JPH0511575U - Wireless unit - Google Patents
Wireless unitInfo
- Publication number
- JPH0511575U JPH0511575U JP063340U JP6334091U JPH0511575U JP H0511575 U JPH0511575 U JP H0511575U JP 063340 U JP063340 U JP 063340U JP 6334091 U JP6334091 U JP 6334091U JP H0511575 U JPH0511575 U JP H0511575U
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- antenna type
- type wireless
- component
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
(57)【要約】
【目的】 コードレス電話等で用いられる各種の無線ユ
ニットの回路基板を共通化しコストダウンを図る。
【構成】 回路基板１０内に外付アンテナ型無線回路部
２０を構成する部品及び内蔵アンテナ型無線回路部３０
を構成する部品を全て実装できるようにパターン設計す
る。すなわち、共通部品の実装部１２には各回路部に共
通の部品が全て実装できるようにし、また、各回路部の
選択部品の実装部１１には、例えば外付アンテナ型無線
回路部２０の部品が実装される場合は、外付アンテナ型
無線回路部２０に特有の部品のみが実装されて他の回路
部品は実装されず、また、内蔵アンテナ型無線回路部３
０の各部品が実装される場合には、内蔵アンテナ型無線
回路部３０特有の部品のみが実装されて他の回路部品は
実装されないようにする。
(57) [Summary] [Purpose] To reduce costs by standardizing the circuit boards of various wireless units used in cordless telephones. [Structure] Components forming the external antenna type wireless circuit unit 20 in the circuit board 10 and the built-in antenna type wireless circuit unit 30.
The pattern is designed so that all the components that make up can be mounted. That is, all the components common to each circuit unit can be mounted on the common component mounting unit 12, and, for example, the component of the external antenna type wireless circuit unit 20 can be mounted on the mounting unit 11 of the selected component of each circuit unit. Is mounted, only the components unique to the external antenna type wireless circuit unit 20 are mounted and the other circuit components are not mounted, and the built-in antenna type wireless circuit unit 3 is mounted.
When each component of 0 is mounted, only the component specific to the built-in antenna type wireless circuit unit 30 is mounted and the other circuit components are not mounted.
Description
【０００１】[0001]
本考案は、コードレス電話等に用いられる無線ユニットに関するものである。 The present invention relates to a wireless unit used in a cordless telephone or the like.
【０００２】[0002]
一般に無線ユニットには、図３（ａ）に示すような外付アンテナ型の無線回路 部２０からなる無線ユニットと、同図（ｂ）に示すような内蔵アンテナ型の無線 回路部３０からなる無線ユニットとがある。同図において、１〜３はそれぞれ異 なる機能を有するアンテナマッチング回路、４はデュプレクサ、５は送信系回路 、６は受信系回路である。これらの無線ユニットは、アンテナマッチング回路の 機能がそれぞれ異なるために、従来は、２種類の基板を作成して各無線ユニット の回路部品をそれぞれの基板に実装するか、或いは、アンテナマッチング回路部 品を実装すべき基板を２種類作成しこれらにそれぞれの回路部品を実装したのち 無線ユニットの外部に組み込むようにしている。 Generally, the wireless unit includes a wireless unit including an external antenna type wireless circuit unit 20 as shown in FIG. 3A and a built-in antenna type wireless circuit unit 30 as shown in FIG. 3B. There is a unit. In the figure, 1 to 3 are antenna matching circuits having different functions, 4 is a duplexer, 5 is a transmission system circuit, and 6 is a reception system circuit. Since these wireless units have different antenna matching circuit functions, conventionally, two types of boards are created and the circuit components of each wireless unit are mounted on the respective boards, or the antenna matching circuit parts are used. Two types of boards to be mounted are created, and the respective circuit components are mounted on these boards, and then they are installed outside the wireless unit.
