JPH05121584A - Integrated circuit package - Google Patents

Abstract

PURPOSE:To provide a microwave conformity integrated circuit package capable of being mounted to a circuit board without degrading its transmission characteristic in terms of an integrated circuit package, such as monolithic and bipolar integrated circuits. CONSTITUTION:This package is provided with a metal header 2 where an integrated circuit board is laid out on the front surface while an opening section is provided so as to penetrates both the front and the rear sides, a conductor pattern 3 formed on the front surface and an insulation board 1 laid out on the rear side of the metal header in such a fashion that the conductor pattern may be located at the opening section, thereby forming a coplanar type stripline with the metal header and the conductor pattern.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to integrated circuit packages such as monolithic ICs and hybrid ICs.

[0002]

2. Description of the Related Art As a conventional integrated circuit package,
For example, the structure shown in FIG. 3 is used ("IC
Packaging Technology "P137 Industrial Research Committee). This Figure 3
In the package for integrated circuit shown in FIG. 1, the metal header 2 is provided with a large number of leads 13 separated from each other via the glass 14.
The hybrid IC substrate 5 is placed on the hybrid IC substrate 5 and the leads 13 are connected to each other.
Is crowned.

When mounting such an integrated circuit package on a circuit board (not shown), the leads 1 of the circuit board are mounted.
Mounting is performed by forming a hole at a position corresponding to 3, and inserting the lead 13 into the hole and soldering.

[0004]

By the way, it is widely known that the impedance of the transmission line has an important meaning when forming a high frequency circuit. That is,
If there is a portion where the impedances are different from each other, a large reflection of the high-frequency signal occurs at the boundary, which deteriorates the transmission characteristics. In order to prevent this, it is necessary to match the impedance of the lines to be connected.

However, in the package as shown in FIG. 3, it is difficult to control the impedance of the portion of the lead 13, and therefore such a package is difficult to use in the microwave circuit. In view of the above problems, an object of the present invention is to provide a microwave-compatible integrated circuit package that can be mounted without degrading transmission characteristics.

[0006]

In order to achieve the above object, an integrated circuit package of the present invention is provided with a metal header having an opening penetrating to the front and back, on which an integrated circuit substrate is arranged, and a conductor pattern on the surface. And an insulating substrate disposed on the back surface side of the metal header so that the conductor pattern is located in the opening, and the metal header and the conductor pattern form a coplanar stripline. Is to

It is preferable that the integrated circuit board is covered with a metal cap that covers the integrated circuit board together with the metal header. An alumina substrate or the like is used as the insulating substrate.

[0008]

The integrated circuit package of the present invention has a coplanar structure with a metal header and a conductor pattern.
Since the shaped strip line is formed, the impedance of the strip line and the strip line on the circuit board can be matched, and the mounting can be performed without deteriorating the transmission characteristics. In addition, a long lead as shown in FIG. 3 is not used, and a part of the package (insulating substrate) is configured as a part of the circuit board. Therefore, it is possible to mount the circuit board in the shortest distance.

When the above metal cap is provided,
It has corrosion resistance and also prevents high-frequency noise from entering and leaking, so that it becomes a more excellent package for microwaves and has high reliability.

[0010]

EXAMPLES Examples of the present invention will be described below. FIG. 1 is a partial cross-sectional perspective view showing an embodiment of an integrated circuit package of the present invention, and FIG. 2 is a perspective view showing a state in which the integrated circuit package is mounted on a circuit board.

As shown in FIG. 1, a metal header 2 and a metal pin 4 are soldered to an alumina substrate 1 on which a conductor pattern 3 forming a coplanar strip line is printed. The hybrid IC substrate 5 is attached onto the metal header 2 with an adhesive, and is bonded with a wire 6 to connect the hybrid IC substrate 5 and the metal pin 4. A metal cap 9 is covered from above and attached by electrical resistance welding or the like. At this time, the insulating resin 8 is filled in advance so that a gap is not formed in the strip line portion.

In the hybrid IC package 15 manufactured in this way, as shown in FIG. 2, the package 15 is arranged on the circuit board 11 which is preliminarily provided with a hole into which the portion of the alumina substrate 1 of the package 15 is inserted. Then, the coplanar stripline of the package and the coplanar stripline of the circuit board 11 which are formed so as to have impedance matching with each other are soldered to each other. Further, the metal header 2 is screwed or soldered to the ground pattern 12 of the circuit board 11 to obtain an electrical connection, and the entire package 15 is fixed to the circuit board 11.

As described above, since the coplanar stripline of the package 15 and the coplanar stripline of the circuit board, which are formed so that their impedances are matched with each other, are connected, signal reflection may occur at the boundary. The package 15 is prevented, and the package 15 is mounted without degrading the transmission characteristics.

[0014]

As described above, the integrated circuit package of the present invention has a coplanar type package on an insulating substrate by bonding an insulating substrate such as an alumina substrate having a conductor pattern to a metal header. Since the strip line is formed, the integrated circuit package can be mounted without deteriorating the transmission characteristic by connecting the strip line on the circuit board by impedance matching and connecting the strip line. Further, when the IC substrate is covered with a metal cap and an insulator is filled in the gaps of the strip line portion, high airtightness can be secured, and internal corrosion and intrusion / leakage of high frequency noise can be prevented.

[Brief description of drawings]

FIG. 1 is a partial cross-sectional perspective view showing an embodiment of an integrated circuit package of the present invention.

FIG. 2 is a perspective view showing a state in which this integrated circuit package is mounted on a circuit board from the back side of the circuit board.

FIG. 3 is an exploded perspective view of a conventional integrated circuit package.

[Explanation of symbols]

1 Alumina Substrate 2 Metal Header 3 Conductor Pattern 4 Metal Pin 5 Hybrid IC Board 6 Bonding Wire 10 Solder 11 Circuit Board 12 Ground Pattern 15 Package

Front page continued (72) Inventor Sakae Furuyata 2270 Yokose, Yokose-cho, Chichibu-gun, Saitama Sanryo Materials Co., Ltd. Ceramics Research Laboratory (72) Kotaro Nose 2270 Yokose, Yokose-cho, Chichibu-gun, Saitama Ryo Materials Co., Ltd. Ceramics Research Center

Claims (2)

[Claims] 1. A metal header having an opening penetrating through the front surface and a back surface on which an integrated circuit board is disposed, and a conductor pattern formed on the surface, and the back surface of the metal header so that the conductor pattern is located in the opening. A package for an integrated circuit, comprising: an insulating substrate disposed on the side, and a coplanar stripline formed by the metal header and the conductor pattern. 2. The package for an integrated circuit according to claim 1, further comprising a metal cap that covers the integrated circuit board and covers the integrated circuit board together with the metal header.