JPH05129387A - Probe card - Google Patents

Abstract

PURPOSE:To obtain a probe card capable of transmitting an electric signal with accuracy by interposing an insulators between contacts. CONSTITUTION:Insulators 22b and 22c are interposed between rows of contacts 2a to 22c, 22d to 22f and 22g to 22i. The contacts 22a to 22i are fixed with the surfaces of the insulators 21a to 21c, which makes it possible to hold the insulation properties between the contacts 22a to 22i definitely. The contacts 22a to 22i form a plurality of contact rows 22a to 22c, 22d to 22f and 22g to 22i in the shape of layers. Furthermore, sheet-shaped insulators 21a to 21c are interposed between each of the contacts 22a to 22c, 22d to 22f and 22g to 22i. Therefore, an increase in the number of layers makes it possible to hold more definite insulation properties between the contacts 22a to 22i and place them into contact with area bumps within a chip easily. It is, therefore, possible to hold the insulation properties between the contacts more definitely.

Description

Detailed Description of the Invention

(Table of contents) -Industrial application field-Conventional technology (Fig. 6) -Problems to be solved by the invention-Means for solving the problem-Action-Examples (Figs. 1 to 5) -Invention Effect of

[0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus, and more particularly to a semiconductor manufacturing apparatus such as an LSI tester having a probe card for measuring the characteristics of chips formed in a wafer.

In a semiconductor integrated circuit device such as an LSI, a large number of chip areas are formed on a wafer, and the characteristics are measured and the quality is checked before dividing into chips.
By assembling only good chips, the number of assembling steps and the assembling materials are saved, and the shipping test is facilitated. Therefore, it is desired that the probe test has higher reliability.

[0004]

2. Description of the Related Art FIGS. 6A to 6C are configuration diagrams illustrating a conventional LSI tester having a probe card for measuring the characteristics of chips formed on a wafer.

FIG. 6 (a) is an overall view of an LSI tester. In the figure, 1 is in contact with a predetermined portion of the object to be measured, sends an electric signal from the measuring device 4 to the object to be measured, and is measured. A probe card that serves as an electric signal path for sending back an electric signal of the characteristic value of the measured object to the measuring device 4, 2 is a flock ring, 3 is a performance board, 4 is an electric signal applied to the measured object, and measurement is performed. A measuring device for taking in the measured characteristic value, 5 is a movable stage on which a wafer 6 as an object to be measured is mounted,
Reference numeral 7 is a contact pin that electrically connects the boards.

FIG. 6B is a perspective view showing details of the probe card 1, and FIG. 6C is a side view showing details of the probe card 1. In the figure, 8 is a support, 9 is a contactor attached to the support 8, and the contact portion of the chip in the wafer 6, for example, the tip of the contactor 9 that contacts a bump is 4 It is assembled and arranged so that it becomes a side shape. Further, a wiring pattern for connecting the predetermined contact 9 and the connection portion 10 is formed on the support 8. Further, all the contacts 9 are fixed by resin so as not to move.

[0007]

By the way, when the density of the semiconductor integrated circuit device is increased or when it is necessary to contact the area bumps inside the chip, the number of bumps inside the chip reaches several hundreds. .. Therefore, the interval between the bumps in the chip is becoming narrower. Further, it is necessary to simultaneously send a relatively small signal sent to the area bump and a relatively large signal sent to the input / output bump. For this reason,
In the probe card 1 described above, (1) it is necessary to make the interval between the contacts 9 narrow, so that a short circuit between the contacts 9 easily occurs.

(2) Further, when electric signals are simultaneously sent to the area bumps and the input / output bumps, the electric signals on the contacts 9 interfere with each other, making it difficult to accurately transmit the electric signals. Become.

(3) Furthermore, since it is necessary to lengthen the contactor 9, the stray inductance (L) component of the contactor 9 increases, and it becomes difficult to accurately transmit an electric signal. The present invention has been made in view of the above conventional problems, and it is possible to reliably maintain insulation between the contacts, prevent interference between electric signals on the contacts, and float the contacts 9. An object of the present invention is to provide a probe card capable of accurately transmitting an electric signal by reducing an inductance (L) component.

