JPH05123955A - Crystal piece polishing device - Google Patents

Abstract

PURPOSE:To rationalize the machining process of bevel polishing and improve work efficiency so as to heighten productivity by providing a polishing machine brought into sliding contact with a crystal wafer positioned on a base so as to polish the edge of intersection between a main face and a side face. CONSTITUTION:Crystal wafers 14 are respectively attached to the plate face on the opposite side to the contact face of an attached block 12, that is, onto its holding face, using fused paraffin or the like. The attached block 12 is then attracted to a base 11 by magnetic force and positioned correctly by the step difference of the inclined face. In this state, the crystal wafer 14 is brought into sliding contact with the peripheral edge part of a disc like polishing machine 15, for instance, to polish and remove the desired edges and to form the side end parts of the crystal wafer 14 into slant faces, thus performing the so-called bevel machining.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a crystal piece polishing apparatus for performing a Beval process for obliquely cutting an end portion of a crystal piece.

[0002]

2. Description of the Related Art For example, in a crystal resonator manufacturing process, a strip-shaped crystal wafer is cut out from a crystal of artificial quartz, and a blank corresponding to each crystal resonator is obtained from the crystal wafer. Conventionally, in this type of processing step, for example, when manufacturing an AT-cut crystal unit,
The artificial quartz is cut at a predetermined angle with respect to the crystal axis to obtain a plate-shaped quartz wafer having a thickness corresponding to a desired resonance frequency.
This crystal wafer 1 is a strip-shaped plate piece having a length of 30 mm, a width of 10 mm, and a thickness of about 0.5 mm, for example, as shown in FIG. Then, the lateral end of the crystal wafer 1 in the width direction is obliquely removed to form an inclined surface, and so-called Beval processing is performed. In this Beval process, as shown in FIG. 4, the main surface 1a of the crystal wafer 1 is bonded to the inclined surface 2a of the base 2 whose plate surface is formed in a sawtooth shape by using molten paraffin or the like. Then, for example, as shown in FIG. 5, the base 2 to which the crystal wafer 1 is adhered is brought into sliding contact with a polishing plate, for example, a rotary grindstone to polish the side end where the main surface and the side surface of the crystal wafer 1 intersect, that is, the ridge 1b. Then, the so-called Beval process is performed. The same operation is repeated four times to polish each edge 2b in the width direction of the crystal wafer 1 as shown in FIG. 6 to form a knife edge shape 1c having an angle of about 5 °. Then, the main surfaces 1a of a plurality of crystal wafers 1 each having a side edge in the width direction formed into a knife-edge shape 1c are sequentially bonded and stacked, and several tens of them are bonded. Then, using a multi-blade cutting machine in which a large number of blades (saw blades) are stretched in parallel at intervals corresponding to the cutting width, the crystal wafer 2 bonded as described above is moved in a predetermined direction in the longitudinal direction of the main surface. Simultaneously cut at intervals, for example a width of 2 mm, in the direction perpendicular to the main surface. Next, the crystal wafer 2 cut into a predetermined width is heated to melt the paraffin and separated into individual crystal pieces to obtain crystal blanks. The longitudinal direction of this crystal blank corresponds to the width direction of the crystal wafer 2 before cutting, and both ends of the crystal blank are beveled. Then, the paraffin adhering to the surface of the quartz blank is removed, and the paraffin is stored in a cylindrical container together with an abrasive, for example, and the cylindrical container is rotatably driven to remove the corners of the entire circumference to make the outer circumference rounded. Grind. Then, an excitation electrode is formed on the main surface of the crystal blank by vacuum vapor deposition or the like, held by a holding member, and the electrode is led out to the outside and sealed in an airtight container to complete the crystal oscillator.

In this way, since the thickness of the end portion of the blank is formed thin by the Beval process, vibration can be confined in the central portion of the plate surface and good vibration characteristics can be obtained. However, in such a case, the Beval process work of polishing and removing the ridge in the width direction of the quartz wafer is troublesome, and the productivity is remarkably reduced. That is, a ridge in the width direction of a plate-shaped crystal wafer with a thickness of about 0.5 mm must be ground and shaped into a knife edge with an angle of about 5 °. However, in such a processing step, since the side end portion of the thin crystal wafer has to be obliquely polished, there is a problem that damage such as cracking and chipping is likely to occur and becomes a bottleneck in the production process.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and requires no special skill by rationalizing the Beval process in the process of processing the crystal piece, and the defect at the time of manufacturing can be eliminated. It is an object of the present invention to provide a polishing device for a crystal piece, which is less likely to occur and which can enhance productivity.

