JPH05112768A - Heat-resistant adhesive and method of bonding therewith - Google Patents

Abstract

PURPOSE:To obtain the title adhesive capable of bonding at low temperatures and low pressure and excellent in adhesiveness by incorporating a polyamic acid and/or a polyimide each terminated with a specified compound and comprising specified repeating units. CONSTITUTION:The title adhesive comprises a polyamic acid and/or a polyimide each terminated with an aromatic dicarboxylic acid anhydride of formula I (wherein Z is a bivalent group selected from among monocyclic and fused polycyclic aromatic groups and nonfused polycyclic aromatic groups consisting of aromatic groups bonded to each other directly or through bridging members and comprising repeating units of formula II [wherein Y is a group of formula III or IV (wherein X is a direct bond, -CO- or -O-)].

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat resistant adhesive and a bonding method using the adhesive. In particular, in the fields of electricity and electronics, the present invention relates to a polyimide-based adhesive that can be bonded at low temperature and low pressure, and is particularly excellent in adhesiveness and heat resistance, and a bonding method using the adhesive.

[0002]

2. Description of the Related Art As adhesives for various high-performance materials used in the fields of electronics, aerospace equipment, transportation equipment, etc., heat-resistant adhesives made of organic synthetic polymers have been known more than ever before. Among them, polybenzimidazole-based and polyimide-based adhesives have been developed as those having excellent heat resistance. In particular, as a polyimide-based heat-resistant adhesive, USP 4,065,345 and JP-A-61-1 have been used as those having excellent heat resistance and adhesive strength.
The adhesive disclosed in 43477 and the like is known. Although these heat-resistant adhesives have excellent heat resistance and adhesiveness, they require high-temperature and high-pressure adhesion conditions in order to obtain a good adhesion state. In addition, these polyimide-based adhesives, when used, apply a solution of a polyamic acid, which is a precursor thereof, to an adherend, perform solvent removal and imidization, and then dry it to obtain another adherend. At high temperature, a method of adhering under high pressure adhesion conditions, or after processing the polyimide into a film, or after isolation and purification as a powder,
A method of inserting these between adherends and adhering them under high-temperature and high-pressure adhering conditions has been performed.

Polyimide is a polymer material having excellent heat resistance obtained by polycondensation of aromatic diamine and aromatic tetracarboxylic dianhydride, and various polyimides are known. Among these polyimides, the following polyimides are already known as polyimides using 1,3-bis (3-aminophenoxy) benzene as a diamine component. For example, (1) having a terminal acetylene group produced from 1,3-bis (3-aminophenoxy) benzene, 3,3 ′, 4,4′-benzophenone tetracarboxylic dianhydride and 3-aminophenylacetylene Polyimide oligomers (N, Biow et al., USP 3,845,018 and USP 3,879,349), (2) Polycondensation polyimides composed of 1,3-bis (3-aminophenoxy) benzene and pyrimellitic anhydride (T. P. Gannett et al., US
P4,485,140), (3) 1,3-bis (3-aminophenoxy) benzene and various tetracarboxylic acid dianhydrides, which are heat-resistant adhesives (JP-A-61-143,477 and JP-A-61-143,477). 61-291, 670) and the like.

(1) is an addition type thermosetting polyimide in which the oligomer ends are capped with 3-aminophenylacetylene, but these terminal acetylene groups undergo a crosslinking reaction by heat treatment, and (2) ) Is a condensation type polyimide using 1,3-bis (3-aminophenoxy) benzene as a raw material monomer, and is characterized by using pyromellitic dianhydride as a tetracarboxylic acid dianhydride component, and (3) is a heat-resistant adhesive composed of 1,3-bis (3-aminophenoxy) benzene and various tetracarboxylic dianhydrides, but a reactive end group remains at the polymer molecule end, As a heat resistant adhesive,
Adhesive conditions of high temperature and high pressure are required.

[0005]

SUMMARY OF THE INVENTION An object of the present invention is to provide a polyimide-based adhesive having a milder bonding condition than the conventional bonding condition and having an excellent bonding effect, and a bonding method using this adhesive. It is an object of the present invention to provide an adhesive that does not require a complicated adhesive operation and an adhesive method using the same.

[0006]

Means for Solving the Problems As a result of intensive studies for solving the above-mentioned problems, the present inventors have found that a polyimide having a repeating structural unit described later has a lower temperature and a lower temperature than conventional polyimide adhesives. It is possible to bond under pressure bonding conditions, and as the adhesive, this polyimide and / or its precursor polyamic acid can be used.
Further, they have found that the use of a solution in which this polyimide dissolves an organic solvent as an adhesive provides a more excellent adhesive effect, and completed the present invention.