【０００３】[0003]
従来の無線ユニットはそれぞれ異なるタイプの基板を設けているため、コスト アップを招来すると共に、基板の種類が増加してその管理が面倒になり、また、 多種類の基板を組み立てることになるため、組立工数が余分にかかるという問題 があった。 Conventional wireless units have different types of boards, which increases costs, increases the number of board types, makes management difficult, and assembles many types of boards. There was a problem that it took extra assembly time.
【０００４】[0004]
上述の課題を解決するために本考案は、外付アンテナ型の無線回路部品及び内 蔵アンテナ型の無線回路部品を同一基板内に搭載する手段を備えたものである。 In order to solve the above problems, the present invention comprises means for mounting an external antenna type wireless circuit component and an internal antenna type wireless circuit component on the same substrate.
【０００５】[0005]
同一基板上に外付アンテナ型の無線回路部品及び内蔵アンテナ型の無線回路部 品が搭載された結果、基板の種類を少なく抑えることが可能となり、装置のコス トダウンが可能になると共に、基板の管理工数や組立工数を少なく抑えることが 可能となる。 As a result of mounting the external antenna type wireless circuit parts and the built-in antenna type wireless circuit parts on the same board, it is possible to reduce the number of board types and reduce the cost of the device, It is possible to reduce management man-hours and assembly man-hours.
【０００６】[0006]
以下、本考案について図面を参照して説明する。 図１（ａ）は、本考案の無線ユニットの一実施例を示す構成図である。同図に おいて、１は外付アンテナ型の無線回路に用いられる送受信兼用のアンテナマッ チング回路、２は内蔵アンテナ型の無線回路に用いられる送信用のアンテナマッ チング回路、３は同様に内蔵アンテナ型の無線回路に用いられる受信用のアンテ ナマッチング回路、４は双方の無線回路に共通に用いられるデュプレクサ、５， ６は同様に双方の無線回路に共通に用いられる送信系回路及び受信系回路、７は ハンダパターン部、１０は回路基板である。 Hereinafter, the present invention will be described with reference to the drawings. FIG. 1A is a block diagram showing an embodiment of a wireless unit of the present invention. In the figure, 1 is an antenna matching circuit for transmitting and receiving used in an external antenna type wireless circuit, 2 is an antenna matching circuit for transmission used in a built-in antenna type wireless circuit, and 3 is also built in. An antenna matching circuit for reception used in an antenna type radio circuit, 4 is a duplexer commonly used by both radio circuits, and 5 and 6 are transmission system circuits and reception systems commonly used by both radio circuits. A circuit, 7 is a solder pattern portion, and 10 is a circuit board.
【０００７】 即ち、回路基板１０内に外付アンテナ型無線回路部２０を構成する部品及び内 蔵アンテナ型無線回路部３０を構成する部品を全て実装できるようにパターン設 計して部品を実装し、図中のＡ，Ｂのシルク印刷部の近傍のハンダパターン部７ にチップ抵抗を実装することにより、この回路基板１０に実装された部品が外付 アンテナ型無線回路部２０の部品であるかまたは内蔵アンテナ型無線回路部３０ の部品であるかを識別できるようにしたものである。 即ち例えば、外付アンテナ型無線回路部品を回路基板１０に実装しようとする 場合は、アンテナマッチング回路１、デュプレクサ４、送信系回路５及び受信系 回路６の各部品を実装すると共に、図１（ｂ）に示すように、シルク印刷部Ａと 対応するハンダパターン部７にチップ抵抗８を実装するようにしたものである。 このようなチップ抵抗８を実装することにより、部品が実装された回路基板１ ０を試験を行う基板チェッカーは、この回路基板１０が外付アンテナ型無線回路 部２０の部品が実装された基板であるかまたは内蔵アンテナ型無線回路部３０の 部品が実装された基板であるかを自動的に識別することができ、回路基板を試験 する場合その試験効率を向上させることができる。That is, all the components forming the external antenna type wireless circuit unit 20 and the components forming the internal antenna type wireless circuit unit 30 are designed and mounted on the circuit board 10 by patterning. By mounting a chip resistor on the solder pattern portion 7 near the A and B silk-printed portions in the drawing, is the component mounted on this circuit board 10 a component of the external antenna type wireless circuit unit 20? Alternatively, it is possible to identify whether it is a component of the built-in antenna type wireless circuit section 30. That is, for example, when an external antenna type wireless circuit component is to be mounted on the circuit board 10, each component of the antenna matching circuit 1, the duplexer 4, the transmission system circuit 5 and the reception system circuit 6 is mounted, and at the same time as shown in FIG. As shown in b), the chip resistor 8 is mounted on the solder pattern portion 7 corresponding to the silk printing portion A. A board checker that tests the circuit board 10 on which components are mounted by mounting such chip resistors 8 is a circuit board 10 on which the components of the external antenna type wireless circuit unit 20 are mounted. It is possible to automatically identify whether there is a built-in antenna type wireless circuit section 30 or a board on which the component is mounted, and when testing the circuit board, the test efficiency can be improved.
