.

As shown in the figure, this device serves as an illuminating device 1 including a light source and a shutter, a reticle base 3 on which a reticle 2 having a circuit pattern is placed, and a projection optical system for printing. A projection lens 4, an XY stage 6 on which a wafer 5 to be baked is placed and which moves in two directions of X and Y in an XY plane, and a carrier 7 for housing the wafer.
A wafer transfer device 8 for automatically transferring a wafer; a wafer alignment device 9 including a peripheral exposure device for exposing only the outer peripheral portion of the wafer; and a control box 10 in which a control unit such as a CPU and a storage device are stored. , And a console 11 for inputting parameters for controlling the apparatus.

Table 1 shows the items of wafer processing parameters that can be set for each wafer in the wafer job according to this embodiment.

[0020]

[Table 1]

2 and 3 are flow charts relating to wafer job setting and a series of wafer processes in the semiconductor manufacturing apparatus of FIG. 2 shows a wafer job setting flow, and FIG. 3 shows a series of wafer processing flows.

First, in step S1 shown in FIG. 2, a base job, which is a wafer job common to normal processed wafers, is set on the console 1.

Next, in step S2, an individual job, which is a wafer job for a specially processed wafer, is sent to the console 1
Set on 1.

In step S3, the operator inquires on the console 11 whether or not the setting for a desired number of individual jobs is completed. If completed, the wafer job setting is completed, and if not, step S
Return to 2 and set the next individual job.

After the start of the main body sequence, in step S11 shown in FIG. 3, a wafer job for the first wafer is loaded on the memory of the control box. In addition,
At this time, the necessary wafer job is selected and developed from either the base job or the individual job set in step S2 of FIG.

Next, in step S12, the wafer transfer device takes out the wafer from the carrier designated by the wafer job and carries it into the wafer alignment device.

In step S13, the wafer alignment device aligns the wafer in the XY directions and the rotation direction.

In step S14, it is checked whether or not the peripheral exposure in the wafer job is performed. If the peripheral exposure is performed, the process proceeds to step S15, and the wafer peripheral exposure is performed. If not, the process proceeds to step S16.
The wafer is carried onto the XY stage of the exposure apparatus main body by the wafer transfer apparatus.

Next, in step S17, the exposure apparatus main body positions the wafer and exposes the wafer.

In step S18, it is checked whether or not an error has occurred in step S17. If an error occurs, the wafer is unloaded and stored in a carrier designated by the wafer job as a wafer discharge destination when an error occurs in the main body in step S19. If no error has occurred, the process proceeds to step S20, and the wafer is unloaded from the XY stage of the exposure apparatus main body and is stored in the carrier designated by the wafer job.

In step S21, it is checked whether or not the processing of the number of wafers designated by the wafer job has been completed. If it has not been completed, the process returns to step S12 to process the next wafer. On the other hand, if it has been completed, the process proceeds to step S22.

In step S22, it is checked whether the processing for all wafer jobs has been completed. If it is completed, the main body sequence is ended, and if not, the wafer job is switched in step S23 and loaded in the memory of the control box, and then step S23.
Return to 12.

The present invention is not limited to the above embodiment,
It can be implemented with various modifications.

For example, step S1 of FIG.
2 and S3, it is possible to set a plurality of base jobs.

It is also possible to change the designated carrier in step S12 in FIG. 3 to a photosensitive material coating device and the designated carrier in step S20 to a wafer developing device.

Further, it is possible to perform the processing of FIG. 2 on an external device connected to the exposure apparatus, and change it so that the wafer job is received on the exposure apparatus side at the start of the main body sequence of FIG.

As described above, according to the present embodiment, the wafer job is set and stored for each processing wafer, the wafer job is appropriately developed for each processing wafer, and the wafer job is switched at an appropriate timing. Therefore, it becomes possible to automatically carry all of the plurality of wafers that perform different processes on the wafer carrying path.

[0038]

As described above, according to the present invention,
Since the processing on the transfer path for the wafer to be printed is set independently for each wafer, all wafers that perform different processing on the transfer path can be automatically processed without interrupting the main body sequence. It is possible to convey the material.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram of a semiconductor exposure apparatus according to an embodiment of the present invention,

FIG. 2 is a flowchart of wafer job setting in the semiconductor exposure apparatus of FIG.

3 is a flowchart relating to a series of wafer processes in the semiconductor exposure apparatus of FIG.

[Explanation of symbols]

1: illuminator, 2: reticle, 3: reticle stand, 4: projection lens, 5: wafer, 6: XY stage, 7: carrier, 8: wafer transfer device, 9: wafer alignment device, 1
0: control box, 11: console.

Claims (8)

[Claims] 1. A semiconductor exposure apparatus for printing a circuit pattern on a substrate, comprising wafer processing setting means for independently setting the processing on a transfer path for a wafer to be printed on each wafer. Semiconductor exposure equipment. 2. The semiconductor exposure apparatus according to claim 1, wherein the wafer processing setting means has a wafer job setting means for setting a wafer job which is various parameters relating to processing on a transfer path for each wafer. 3. The wafer job setting means specifies a carrier to be taken out or stored in each wafer,
3. The semiconductor exposure apparatus according to claim 2, wherein a wafer number is taken out from the carrier or a slot number to be a storage place is designated. 4. The wafer job setting means sets whether or not to execute a wafer peripheral exposure function for exposing the outer peripheral portion of each wafer, and an exposure amount in the wafer peripheral exposure,
The semiconductor exposure apparatus according to claim 2, wherein an exposure area and the like are set. 5. A slot, which is a wafer job setting means, specifies a carrier to be a wafer discharge target when an abnormality occurs in processing of each wafer on the exposure apparatus main body, and a wafer storage place in the carrier. The semiconductor exposure apparatus according to claim 2, wherein a number is designated. 6. The wafer job setting means sets an individual job, which is a wafer job including the special processing, only for the wafer to be subjected to the special processing among the wafers, and for the other wafers. 3. The semiconductor exposure apparatus according to claim 2, further comprising means for setting a common base job, which is one or a plurality of wafer jobs, for simplifying the setting of the wafer job. 7. The semiconductor exposure apparatus according to claim 2, further comprising setting means for an operator to arbitrarily set the wafer job. 8. The semiconductor exposure apparatus according to claim 2, further comprising a data receiving means for receiving the wafer job from an external device connected to the semiconductor exposure apparatus.