JPH05131290A - Detergent composition for solder flux - Google Patents

Abstract

PURPOSE:To provide the detergent for a solder flux which does not destroy environment by specifying components and wt.%. CONSTITUTION:This detergent compsn. for the solder flux consists of 50 to 97wt.% R1O(CmH2mO)mH and 3 to 50wt.% R2O(CH2CH2O)pR3. R1 is 1 to 8C alkyl group, m is an integer from 1 to 5; R2, R3 are 1 to 8C alkyl group.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning composition for cleaning flux used in soldering.

[0002]

2. Description of the Related Art Conventionally, a freon-based solvent has been used for a printed circuit board in order to remove solder fluxes remaining after soldering. However, since a CFC-based solvent has a problem of depleting the ozone layer, development of a cleaning agent that can substitute for it is underway, and various glycol ether-based cleaning agents have been disclosed (for example, Japanese Patent Laid-Open Publication No. Sho-Sho). 5
9-134891 and the cleaning agents described in JP-A-3-97792). However, under the present circumstances, these detergents are insufficient to satisfy all required performances such as detergency, toxicity and odor.

[0003]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a non-halogen type cleaning agent for solder flux, which has excellent detergency and is satisfactory in environmental characteristics, toxicity and odor.

[0004]

In view of the above problems, the present inventors have conducted intensive studies on a cleaning agent suitable for cleaning solder flux that does not damage the environment, and as a result, completed the present invention.

That is, the present invention comprises a compound (A) represented by the following general formula (1) and a compound (B) represented by the following general formula (2), and the total weight of (A) and (B): 50 to 97% by weight of (A) and 3 to 50% by weight of (B)
Is a cleaning composition for solder flux. (A): R ₁ O (C _n H _2n O) _m H (1) (In the formula, R ₁ is hydrogen or an alkyl group having 1 to 8 carbon atoms or a cycloalkyl group, n is an integer of 2 to 4, m Is 1 to 5
Represents the integer. ) (B): R ₂ O (CH ₂ CH ₂ O) _p R ₃ (2) (In the formula, R ₂ and R ₃ are each an alkyl group having 1 to 8 carbon atoms or a cycloalkyl group, and p is 1 to 5). Represents the integer of.)

In the general formula (1), R ₁ has 1 to ₁₀ carbon atoms.
As the alkyl group of 8, a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, an octyl group,
Examples thereof include an isopropyl group, a tert-butyl group and a 2-ethylhexyl group, and examples of the cycloalkyl group include:
Examples thereof include a cyclopentyl group, a cyclohexyl group and a cyclooctyl group. Preferred is when R ₁ has 3 to 5 carbon atoms.
Or an alkyl group having 6 to 8 carbon atoms, particularly preferably an alkyl group having 4 carbon atoms. If the number of carbon atoms in the alkyl group exceeds 8, the cleaning property will deteriorate. C _n H _2n O in the formula represents oxyethylene, oxypropylene, and oxybutylene. m is an integer of 1 to 5, preferably 2 to 3. When m is 2 to 5, it may be added alone, randomly or added to a block, but preferred ones are those in which oxyethylene is essentially added, and particularly preferred are oxyethylene single adducts. If m exceeds 5, the cleaning property will deteriorate.

In the general formula (2), examples of the alkyl group having 1 to 8 carbon atoms for R ₂ and R ₃ include a methyl group, an ethyl group,
Examples thereof include a propyl group, a butyl group, a pentyl group, a hexyl group, an octyl group, an isopropyl group, a tert-butyl group and a 2-ethylhexyl group. Examples of the cycloalkyl group include a cyclopentyl group, a cyclohexyl group and a cyclooctyl group. Can be given. In the present invention, R ₂ and R ₃ may be the same or different. Of R ₂ and R ₃ , an alkyl group having 1 to 2 carbon atoms is preferable. If the number of carbon atoms in the alkyl group exceeds 8, the cleaning property will deteriorate. p is 1 to 5
And is preferably 2 to 3. If p exceeds 5, detergency deteriorates.

Examples of (A) are ethylene glycol,
Glycols such as diethylene glycol, triethylene glycol, propylene glycol, dipropylene glycol, tripropylene glycol, ethylene glycol monobutyl ether, ethylene glycol monopentyl ether, ethylene glycol monohexyl ether, ethylene glycol monooctyl ether, diethylene glycol monomethyl ether, diethylene glycol mono Ethyl ether, diethylene glycol monopropyl ether, diethylene glycol monobutyl ether, diethylene glycol monopentyl ether, diethylene glycol monohexyl ether, diethylene glycol monooctyl ether, triethylene glycol monomethyl ether, triethylene glycol monopropyl ether (Poly) ethylene glycol monoalkyl ethers such as triethylene glycol monobutyl ether, tetraethylene glycol monoethyl ether, triethylene glycol monopentyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, propylene glycol monopentyl ether, di Propylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monopropyl ether, dipropylene glycol monobutyl ether, dipropylene glycol monopentyl ether, diethylene glycol monohexyl ether, tripropylene glycol monomethyl ether, tripropylene glycol monoethyl ether, Tripropy (Poly) propylene glycol monoalkyl ethers such as ethylene glycol monopropyl ether and tripropylene glycol monbutyl ether, ethylene dipropylene glycol monomethyl ether, ethylene dipropylene glycol monopropyl ether, ethylene dipropylene glycol monobutyl ether, diethylene dipropylene glycol Examples thereof include monoalkyl ethers such as monomethyl ether, diethylene dipropylene glycol monobutyl ether, diethylene propylene glycol monopropyl ether, and diethylene propylene glycol monobutyl ether, which are obtained by copolymerization addition of ethylene glycol and propylene glycol, and mixtures thereof.