【０００８】 また、図２は、無線ユニットの各部品が実装される回路基板１０の構成図であ る。同図に示すように、回路基板１０内の各ハンダパターン部７の近傍には、そ れぞれ、このハンダパターン部に実装される例えばコンデンサＣ４，Ｃ６及び抵 抗Ｒ３，Ｒ５等の各部品名がシルク印刷されているとともに、ハンダパターン部 間には「−」印や「＝」印のシルク印刷が施されている。この「−」印のシルク 印刷の印刷箇所１２には外付アンテナ型無線回路部２０及び内蔵アンテナ型無線 回路部３０のうちの共通の部品が実装されることを意味し、また、「＝」印の印 刷箇所１１には双方の無線回路部のうちこれらの回路に特有な部品（選択的実装 部品）のみが実装されることを意味している。即ち、共通部品の実装箇所には各 回路部に共通な部品が全て実装され、また、選択実装部品の実装箇所には、例え ばこの回路基板１０に外付アンテナ型無線回路部２０の各部品が実装される場合 には外付アンテナ型無線回路部２０に特有の部品のみが実装されて他の回路部の 部品は実装されず、また逆に、内蔵アンテナ型無線回路部３０の各部品が回路基 板１０に実装される場合には内蔵アンテナ型無線回路部３０に特有の部品のみが 実装されて他の回路部の部品は実装されない。 そして、上記のシルク印刷にしたがって部品が実装された後、この部品実装さ れた基板１０を検査した場合、１箇所でも共通部品実装箇所（上記の「−」印の シルク印刷箇所」）に部品が実装されていないときには、直ちに実装不良として 判定することが可能になるとともに、部品不実装箇所が一目瞭然に識別できる。 このため、共通部品点数が各回路特有の部品点数よりも多いこの種の無線回路の ような場合には、その部品の実装点検を短時間で行うことが可能となる。 また、選択的実装部品の実装箇所（上記の「＝」印のシルク印刷箇所」）に部 品が実装されていない場合は、従来どおり、その周辺にシルク印刷されている部 品名と回路部品表とを照らし合わせて、実装の可否をチェックする。FIG. 2 is a configuration diagram of the circuit board 10 on which each component of the wireless unit is mounted. As shown in the figure, in the vicinity of each solder pattern portion 7 in the circuit board 10, the names of the parts such as capacitors C4 and C6 and resistors R3 and R5 mounted on the solder pattern portion are respectively provided. Is silk-printed, and "-" and "=" marks are silk-printed between the solder pattern parts. This means that a common part of the external antenna type wireless circuit unit 20 and the built-in antenna type wireless circuit unit 30 is mounted on the silk-printed printed portion 12 of the “−” mark. This means that only the parts (selective mounting parts) peculiar to these circuits are mounted on the printed part 11 of the mark in both wireless circuit parts. That is, all the components common to the respective circuit parts are mounted at the mounting positions of the common parts, and the mounting parts of the selective mounting components are, for example, the respective parts of the external antenna type wireless circuit part 20 on the circuit board 10. Is mounted, only the components unique to the external antenna type wireless circuit unit 20 are mounted and the components of the other circuit units are not mounted. Conversely, each component of the built-in antenna type wireless circuit unit 30 is mounted. When it is mounted on the circuit board 10, only components specific to the built-in antenna type wireless circuit unit 30 are mounted, and components of other circuit units are not mounted. Then, after the components are mounted according to the