[0010]

The first object of the present invention is to provide a plurality of spaced apart contactors, one end of which is in contact with an object to be measured and the other end of which is connected to a measuring instrument. In the probe card having, the contactor is arranged in accordance with the arrangement of the contact portion of the object to be measured, and an insulator is interposed between the conductors so that the positions of the conductors are different from each other. Achieved by a probe card characterized in that it is held constant, secondly, one end is in contact with the object to be measured and the other end is connected to the measuring instrument, spaced apart from each other A probe card having a plurality of contacts arranged therein, wherein the contacts are formed in layers in a plurality of rows, and a plate-shaped insulator is interposed between the contact rows. Achieved by a probe card characterized by In addition, a plate-shaped conductor is provided inside the insulator between the contact rows so as to face the contact rows, and the conductor is electrically fixed to a constant potential. A fourth aspect of the present invention is achieved by the probe card according to the second aspect of the present invention, and fourthly, the DUT is a chip formed in a wafer, and the plurality of layered contacts are formed. This is achieved by the probe card according to the second or third invention, wherein the child rows are arranged in a quadrilateral shape so as to correspond to the arrangement of the contact portions in the chip.

Fifth, the probe card according to the first, second, third or fourth invention, wherein the contactor has a strip shape.

[0012]

In the probe card of the present invention, (1) since the insulator is interposed between the contacts, the reliable insulation between the contacts can be maintained.

(2) Since the contactors are formed in a plurality of rows and formed in layers and a plate-shaped insulator is interposed between each contactor row, the number of layers can be increased to increase the number of contacts. It is possible to easily make contact with the area bumps inside the chip while maintaining reliable insulation between them.

(3) Inside the insulator between each contact row,
Since it has a plate-shaped conductor facing the contact row, and the conductor is fixed to an electrically constant potential, the conductor is kept at an electrically constant potential during measurement. By fixing, it is possible to prevent the influence of electric signals from the surrounding contacts.

(4) In the conventional case in which the individual contacts are spaced apart from each other without support, it is difficult to process the contacts themselves into a strip shape, but in the case of the present invention, the contacts are electrically conductive, for example, on an insulator. By patterning the body film, the shape of the contactor can be easily made into a band shape. Then, by forming the contactor into a strip shape, the stray inductance can be reduced as compared to the conventional case.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIGS. 1A to 1C are configuration diagrams for explaining an LSI tester having a probe card for measuring the characteristics of chips formed on a wafer according to a first embodiment of the present invention.

FIG. 1 (a) is an overall view of an LSI tester. In FIG. 1, 11 is a measuring device 1 which is in contact with a predetermined portion of an object to be measured.
4 is a probe card serving as an electric signal passage for sending an electric signal from 4 to the object to be measured and returning an electric signal of the measured characteristic value of the object to the measuring instrument 14, 12 is a flock ring, 13 is a performance A board, 14 is a measuring instrument that applies an electric signal to the object to be measured and takes in the measured characteristic values, 15 is a movable stage on which a wafer 16 as the object to be measured is mounted, and 17 is an electrical connection between the boards. It is a contact pin that does.

Further, FIG. 1B is a perspective view showing an overall view of the probe card 11, and FIG. 1C is a probe card 11.
It is a side view showing the whole figure. In the figure, 18 is a support, 19
Reference symbol a is a set of contacts attached to the support 18. The tip of the contact part 19a of the chip in the wafer 16, for example, the contact set 19a that contacts the bump electrode has four sides corresponding to the shape of the chip. It is arranged to have a shape. Further, the support 18 is formed with a wiring pattern for connecting a predetermined contactor to the connecting portions 20a, 20b. Although only two connecting portions 20a and 20b are shown in the drawing, the number of connecting portions corresponding to the number of contacts is actually formed.

Further, FIG. 2D is a sectional view showing the details of the contact assembly 19a. In the drawing, 21a to 21c are insulators made of polyside, and 22a to 22i are arranged at intervals. The contactors 22a to 22i are contactor rows 22a to 22c, 22d to which are made of copper plated with gold or tin.
22f, 22g to 22i are arranged in a line in a plane,
And each contactor row 22a-22c, 22d-22f, 22g
22i are layered with the insulators 21b and 21c interposed therebetween.
Further, one end of each of the contacts 22a to 22i is brought into contact with a bump electrode 52a to 52i of an input / output section formed on, for example, a chip peripheral portion on a semiconductor substrate as the DUT 51, and the contacts 22a to 22i are contacted. The other end of is connected to the connecting portions 20a and 20b via a wiring pattern formed on the support 18.