Examples of (B) include diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dibutyl ether, triethylene glycol dimethyl ether, triethylene glycol diethyl ether, triethylene glycol dibutyl ether, diethylene glycol methyl ethyl ether and ethylene glycol methyl butyl ether. Examples thereof include dialkyl ethers of poly) ethylene glycol and mixtures thereof.

The cleaning agent of the present invention comprises (A) and (B), and (A) is 50 based on the total weight of (A) and (B).
˜97 wt% (B) is 3 to 50 wt%, and preferably (A) 70 to 95 wt% (B) is 5 to 30 wt%. If it deviates from this range, the cleaning property will deteriorate.

The detergent of the present invention is mainly composed of glycol ethers, but it may contain a surfactant in order to enhance the permeability and wettability of the detergent. It is also possible to contain water for further flame retardation. Examples of the surfactant include an ethylene oxide adduct of nonylphenol, an ethylene oxide adduct of octylphenol, a fluorine-based surfactant (for example,
Examples thereof include surfactants such as perfluoroalkylcarboxylic acid salts and perfluoroalkylethylene oxide adducts, and fluorine-based surfactants are preferable.

The content of the surfactants is usually 8% by weight or less, preferably 5% by weight, based on the total weight of (A) and (B).
It is less than or equal to weight%. If it exceeds 8% by weight, it may cause stains and corrosion due to residual surfactant.

The content of water is usually 50% by weight or less, preferably 20% by weight, based on the total weight of (A) and (B).
Hereafter, it is more preferably 10% by weight or less. If it exceeds 50% by weight, detergency becomes poor.

To clean a printed circuit board using the cleaning agent of the present invention, the printed circuit board is generally immersed in a cleaning agent heated to room temperature to 100 ° C., preferably 30 to 70 ° C., and ultrasonic waves, agitation, and shaking are used. Or by spraying or wiping. After washing, the printed circuit board may be pulled out and dried as it is, or may be rinsed with water or warm water and then dried.

[0015]

The present invention will be described in detail below with reference to examples, but the present invention is not limited thereto. In the examples,% means% by weight unless otherwise specified.

Example 1 Cleaning Agent (a1) of the Present Invention Ethylene glycol monobutyl ether 90% Diethylene glycol dimethyl ether 10%

Example 2 Detergent of the present invention (a2) Diethylene glycol monopropyl ether 70% Diethylene glycol dimethyl ether 30%

Example 3 Cleaning Agent of the Present Invention (a3) Diethylene glycol monobutyl ether 80% Triethylene glycol dimethyl ether 20%

Example 4 Cleaning Agent (a4) of the Present Invention Triethylene glycol monobutyl ether 80% Tetraethylene glycol dimethyl ether 20%

Example 5 Cleaning Agent (a5) of the Present Invention Tetraethylene glycol monoheptyl ether 90% Diethylene glycol diethyl ether 10%

Comparative Example 1 Detergent (b1) Triethylene glycol monomethyl ether 100%

Comparative Example 2 Detergent (b2) Hexaethylene glycol monobutyl ether 90% Diethylene glycol diethyl ether 10%

Comparative Example 3 Detergent (b3) Diethylene glycol dimethyl ether 100%

Comparative Example 4 Detergent (b4) 100% dipropylene glycol monobutyl ether

Detergency Test A detergency test was conducted using the cleaning agents obtained in Examples 1-5 and Comparative Examples 1-4. In the test, solder flux was applied to a glass plate and heated at 200 ° C. for 15 minutes to give a contaminated plate.
Each flux was immersed in each cleaning agent at 40 ° C. for 30 seconds and the dissolved state of the flux was visually observed. Evaluation Criteria ○: Large solubility (no flux on the glass plate) Δ: Slightly inferior (some flux on the glass plate exists) ×: Poor solubility (large amount of flux on the glass plate) Flux A: Inert rosin Flux Flux B: Active rosin flux

[0026]

The cleaning agent of the present invention has a detergency equal to or higher than that of a halogen-based cleaning agent, and since it is a non-halogen type cleaning agent, there is no fear of environmental destruction, and the odor and flammability are also high. It is fully satisfactory and extremely effective in removing solder flux. Combined

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification number Office reference number FI technical display location H05K 3/34 V 9154-4E (C11D 7/60 7:26)

Claims (1)

[Claims] 1. A compound (A) represented by the following general formula (1) and a compound (B) represented by the following general formula (2), which is based on the total weight of (A) and (B). (A)
Is from 50 to 97% by weight, and (B) is from 3 to 50% by weight. (A): R ₁ O (C _n H _2n O) _m H (1) (In the formula, R ₁ is hydrogen or an alkyl group having 1 to 8 carbon atoms or a cycloalkyl group, n is an integer of 2 to 4, m Is 1 to 5
Represents the integer. ) (B): R ₂ O (CH ₂ CH ₂ O) _p R ₃ (2) (In the formula, R ₂ and R ₃ are each an alkyl group or cycloalkyl group having 1 to 8 carbon atoms, and p is 1 to 5). Represents the integer of.)