above-mentioned silk printing, when the substrate 10 on which the components are mounted is inspected, the component is mounted on the common component mounting location (the above-mentioned “-” silk-printing location ”) even at one location. When is not mounted, it is possible to immediately determine that there is a mounting failure, and it is possible to identify the component non-mounting location at a glance. Therefore, in the case of this type of wireless circuit in which the number of common components is larger than the number of components peculiar to each circuit, the mounting inspection of the components can be performed in a short time. If the component is not mounted at the mounting location of the selectively mounted component (the silk-printed location marked with “=” above), the component name and circuit component table printed on the periphery are printed as before. Check the implementation by comparing with and.
【０００９】 このように、従来、複数種の基板を用意し、外付アンテナ型無線回路部２０の 各部品及び内蔵アンテナ型無線回路部３０の各部品をそれぞれ個別に実装してい たものを１種類の基板に実装できるようにして、基板の共通化を図り、基板の種 類を減らすことによるコストダウン及び基板の組立工数及び検査工数等を削減す るようにしたものである。As described above, conventionally, a plurality of types of substrates are prepared, and each component of the external antenna type wireless circuit unit 20 and each component of the built-in antenna type wireless circuit unit 30 are individually mounted. The board can be mounted on different types of boards so that the boards can be used in common, the cost is reduced by reducing the kinds of boards, and the number of board assembling steps and inspection steps are reduced.
【００１０】[0010]
以上説明したように本考案の無線ユニットは、同一基板上に外付アンテナ型の 無線回路部品及び内蔵アンテナ型の無線回路部品を搭載するようにしたので、基 板の種類を少なく抑えることが可能となり、装置のコストダウンが可能になると 共に、基板の管理工数や組立工数を低減させることが可能になるという効果があ る。 As described above, in the wireless unit of the present invention, the external antenna type wireless circuit component and the built-in antenna type wireless circuit component are mounted on the same substrate, so the number of types of substrates can be reduced. As a result, the cost of the device can be reduced, and the man-hours for managing and assembling the board can be reduced.
【図１】本考案に係る無線ユニットの一実施例を示す回
路の構成図である。FIG. 1 is a circuit configuration diagram showing an embodiment of a wireless unit according to the present invention.
【図２】上記無線ユニットの回路基板の構成図である。FIG. 2 is a configuration diagram of a circuit board of the wireless unit.
【図３】従来の無線ユニットの回路の構成図である。FIG. 3 is a configuration diagram of a circuit of a conventional wireless unit.