That is, according to the present invention, the polymer molecule terminal is represented by the formula (1):

[Chemical 21] (In the formula, Z is selected from the group consisting of a monocyclic aromatic group, a condensed polycyclic aromatic group, and a non-condensed polycyclic aromatic group in which the aromatic groups are connected to each other directly or by a bridging member. An aromatic dicarboxylic acid anhydride represented by a divalent group),

And / or equation (3)

[Chemical formula 22] (In the formula, Q is selected from the group consisting of a monocyclic aromatic group, a condensed polycyclic aromatic group, and a non-condensed polycyclic aromatic group in which the aromatic groups are connected to each other directly or by a bridging member. A monovalent group), which is sealed with an aromatic monoamine represented by the formula (2)

[Chemical formula 23] [Where Y is

[Chemical formula 24] Or

[Chemical 25] (Wherein X represents a direct bond, a divalent group of —CO— or —O—), and a heat resistant adhesive containing a polyamic acid and / or a polyimide having a repeating structural unit represented by Agent,

Further, the polymer molecule end has the formula (1)

[Chemical formula 26] (In the formula, Z is selected from the group consisting of a monocyclic aromatic group, a condensed polycyclic aromatic group, and a non-condensed polycyclic aromatic group in which the aromatic groups are connected to each other directly or by a bridging member. An aromatic dicarboxylic acid anhydride represented by a divalent group) and / or formula (3)

[Chemical 27] (In the formula, Q is selected from the group consisting of a monocyclic aromatic group, a condensed polycyclic aromatic group, and a non-condensed polycyclic aromatic group in which the aromatic groups are connected to each other directly or by a bridging member. A monovalent group), which is sealed with an aromatic monoamine represented by the formula (2)

[Chemical 28] [Where Y is

[Chemical 29] (Wherein, X represents a direct bond, a divalent group of —CO— or —O—), and a polyimide having a repeating structural unit represented by the above is dissolved and contained in a solvent that dissolves the polyimide. Is a polyimide heat resistant adhesive and a solution thereof. still,
The polyimide constituting the polyimide heat-resistant adhesive may contain a polyamic acid as a precursor thereof within a range not impairing the characteristics of the heat-resistant adhesive of the present application.

In the above polyamic acid or polyimide, phthalic anhydride is particularly preferable as the aromatic dicarboxylic acid anhydride used for capping the ends of the polymer molecules, and aniline is particularly preferable as the aromatic monoamine. To be done.

The polyimide used as the adhesive of the present invention is, as a known polyimide, 1,3-bis (3
-Aminophenoxy) benzene, 3,3 ', 4,4'-benzophenone tetracarboxylic acid dianhydride and a polyimide oligomer having a terminal acetylene group, which is produced from 3-aminophenylacetylene, is
-Different in that it is an addition type thermosetting polyimide that is sealed with aminophenylacetylene, and these terminal acetylene groups undergo a cross-linking reaction by heat treatment.
Polycondensation-type polyimide composed of 1,3-bis (3-aminophenoxy) benzene and pyrimellitic anhydride is different in that the tetracarboxylic dianhydride component is pyromellitic dianhydride, and further (3) 1. A heat-resistant adhesive composed of 1,3-bis (3-aminophenoxy) benzene and various tetracarboxylic acid dianhydrides (JP-A-61-143,477 and JP-A-61-291,670) is The difference is that the reactive terminal group at the polymer molecule end of this polyimide remains, and that the heat resistant adhesive requires high temperature and high pressure bonding conditions.

The present invention will be described below. The polyamic acid or polyimide according to the present invention has 1,3-bis (3-aminophenoxy) benzene as an aromatic diamine component and 3,4 as an aromatic tetracarboxylic dianhydride component.
3 ', 4,4'-diphenyl ether tetracarboxylic dianhydride, 3,3', 4,4'-benzophenone tetracarboxylic dianhydride, and 3,3 ', 4,4'-biphenyl tetracarboxylic dianhydride A polyamic acid or a polyimide obtained by polycondensing at least one aromatic tetracarboxylic dianhydride selected from the group consisting of anhydrides, wherein the reactive terminal group at the polymer molecule end is represented by the formula (1)

[Chemical 30] (In the formula, Z is the same as above), which is a polyamic acid or a polyimide sealed with an aromatic dicarboxylic acid anhydride,

Alternatively, the reactive end group at the end of the polymer molecule has the formula (3)

[Chemical 31] (In the formula, Q is the same as the above) and is a polyamic acid or polyimide sealed with an aromatic monoamine.

