JPH051206U - Laminated coil - Google Patents

Laminated coil

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Publication number
JPH051206U
JPH051206U JP4755691U JP4755691U JPH051206U JP H051206 U JPH051206 U JP H051206U JP 4755691 U JP4755691 U JP 4755691U JP 4755691 U JP4755691 U JP 4755691U JP H051206 U JPH051206 U JP H051206U
Authority
JP
Japan
Prior art keywords
conductor pattern
laminated
coil
conductor
conductor patterns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4755691U
Other languages
Japanese (ja)
Inventor
真人 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP4755691U priority Critical patent/JPH051206U/en
Publication of JPH051206U publication Critical patent/JPH051206U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】 【目的】 コイル状に接続された導体パターンの接続信
頼性が高い積層型コイルを得る。 【構成】 導体パターン5,6,7を設けた絶縁性基板
21,22,23を積層した積層物に穴12a,12b
を設け、この穴12a,12bに充填した半田や銀ペー
スト等の導電材13a,13bにて導体パターン5,
6,7をコイル状に接続した。この結果、導体パターン
5,6,7と導電材13a,13bは確実に接続され
る。
(57) [Abstract] [Purpose] To obtain a laminated coil having a highly reliable connection of conductor patterns connected in a coil shape. [Structure] Holes 12a, 12b are formed in a laminate in which insulating substrates 21, 22, 23 provided with conductor patterns 5, 6, 7 are laminated.
Are provided, and the conductive patterns 13a and 13b such as solder or silver paste filled in the holes 12a and 12b are used to form the conductor pattern 5.
6, 7 were connected in a coil shape. As a result, the conductor patterns 5, 6, 7 and the conductive materials 13a, 13b are reliably connected.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

本考案は、電源回路やフィルタ回路等に使用される積層型コイルに関する。 The present invention relates to a laminated coil used in a power supply circuit, a filter circuit or the like.

【0002】[0002]

【従来の技術と課題】[Prior art and problems]

従来、この種の積層型コイルは、穴を予め設けた絶縁材シートの表面に導電性 ペーストを印刷等の手段にて塗布し、導体パターンとスルーホールを一括して形 成していた。導体パターンとスルーホールが形成された絶縁材シートは積層され 、スルーホールを介して各導体パターンがコイル状に接続されていた。 Conventionally, in this type of laminated coil, a conductive pattern is applied to the surface of an insulating material sheet in which holes are provided in advance by printing or the like to collectively form a conductor pattern and through holes. The insulating material sheet in which the conductor pattern and the through hole are formed is laminated, and the conductor patterns are connected in a coil shape through the through hole.

【0003】 ところが、絶縁材シートのそり、ゆがみ等の問題により、スルーホールの導電 部分と導体パターンの接触が不安定となり、環境条件の厳しい場所でこのコイル を使用する場合、スルーホールと導体パターン間の接続信頼性に不安があった。 そこで、本考案の課題は、コイル状に接続された導体パターンの接続信頼性が 高い積層型コイルを提供することにある。However, due to problems such as warpage and distortion of the insulating material sheet, the contact between the conductive part of the through hole and the conductor pattern becomes unstable, and when this coil is used in a place where the environmental conditions are severe, the through hole and the conductor pattern are I was worried about the connection reliability between them. Therefore, an object of the present invention is to provide a laminated coil in which the conductor patterns connected in a coil shape have high connection reliability.

【0004】[0004]

【課題を解決するための手段と作用】[Means and actions for solving the problem]

以上の課題を解決するため、本考案に係る積層型コイルは、導体パターンと絶 縁体とを交互に積層した積層物に前記導体パターンが露出する穴を設け、この穴 に充填した導電材にて前記導体パターンをコイル状に接続したことを特徴とする 。 In order to solve the above problems, the laminated coil according to the present invention has a hole in which a conductor pattern is exposed in a laminate in which conductor patterns and insulators are alternately laminated, and a conductive material filled in the hole is formed. The conductor pattern is connected in a coil shape.