１ 送受信兼用アンテナマッチング回路 ２ 送信用アンテナマッチング回路 ３ 受信用アンテナマッチング回路 ４ デュプレクサ ５ 送信系回路 ６ 受信系回路 ７ ハンダパターン部 ８ チップ抵抗 １０ 回路基板 １１ 選択的部品の実装部 １２ 共通部品の実装部 1 Antenna matching circuit for both transmission and reception 2 Antenna matching circuit for transmission 3 Antenna matching circuit for reception 4 Duplexer 5 Transmission system circuit 6 Reception system circuit 7 Solder pattern part 8 Chip resistance 10 Circuit board 11 Selective component mounting part 12 Common component mounting Department
Claims (1)
テナ型の無線回路または内蔵アンテナ型の無線回路によ
り高周波信号の送受を行う無線ユニットにおいて、 前記外付アンテナ型の無線回路の部品及び内蔵アンテナ
型の無線回路の部品を同一基板内に搭載する手段を備
え、基板を共通化したことを特徴とする無線ユニット。Claims for utility model registration 1. A wireless unit used for a cordless telephone or the like for transmitting and receiving a high frequency signal by an external antenna type wireless circuit or a built-in antenna type wireless circuit, comprising: A wireless unit comprising means for mounting a wireless circuit component and a built-in antenna type wireless circuit component on the same substrate, and sharing the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991063340U JP2589381Y2 (en) | 1991-07-17 | 1991-07-17 | Wireless unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991063340U JP2589381Y2 (en) | 1991-07-17 | 1991-07-17 | Wireless unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0511575U true JPH0511575U (en) | 1993-02-12 |
| JP2589381Y2 JP2589381Y2 (en) | 1999-01-27 |
Family
ID=13226414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1991063340U Expired - Fee Related JP2589381Y2 (en) | 1991-07-17 | 1991-07-17 | Wireless unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2589381Y2 (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5048173A (en) * | 1973-08-31 | 1975-04-30 | ||
| JPS55149972U (en) * | 1979-04-13 | 1980-10-29 | ||
| JPS584952A (en) * | 1981-07-01 | 1983-01-12 | Toshiba Corp | Semiconductor device |
| JPS6221636U (en) * | 1985-07-25 | 1987-02-09 | ||
| JPS648852U (en) * | 1987-07-07 | 1989-01-18 | ||
| JPH02116228A (en) * | 1988-10-26 | 1990-04-27 | Nec Corp | Portable radio equipment |
-
1991
- 1991-07-17 JP JP1991063340U patent/JP2589381Y2/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5048173A (en) * | 1973-08-31 | 1975-04-30 | ||
| JPS55149972U (en) * | 1979-04-13 | 1980-10-29 | ||
| JPS584952A (en) * | 1981-07-01 | 1983-01-12 | Toshiba Corp | Semiconductor device |
| JPS6221636U (en) * | 1985-07-25 | 1987-02-09 | ||
| JPS648852U (en) * | 1987-07-07 | 1989-01-18 | ||
| JPH02116228A (en) * | 1988-10-26 | 1990-04-27 | Nec Corp | Portable radio equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2589381Y2 (en) | 1999-01-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6045368A (en) | Means for accurately aligning and attaching an electrical part to a surface mount circuit | |
| EP0856740A1 (en) | PCB testing system | |
| US4080512A (en) | Substrate for integrated circuit | |
| JPH0511575U (en) | Wireless unit | |
| US4741472A (en) | Method of soldering an integrated circuit and printed circuit board | |
| JPH04303988A (en) | Printed wiring board | |
| JPH05121849A (en) | Printed board | |
| KR100208243B1 (en) | Apparatus for confirming printed circuit board mounting position in full electronic switching system | |
| JP2002076543A (en) | Printed board | |
| KR100208244B1 (en) | Method for confirming printed circuit board mounting position in full electronic switching system | |
| JPH0546294Y2 (en) | ||
| JPS6055031B2 (en) | IC measurement socket adapter | |
| JPH0625981Y2 (en) | Ceramic substrate | |
| JPH02237091A (en) | Printed wiring board | |
| JP2519283Y2 (en) | Card Module | |
| JPH0593072U (en) | Printed circuit board modification module | |
| JPH0448681A (en) | Electronic circuit board and its manufacture | |
| JPH03145789A (en) | Hybrid integrated circuit | |
| JPH0720624Y2 (en) | Electronics | |
| JPH0328549Y2 (en) | ||
| JPH058975U (en) | Printed board | |
| JPH0650990Y2 (en) | Lead terminal parts | |
| JPH03169093A (en) | Electronic component mounting device | |
| JPH04111782U (en) | printed wiring board | |
| JPH058974U (en) | Printed board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R323111 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| LAPS | Cancellation because of no payment of annual fees |