[0005]

SUMMARY OF THE INVENTION According to the present invention, a crystal wafer is attached to the front surface of a plurality of attachment blocks which are removably inclined and arranged side by side on a base, and the crystal wafer is slidably brought into contact with a polishing plate. It is characterized in that the side edges are polished.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to a perspective view shown in FIG. 1 and a side view showing a state during a polishing operation shown in FIG. In the figure, 11 is a base made of a magnetic material such as iron, and one side surface thereof is provided with inclined surfaces 11a at regular intervals to form a sawtooth cross section. And each inclined surface 11
A block 12 is detachably attached to a. Each attachment block 12 has the same size and is made of a non-magnetic material such as brass or hard aluminum, and is molded into a substantially rectangular parallelepiped, and a plurality of magnets 13 are embedded in the contact surface with the base 11 with the same polarity. There is. And sticking block 12
The crystal wafer 14 is attached to the plate surface opposite to the contact surface, that is, the holding surface by using molten paraffin or the like. Since the surface of the base 11 that holds the attachment block 12 is formed in a sawtooth cross-section, the attachment block 12 is magnetically applied to the base 1.
It is possible to make it adhere to No. 1 and accurately position it by the step of the inclined surface. Then, in this state, for example, the crystal wafer 14 is slidably contacted with the peripheral edge of the disk-shaped polishing disk 15 to polish and remove a desired edge, and the side end of the crystal wafer 14 is formed into an inclined surface. , So-called Beval processing. In this case, the attachment block 12 is held in a direction in which it is pressed against the step of the base 11 by frictional resistance with respect to the rotation direction of the polishing plate 15. Then, the attachment block 12 is peeled off from the base 11 against the magnetic force, inverted, and adsorbed to the base 11 again, so that the ridge on the opposite side of the crystal wafer 14 can be polished. That is, if the sticking operation of the crystal wafer 14 to the sticking block 12 is performed once, two ridges can be beveled, and by performing the sticking work twice, all side end portions of the crystal wafer 14, that is, Four edges can be polished. Therefore, the pasting work was performed four times in the conventional work process, but according to the above-mentioned embodiment, the pasting work is required only twice, the number of the pasting work can be reduced by half, and the workability can be remarkably improved. ..

In this way, the work can be performed with efficiency more than twice as high as that in the case where the Beval polishing is performed using a corrugated plate jig as shown in FIG. 4, and the workability is remarkably increased. Can be improved. Then, by preparing a large number of attachment blocks in advance and attaching the crystal wafers to each of them, only the attachment blocks can be sequentially replaced with respect to one base, and the work can proceed. Is also good. Further, according to the above-mentioned embodiment, it is possible to dispose the crystal wafer on almost the entire surface of the base facing the polishing plate, and the maximum number of crystal wafers can be held on the base of a certain area for polishing. There is an advantage that it can be performed and work efficiency can be improved.

[0008]

As described above in detail, according to the present invention, it is possible to provide a crystal piece polishing apparatus which can streamline the processing steps of Beval polishing, have good working efficiency, and can enhance productivity.

[0009]

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is a side view showing bevel processing of the embodiment shown in FIG.

FIG. 3 is a perspective view showing an example of a crystal wafer.

FIG. 4 is a side view showing a conventional bevel processing jig.

FIG. 5 is a perspective view showing a conventional Beval process.

FIG. 6 is a perspective view of a quartz wafer obtained by conventional Beval processing.

[Explanation of symbols]

 11 Base 11a Inclined Surface 12 Attachment Block 13 Magnet 14 Crystal Wafer

Claims (1)

[Claims] 1. A base having a plurality of inclined surfaces having the same inclination angle formed on one side surface, a plurality of attachment blocks detachably arranged on the inclined surface of the base, and a front surface of each attachment block. 1. A crystal piece polishing apparatus comprising: a bonded crystal wafer; and a polishing plate for slidingly contacting the crystal wafer positioned by the base to polish an edge where a main surface and a side surface intersect with each other.