【0005】 穴壁に露出している導体パターンは、穴に充填された導電材を介してコイル状 に接続される。多少のそり等が発生しても、液体状の導電材を流し込むため、導 電材と穴壁に露出している導体パターンは確実に接続される。導電材は、溶融半 田や銀ペースト等を穴に流し込んだ後、硬化させて作製される。The conductor pattern exposed on the wall of the hole is connected in a coil shape through the conductive material filled in the hole. Even if some warpage occurs, the liquid conductive material is poured, so that the conductive material and the conductor pattern exposed on the hole wall are securely connected. The conductive material is prepared by pouring molten solder, silver paste, etc. into the holes and then curing the same.

【0006】[0006]

【実施例】 以下、本考案に係る積層型コイルの実施例を添付図面を参照して説明する。 [第1実施例、図1〜図3] まず、図1に示すように、エポキシ樹脂材等でできた絶縁性基板1,2,3が 準備される。各基板1,2,3の中央部には角穴1a,2a,3aが設けられて いる。基板1の上面には、導体パターン5が角穴1aの周囲部に印刷等の手段に て設けられている。導体パターン5の端部5a,5bは基板1の手前側端面に露 出している。同様にして、基板2,3の上面には導体パターン6,7が設けられ 、導体パターン6,7の端部6a,6b,7a,7bはそれぞれ基板2,3の手 前側端面に露出している。導体パターン5,6,7には、Cu,Ag,Ag−P d等の材料が使用される。[Embodiments] Hereinafter, embodiments of the laminated coil according to the present invention will be described with reference to the accompanying drawings. First Embodiment, FIGS. 1 to 3 First, as shown in FIG. 1, insulating substrates 1, 2 and 3 made of an epoxy resin material or the like are prepared. Square holes 1a, 2a, 3a are provided in the central portions of the respective substrates 1, 2, 3. A conductor pattern 5 is provided on the upper surface of the substrate 1 around the square hole 1a by means such as printing. The ends 5a and 5b of the conductor pattern 5 are exposed at the front end face of the substrate 1. Similarly, the conductor patterns 6 and 7 are provided on the upper surfaces of the substrates 2 and 3, and the end portions 6a, 6b, 7a and 7b of the conductor patterns 6 and 7 are exposed at the front end faces of the substrates 2 and 3, respectively. There is. Materials such as Cu, Ag, and Ag-Pd are used for the conductor patterns 5, 6, and 7.

【0007】 これらの基板1,2,3は、例えば絶縁性接着剤を介して、図2に示すような 積層物10とされる。角穴1a,2a,3aは、磁性体材料でできたコアを嵌め 込むための角穴10aとされる。この積層物10の手前側縁部には小円形穴12 a,12bが設けられている。小円形穴12a,12bの直径は、導体パターン 5,6,7の幅よりも小さくするのが好ましい。この穴12a,12bに溶融半 田や銀ペースト等を流し込んだ後、硬化することにより、穴12a,12bを充 填する導電材13a,13bが作製される。図3に示すように導電材13aは導 体パターン5の端部5bと導体パターン6の端部6aとを電気的に接続している 。同様に、導電材13bは導体パターン6の端部6bと導体パターン7の端部7 aとを電気的に接続している。こうして、導体パターン5,6,7は導電材13 a,13bを介してコイル状に接続されることになる。These substrates 1, 2 and 3 are made into a laminate 10 as shown in FIG. 2 with an insulating adhesive interposed, for example. The square holes 1a, 2a and 3a are used as square holes 10a into which a core made of a magnetic material is fitted. Small circular holes 12a and 12b are provided at the front edge of the laminate 10. The diameter of the small circular holes 12a, 12b is preferably smaller than the width of the conductor patterns 5, 6, 7. A conductive material 13a, 13b filling the holes 12a, 12b is produced by pouring a molten solder, a silver paste or the like into the holes 12a, 12b and then hardening. As shown in FIG. 3, the conductive material 13a electrically connects the end 5b of the conductor pattern 5 and the end 6a of the conductor pattern 6. Similarly, the conductive material 13b electrically connects the end portion 6b of the conductor pattern 6 and the end portion 7a of the conductor pattern 7. In this way, the conductor patterns 5, 6, 7 are connected in a coil shape via the conductive materials 13a, 13b.