The polyamic acid or polyimide relating to the heat-resistant adhesive of the present invention is manufactured as follows. The aromatic diamine component used as a monomer has the formula (4)

[Chemical 32] Is 1,3-bis (3-aminophenoxy) benzene (hereinafter sometimes abbreviated as APB).

The aromatic tetracarboxylic dianhydride used as one of the monomers has the formula (5)

[Chemical 33] (In the formula, X represents a direct bond, a divalent group of -CO- or -O-), and 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride (hereinafter referred to as BPDA). Abbreviated as "), 3,3 ', 4,4'-benzophenone tetracarboxylic acid dianhydride (hereinafter also abbreviated as BTDA) or 3,"
It is 3 ′, 4,4′-diphenyl ether tetracarboxylic dianhydride (hereinafter sometimes abbreviated as ODPA), and these aromatic tetracarboxylic dianhydrides are used alone or in combination.

The polyamic acid and / or polyimide as the adhesive of the present invention mainly comprises the above-mentioned aromatic diamine component and aromatic tetracarboxylic dianhydride. Of the aromatic tetracarboxylic dianhydride of the above formula (5) within the range of not impairing the properties of

[Chemical 34] (In the formula, R is an aliphatic group having 2 or more carbon atoms, a cycloaliphatic group,
A tetravalent group selected from the group consisting of a monocyclic aromatic group, a condensed polycyclic aromatic group, and a non-condensed polycyclic aromatic group in which aromatic groups are connected to each other directly or by a crosslinking member. There is no problem even if it substitutes and uses the tetracarboxylic acid dianhydride represented by these.

That is, examples of the tetracarboxylic dianhydride which can be used as a partial substitute include, for example, ethylenetetracarboxylic dianhydride, butanetetracarboxylic dianhydride, cyclopentanecarboxylic dianhydride and pyromellitic acid. Dianhydride, 2,2 ', 3,3'-benzophenone tetracarboxylic dianhydride, 2,2', 3,3'-biphenyltetracarboxylic dianhydride, 2,2-bis (3,4- Dicarboxyphenyl) propane dianhydride, bis (3,4-dicarboxyphenyl) ether dianhydride, bis (2,3-dicarboxyphenyl) ether dianhydride, bis (3,4-dicarboxyphenyl) sulfone Dianhydride, bis (2,3-dicarboxyphenyl) sulfone dianhydride, 1,1-bis (2,3-dicarboxyphenyl) methane dianhydride, bis (3,4-dicarboxyphenyl) methane dianhydride Anhydrous, 4,4 '-(p-phenylenedioxy) diphthalic acid dinone Water, 4,4 '-(m-phenylenedioxy) diphthalic dianhydride, 2,3,6,7-naphthalene tetracarboxylic dianhydride, 1,
4,5,8-Naphthalenetetracarboxylic dianhydride, 1,2,5,6-
Naphthalene tetracarboxylic dianhydride, 1,2,3,4-benzenetetracarboxylic dianhydride, 3,4,9,10-perylene tetracarboxylic dianhydride, 2,3,6,7-anthracene tetra Examples thereof include carboxylic acid dianhydride and 1,2,7,8-phenanthrenetetracarboxylic acid dianhydride.

