JPH05129483A - Hybrid ic - Google Patents

Abstract

PURPOSE:To provide an excellent heat dissipating efficiency by mounting a heat dissipating trunk on an inner surface of a package and connecting the trunk to a heat generating element of an IC body via a metal wire, thereby forming a new heat dissipating passage. CONSTITUTION:Heat dissipating trunks 27, 29 are mounted on an inner surface of a package 26 for containing a hybrid IC body 21. That is, both ends of heat conductive metal wires 31 are bonded to the trunks 27, 29 made of thermal conductive materials and heat generating elements 23-25 of the body 21 on the inner surface of the package 26. Accordingly, a heat transfer passage of the elements 23-25, the wires 31, the trunks 27, 29 and the package 26 is formed. Further, the wires 31 and the trunks 27, 29 are formed of heat conductive materials. Thus, heats generated from the elements 23-25 are efficiently transferred to the package 26, and dissipated from the package 26.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid IC having a hybrid IC body housed in a package.

[0002]

2. Description of the Related Art The structure of a conventional hybrid IC is shown in FIG. The hybrid IC body 11 has a plurality of chip components 13 mounted on, for example, a ceramic substrate 12, and the hybrid IC body 11 is housed in a substantially rectangular parallelepiped package 14 having an opening on one surface. At this time, a plurality of terminals 15 are provided on the bottom plate 14a of the package 14.
The bottom plate of the package 1
4a, the substrate 12 of the hybrid IC body 11 is arranged, the terminals 15 are inserted into the terminal holes 12a formed in the substrate 12, and the terminals 15 and pads formed on the substrate 12 (see FIG. (Not shown) are respectively connected. The package 14 accommodating the hybrid IC body 11 is covered by a package upper lid 16.

[0003]

When the conventional hybrid IC having the above-described structure is driven and, for example, the chip component 13 generates heat, most of the heat is transferred to the package bottom plate 14a via the substrate 12 and is radiated to the outside. To be done. In a hybrid IC having such a heat dissipation path, heat dissipation efficiency is improved when a heat generating element such as a power MOSFET or a power transistor is mounted as the chip component 13 and when high density mounting of such heat generating element is attempted. It becomes a problem. That is, it is necessary to improve the heat dissipation efficiency in order to suppress the temperature rise of the heating element so that the operating temperature of the heating element does not exceed the allowable temperature and the desired performance is obtained.

An object of the present invention is to provide a hybrid IC having excellent heat dissipation efficiency in view of such requirements.

[0005]

SUMMARY OF THE INVENTION The present invention is a hybrid IC in which a hybrid IC body is housed in a package.
In this case, a heat dissipation relay portion made of a material having good heat conductivity is attached to the inner surface of the package, and both ends of a metal wire having good heat conductivity are bonded to the heat dissipation relay portion and the heat generating element of the hybrid IC body.

[0006]

[Operation] In the present invention configured as described above, in addition to the conventional heat transfer path of heating element → substrate → package, there is newly provided heat transfer path of heating element → metal wire → relay relay → package. Since the metal wire and the heat dissipation relay are formed of a material having good thermal conductivity, the heat generated by the heat generating element is efficiently transmitted to the package.
Heat is dissipated from the package.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will now be described with reference to the drawings. FIG. 1A is a cross-sectional view of a hybrid IC according to the present invention, and FIG. 1B is a schematic plan view showing the package upper cover 16 removed. The hybrid IC body 21 is
A configuration suitable for carrying out the present invention is illustrated. That is, on the rectangular ceramic substrate 22, three heating elements 23 are mounted along one short side thereof, while four heating elements 24 are mounted along the other short side thereof, and further in the central portion of the substrate 22. One heating element 25 is mounted. The heating element 23 is a power MOSFET, and the heating elements 24 and 25 are
Is a diode.