【0008】 この後、積層物10の表面に導体パターン5,6,7の端部5a,5b,6a ,6b,7a,7bに電気的に接続する外部電極が設けられ、かつ、角穴10a にコアが嵌め込まれて積層型コイルとされる。こうして、コイル状に接続された 導体パターンの接続信頼性が高い積層型コイルが得られる。 [第2実施例、図4] 本実施例は、コイルの巻き回数を増やすために導体パターンを渦巻き状にした ものである。図4には小角穴を設けた後の積層物を分解した状態が示されている 。絶縁性基板21,22,23の中央部にはそれぞれ角穴24が設けられ、この 角穴24の周囲部には渦巻き状の導体パターン25,26,27が設けられてい る。基板21,22,23のそれぞれの手前側には小角形穴28a,28b,2 8c,28dが同じ位置に設けられている。導体パターン25の端部は小角形穴 28a,28bを囲み、同様に、導体パターン26及び27の端部は小角形穴2 8b,28c及び28d,28cを囲んでいる。以上の構成により、各基板21 ,22,23が積層されて小角形穴28a〜28dに導電材が充填された状態で は、導体パターン25,26,27は導電材を介してコイル状に接続されること となる。Thereafter, external electrodes electrically connected to the ends 5a, 5b, 6a, 6b, 7a, 7b of the conductor patterns 5, 6, 7 are provided on the surface of the laminate 10, and the square holes 10a are provided. The core is fitted into the to form a laminated coil. In this way, a laminated coil having a highly reliable connection of the conductor patterns connected in a coil shape can be obtained. [Second Embodiment, FIG. 4] In this embodiment, the conductor pattern has a spiral shape in order to increase the number of windings of the coil. FIG. 4 shows a state in which the laminate is disassembled after the small square holes are provided. Square holes 24 are provided in the central portions of the insulating substrates 21, 22, 23, respectively, and spiral conductor patterns 25, 26, 27 are provided around the square holes 24. Small square holes 28a, 28b, 28c, 28d are provided at the same position on the front side of each of the substrates 21, 22, 23. The ends of the conductor pattern 25 surround the small square holes 28a and 28b, and similarly, the ends of the conductor patterns 26 and 27 surround the small square holes 28b, 28c and 28d, 28c. With the above configuration, the conductor patterns 25, 26, 27 are connected in a coil shape through the conductive material in a state where the substrates 21, 22, 23 are stacked and the small square holes 28a to 28d are filled with the conductive material. Will be done.

【0009】 こうして得られる積層型コイルは、前記第1実施例の作用効果に加えて、巻き 回数が多いコイルとなる。 [他の実施例] なお、本考案に係る積層型コイルは、前記実施例に限定するものではなく、そ の要旨の範囲内で種々に変形することができる。The laminated coil thus obtained is a coil having a large number of turns in addition to the effects of the first embodiment. [Other Embodiments] The laminated coil according to the present invention is not limited to the above-mentioned embodiment, and can be variously modified within the scope of the invention.

【0010】 コイルの巻き回数をさらに増やすには導体パターンを設けた絶縁性基板の枚数 を増やせばよい。 また、前記実施例のように、導体パターンと絶縁性基板との積層に必ずしも接 着剤を使用する必要はなく、導体パターンと絶縁性基板をコアで挟んで積層した り、積み重ねた導体パターンと絶縁性基板とに接着テープを巻き回して積層して もよい。In order to further increase the number of windings of the coil, the number of insulating substrates provided with the conductor pattern may be increased. Further, as in the above-mentioned embodiment, it is not always necessary to use an adhesive for laminating the conductor pattern and the insulating substrate, and the conductor pattern and the insulating substrate are sandwiched between cores and laminated, or a conductor pattern is stacked. An adhesive tape may be wound around the insulating substrate and laminated.