Inside the insulators 21a to 21c, plate-shaped conductors 23a to 23c made of copper are formed so as to face the contact rows 22a to 22c, 22d to 22f and 22g to 22i, and each of them is formed. The conductors 23a-23c are electrically fixed to a constant potential.

As described above, in the probe card of the first embodiment of the present invention, (1) the insulators 21b and 21c are interposed between the contactor rows 22a to 22c, 22d to 22f and 22g to 22i. ing. Also, contact
Since 22a to 22i are fixed to the surfaces of the insulators 21a to 21c, reliable insulation between the contacts 22a to 22i can be maintained.

(2) The contacts 22a to 22i are a plurality of contact rows
22a to 22c, 22d to 22f, 22g to 22i are formed in layers and each contact row 22a to 22c, 22d to 22f, 22g.
Since the plate-shaped insulators 21a to 21c are interposed between the contacts 22a to 22i, the number of layers is increased so that the area bumps inside the chip can be easily maintained while maintaining the reliable insulation between the contacts 22a to 22i. Can be contacted with.

(3) Each of the contacts 22a-22c, 22d-22f,
Inside the insulators 21a to 21c between 22g to 22i, contactor rows are provided.
22a to 22c, 22d to 22f, 22g to 22i, and plate-shaped conductors 23a to 23c so as to face the conductors 23a to 23c
Is fixed to an electrically constant potential, therefore, by fixing the conductors 23a to 23c to an electrically constant potential, for example, the ground potential, during measurement, an electric signal from surrounding contacts is generated. Can be prevented from affecting.

Next, a method of making one of the contact rows 22a to 22c of the contact rows 22a to 22c, 22d to 22f, 22g to 22i constituting the above-mentioned contact group 19a will be described with reference to FIG.
A description will be given with reference to (a) to (c).

First, as shown in FIG. 5A, the film thickness is 0.1
conductors 23a / insulators 21a / contacts 22a to 22c made of copper and having a thickness of 0.1 mm on insulators 21a made of mm polyside.
Then, the conductor 22 of 0.1 mm is sequentially formed.

Next, as shown in FIG. 5B, the conductor 22 is formed using the strip-shaped resist pattern films 31a to 31c as masks.
Is patterned to form strip-shaped contacts 22a to 22c. A top view is shown in FIG. This gives 1
Two contactor rows 22a-22c are formed.

After that, other contact rows 22d to 22f and 22g to 22i formed in the same manner are laminated and fixed by shifting the ends little by little and interposing an adhesive agent between them, and the contact elements shown in FIG. Is created.

By the way, in the conventional case in which the individual contacts are separated from each other without any support, it is difficult to process the contacts themselves into a strip shape, but in the contacts 22a to 22c produced as described above, Is the conductor 23a / on the insulator 21a.
After stacking the insulator 21a / conductor 22 and then patterning the conductor 22 of the uppermost layer, the contacts 22a to 22c can be easily formed into a strip shape. And contactor
By making the shapes of 22a to 22c band-shaped, the stray inductance can be reduced as compared with the conventional case.

In the first embodiment, an assembly of contacts
The contact portion of 19a with the DUT 16 is arranged in a quadrilateral shape in accordance with the shape of the chip, but it may be arranged in any shape.

Further, inside the insulators 21a to 21c, there are plate-like conductors 23a to 23c so as to face the contactor rows 22a to 22c, 22d to 22f and 22g to 22i, but FIG. The conductors 23a to 23c may be omitted as in the third embodiment shown in FIG. In FIG. 3, reference numerals 24a to 24c are insulators, 25a,
25d and 25g are contacts formed by sandwiching the insulators 24b and 24c, and 51 is a wafer in which bump electrodes 52a, 52d and 52g that contact the contacts 25a, 25d and 25g are formed in the chip (measurement object). ).