A heat radiating relay portion is attached to the inner surface of the package 26 that houses the hybrid IC body 21.
The rectangular plate-shaped heat dissipation relay portion 27 has its plate surface parallel to the package bottom plate 26a, and both side plates 26b, 2 of the package 26 facing both short sides of the hybrid IC body 21.
Each of them is attached to each of the 6c in a fin shape, and the protruding ends of these heat radiation relay portions 27 are located near the heat generating elements 23 and 24 of the hybrid IC main body 21, respectively.

A through hole 28 is formed in the substrate 22 in the vicinity of the heat generating element 25, and a columnar heat radiating relay portion 29 is perpendicular to the package bottom plate 26a so as to be inserted into the through hole 28 and project onto the substrate 22. Mounted on. These heat radiating relay portions 27 and 29 are made of a material having a good thermal conductivity such as aluminum, and are attached to the inner surface of the package 26 so as to have a good thermal conductivity.

Pads 23a, 24a, 25a are formed on the upper surfaces of the heating elements 23, 24, 25 via an insulating layer, and one end of a metal wire 31 is bonded to each of the pads 23a, 24a, 25a. The other ends thereof are respectively bonded to the upper surfaces of the heat dissipation relay portions 27 or 29 located in the vicinity thereof. That is, each heating element 23, 24,
25 and the heat radiating relay portions 27 or 29 located in the vicinity thereof are individually connected in an electrically insulated state. The metal wire 31 is made of a material having good thermal conductivity, and for example, an aluminum wire having an outer diameter of 300 μm is used.

With the above-mentioned configuration, each heating element 23, 2
New heat transfer paths reaching the package 26 through the metal wire 31 and the heat radiation relay portion 27 or 29 are formed for the wirings 4 and 25, respectively. Good heat conductivity can be obtained by integrally forming the heat radiating relay portions 27 and 29 and the package 26 with, for example, aluminum, and good bonding strength can be obtained by forming them with the metal wire 31. Can be obtained.

Further, as shown in FIGS. 1A and 1B, the pads 23a, 24a, 25a of the heating elements 23, 24, 25 are formed.
The metal wires 31 to be bonded with good workability by making the upper surfaces of the metal wires 31 and the upper surfaces of the heat dissipation relay portions 27 and 29 substantially at the same height and aligning the extending directions of the metal wires 31 connecting them. You can In this embodiment, the heating element 2 mounted on the substrate 22
3, that is, in the power MOSFET, the drain electrode thereof is connected to the pattern on the substrate 22 so as to be in contact therewith, and the gate electrode and the source electrode are connected to the pattern on the substrate 22 by metal lines 32 and 33, respectively. In addition, the heating elements 24 and 25, that is, the diodes are connected to one of the P-side electrode and the N-side electrode so as to be in contact with the pattern on the substrate 22, and the other is connected to the pattern on the substrate 22 by the metal wire 34. It is connected to the. In FIGS. 1A and 1B, illustration of these electrodes and patterns is omitted, and the metal wires 32, 33, 3
Only 4 is shown.

[0013]

As described above, according to the present invention, the heat dissipation relay section is attached to the inner surface of the package, and the heat dissipation relay section and the heat generating element of the hybrid IC body are connected by the metal wire to newly dissipate heat. By forming the path, a hybrid IC having excellent heat dissipation efficiency can be obtained.

[Brief description of drawings]

FIG. 1A is a sectional view showing an embodiment of a hybrid IC according to the present invention. B is the top view which removed and showed the package top cover.

FIG. 2 is a sectional view showing a conventional hybrid IC.

[Explanation of symbols]

 21 Hybrid IC Main Body 23, 24, 25 Heating Element 26 Package 27, 29 Heat Dissipation Relay Section 31 Metal Wire

Claims (1)

[Claims] 1. A hybrid IC in which a hybrid IC main body is housed in a package, a heat radiation relay portion which is attached to the inner surface of the package and is made of a material having good thermal conductivity, the heat radiation relay portion, and the hybrid IC body. And a metal wire having good thermal conductivity, both ends of which are bonded to the heat generating element.