【0011】[0011]

【考案の効果】[Effect of the device]

以上の説明で明らかなように、本考案によれば、導体パターンと絶縁体とを交 互に積層した積層物に穴を設け、この穴に充填した導電材にて前記導体パターン をコイル状に接続したため、導体パターンと導電材は確実に接続される。その結 果、コイル状に接続された導体パターンの接続信頼性が高い積層型コイルが得ら れる。 As is apparent from the above description, according to the present invention, a hole is formed in a laminate in which a conductor pattern and an insulator are alternately laminated, and the conductor pattern is coiled with a conductive material filled in the hole. Since the connection is made, the conductor pattern and the conductive material are surely connected. As a result, a laminated coil having a highly reliable connection of the conductor patterns connected in a coil shape can be obtained.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本考案に係る積層型コイルの第1実施例を示
すもので、積層前の状態を示す斜視図。
FIG. 1 is a perspective view showing a first embodiment of a laminated coil according to the present invention, showing a state before lamination.

【図2】 図1に示した積層型コイルの積層後の状態を
示す斜視図。
FIG. 2 is a perspective view showing a state after the laminated coil shown in FIG. 1 is laminated.

【図3】 図2のX−X’の垂直断面図。FIG. 3 is a vertical cross-sectional view taken along line X-X ′ of FIG.

【図4】 本考案に係る積層型コイルの第2実施例を示
すもので、積層後の状態を示す分解斜視図。
FIG. 4 is an exploded perspective view showing a laminated coil according to a second embodiment of the present invention and showing a state after lamination.

【符号の説明】[Explanation of symbols]

1,2,3…絶縁性基板 5,6,7…導体パターン 12a,12b…穴 13a,13b…導電材 21,22,23…絶縁性基板 25,26,27…導体パターン 28a,28b,28c,28d…穴 1, 2, 3 ... Insulating substrate 5, 6, 7 ... Conductor pattern 12a, 12b ... Hole 13a, 13b ... Conductive material 21, 22, 23 ... Insulating substrate 25, 26, 27 ... Conductor pattern 28a, 28b, 28c , 28d ... hole

Claims (1)

【実用新案登録請求の範囲】 【請求項1】 導体パターンと絶縁体とを交互に積層し
た積層物に前記導体パターンが露出する穴を設け、この
穴に充填した導電材にて前記導体パターンをコイル状に
接続したことを特徴とする積層型コイル。
[Claims for utility model registration] [Claim 1] A hole in which the conductor pattern is exposed is formed in a laminate in which conductor patterns and insulators are alternately laminated, and the conductor pattern is filled with a conductive material. A laminated coil characterized by being connected in a coil shape.
JP4755691U 1991-06-24 1991-06-24 Laminated coil Pending JPH051206U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4755691U JPH051206U (en) 1991-06-24 1991-06-24 Laminated coil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4755691U JPH051206U (en) 1991-06-24 1991-06-24 Laminated coil

Publications (1)

Publication Number Publication Date
JPH051206U true JPH051206U (en) 1993-01-08

Family

ID=12778461

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4755691U Pending JPH051206U (en) 1991-06-24 1991-06-24 Laminated coil

Country Status (1)

Country Link
JP (1) JPH051206U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104051125A (en) * 2013-03-14 2014-09-17 Tdk株式会社 Electronic component and manufacturing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104051125A (en) * 2013-03-14 2014-09-17 Tdk株式会社 Electronic component and manufacturing method thereof
JP2014179453A (en) * 2013-03-14 2014-09-25 Tdk Corp Electronic component and method of manufacturing the same

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