Further, in the first embodiment described above, the bump electrode
Contact pieces 25a, 25d, 25 on the convex portion such as 52a, 52d, 52g
Although it is in contact with g, when contact is made with the electrodes 54a, 54d, 54g, etc. at the bottom of the via hole as in the third embodiment shown in FIG. 4 (a), the contacts 27a, 27d, 27g Auxiliary contactors 29a, 29d, 29g by welding or soldering on the tip
May be attached. This makes it possible to easily make contact in the recess. In the figure, another reference numeral 19c is a contactor assembly, and 28a to 28c are inside insulators 26a to 26c.
A plate-shaped conductor formed so as to face the contact row 22a, 22d, 22g, 53 is a contact 27a, 27d, 27 in the chip.
This is a wafer (measurement object) on which electrodes 54a, 54d, 54g that are in contact with g are formed.

Further, instead of FIG. 4A, FIG.
As in the fourth embodiment shown in FIG. 3, the contacts 30a, 30d, 30g
It may be formed so that the tip portion of itself projects beyond the tip portions of the insulators 26a to 26a.

[0033]

As described above, in the probe card of the present invention, (1) since the insulator is interposed between the contacts, the reliable insulation between the contacts can be maintained.

(2) Since the contactor is formed in a plurality of rows in a layered form and a plate-shaped insulator is interposed between each contactor row, the contactor is increased by increasing the number of layers. It is possible to easily make contact with the area bumps inside the chip while maintaining reliable insulation between them.

(3) Inside the insulator between each contact row,
Since it has a plate-shaped conductor that faces the contact row, and the conductor is designed to be electrically fixed to a constant potential, the influence of electrical signals from the surrounding contacts does not occur. You can avoid it.

(4) By making the contactor in the shape of a band, the stray inductance can be reduced as compared with the conventional case.

[Brief description of drawings]

FIG. 1 is a diagram (No. 1) explaining a first embodiment of the present invention.

FIG. 2 is a diagram (No. 2) for explaining the first embodiment of the present invention.

FIG. 3 is a diagram illustrating a second embodiment of the present invention.

FIG. 4 is a side view illustrating third and fourth embodiments of the present invention.

FIG. 5 is a diagram illustrating a method of forming a contact aggregate according to the first embodiment of the present invention.

FIG. 6 is a diagram illustrating a conventional example.

[Explanation of symbols]

11 probe card, 12 flock ring, 13 performance board, 14 measuring instrument, 15 stage, 16, 51, 53 wafer (measurement object), 17 contact pin, 18 support, 19a to 19d contact assembly, 20a, 20b connection part, 21a-21c, 24a-24c, 26a-26c insulator, 22,23a-23c, 28a-28c conductor, 22a-22i, 25a, 25d, 25g, 27a, 27d, 27g, 30
a, 30d, 30g contacts, 29a, 29d, 29g auxiliary contacts, 52a, 52d, 52g bump electrodes, 54a, 54d, 54g electrodes.

Claims (5)

[Claims] 1. A probe card having a plurality of contacts arranged at a distance from each other, one end of which is brought into contact with a device under test and the other end of which is connected to a measuring instrument, wherein the contacts are It is arranged according to the arrangement of the contact portion of the object to be measured, and an insulator is interposed between the conductors so that the conductors are held so that their positions are constant. And a probe card. 2. A probe card having a plurality of contacts arranged at a distance from each other, one end of which contacts the object to be measured and the other end of which is connected to a measuring instrument, wherein the contacts are A probe card, wherein a plurality of rows are formed in layers and a plate-shaped insulator is interposed between the contact rows. 3. Inside the insulator between the contact rows,
3. The probe card according to claim 2, further comprising a plate-shaped conductor facing the contact row, the conductor being electrically fixed at a constant potential. .. 4. The object to be measured is a chip formed in a wafer, and the row of the plurality of layered contacts has a quadrilateral shape so as to correspond to the arrangement of the contact parts in the chip. It is arranged, Claim 1, Claim 2 characterized by the above-mentioned.
Alternatively, the probe card according to claim 3. 5. The probe card according to claim 1, wherein the contactor has a strip shape.