There is no problem even if a part of the APB of the formula (4) is used by replacing it with another aromatic diamine within a range not impairing the characteristics of the heat-resistant adhesive of the present invention. Examples of aromatic diamines that can be partially substituted include, for example, m-
Phenylenediamine, o-phenylenediamine, p-phenylenediamine, m-aminobenzylamine, p-aminobenzylamine, bis (3-aminophenyl) sulfide, (3-aminophenyl) (4-aminophenyl) sulfide, bis ( 4-aminophenyl) sulfide, bis (3-aminophenyl) sulfoxide, (3-
Aminophenyl) (4-aminophenyl) sulfoxide, bis (3-aminophenyl) sulfone, (3-aminophenyl) (4-aminophenyl) sulfone, bis (4-aminophenyl) sulfone, 3,3'-diaminobenzophenone , 3,4'-diaminobenzophenone, 4,4'-diaminobenzophenone, 3,3'-diaminodiphenylmethane, 3,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylether, 3 , 3'-diaminodiphenyl ether, 3,4'-diaminodiphenyl ether, bis [4- (3-aminophenoxy) phenyl] methane, bis [4- (4-aminophenoxy) phenyl] methane, 1,1-bis [4 -(3-aminophenoxy) phenyl] ethane, 1,1-bis [4- (4
-Aminophenoxy) phenyl] ethane, 1,2-bis [4
-(3-aminophenoxy) phenyl] ethane, 1,2-bis [4- (4-aminophenoxy) phenyl] ethane,
2,2-bis [4- (3-aminophenoxy) phenyl] propane, 2,2-bis [4- (4-aminophenoxy) phenyl] propane, 2,2-bis [4- (3-aminophenoxy) Phenyl] butane, 2,2-bis [3- (3-aminophenoxy) phenyl] -1,1,1,3,3,3-hexafluoropropane, 2,2-bis [4- (4-aminophenoxy) ) Phenyl] -1,1,1,3,3,3-hexafluoropropane, 1,3-bis (4-aminophenoxy) benzene, 1,4-bis (3-
Aminophenoxy) benzene, 1,4-bis (4-aminophenoxy) benzene, 4,4'-bis (3-aminophenoxy) biphenyl, 4,4'-bis (4-aminophenoxy)
Biphenyl, bis [4- (3-aminophenoxy) phenyl] ketone, bis [4- (4-aminophenoxy) phenyl] ketone, bis [4- (3-aminophenoxy)
Phenyl] sulfide, bis [4- (4-aminophenoxy) phenyl] sulfide, bis [4- (3-aminophenoxy) phenyl] sulfoxide, bis [4- (aminophenoxy) phenyl] sulfoxide, bis [4-
(3-aminophenoxy) phenyl] sulfone, bis [4- (4-aminophenoxy) phenyl] sulfone,
Bis [4- (3-aminophenoxy) phenyl] ether, bis [4- (4-aminophenoxy) phenyl] ether, 1,4-bis [4- (3-aminophenoxy) benzoyl] benzene, 1,3- Bis [4- (3-aminophenoxy) benzoyl] benzene, 4,4′-bis [3- (4-
Aminophenoxy) benzoyl] diphenyl ether,
4,4'-bis [3- (3-aminophenoxy) benzoyl] diphenyl ether, 4,4'-bis [4- (4-amino-α, α-dimethylbenzyl) phenoxy] benzophenone, 4,4'-bis [4- (4-amino-α, α-dimethylbenzyl) phenoxy] diphenyl sulfone, bis [4- {4- (4-aminophenoxy) phenoxy} phenyl] sulfone, bis [4- {4- (4-amino Phenoxy) phenoxy} phenyl] sulfone, 1,4-bis [4- (4-aminophenoxy) -α, α-dimethylbenzyl] benzene, 1,3-bis [4- (4-aminophenoxy) -α, α -Dimethylbenzyl] benzene, etc., and these may be used alone or in admixture of two or more.

Further, in order to obtain a polyimide or a polyamic acid having excellent adhesiveness at low temperature / low pressure of the adhesive of the present invention, the formula (1) is used for the purpose of capping the polymer molecule end.

[Chemical 35] (In the formula, Z is a monocyclic aromatic group, a condensed polycyclic aromatic group,
An aromatic dicarboxylic acid anhydride represented by a divalent group selected from the group consisting of non-condensed polycyclic aromatic groups in which aromatic groups are directly or cross-linked with each other by a cross-linking member) There is.

Examples of the aromatic dicarboxylic acid anhydride used include phthalic anhydride, 2,3-benzophenodicarboxylic acid anhydride, 3,4-benzophenone dicarboxylic acid anhydride and 2,3-dicarboxyphenylphenyl ether anhydride. Substance, 2,3-biphenyldicarboxylic acid anhydride, 3,4-biphenyldicarboxylic acid anhydride, 2,3-dicarboxyphenylphenylsulfone anhydride, 3,4-dicarboxyphenylphenylsulfone anhydride, 2,3- Dicarboxyphenyl phenyl sulfide anhydride, 3,4-dicarboxyphenyl phenyl sulfide anhydride, 1,2-naphthalenedicarboxylic acid anhydride, 2,3-naphthalenedicarboxylic acid anhydride, 1,8-naphthalenedicarboxylic acid anhydride, Examples thereof include 1,2-anthracene dicarboxylic acid anhydride, 2,3-anthracene dicarboxylic acid anhydride and 1,9-anthracene dicarboxylic acid anhydride. These dicarboxylic acid anhydrides may be substituted with a group having no reactivity with amines or dicarboxylic acid anhydrides. Of these aromatic dicarboxylic acid anhydrides, phthalic anhydride is preferably used.

Further, for the purpose of sealing the end of the polymer molecule, the formula (3)

[Chemical 36] (In the formula, Q is selected from the group consisting of a monocyclic aromatic group, a condensed polycyclic aromatic group, and a non-condensed polycyclic aromatic group in which the aromatic groups are connected to each other directly or by a bridging member. It is necessary to use an aromatic monoamine represented by a monovalent group). Examples of the aromatic monoamine used include the following. For example, aniline, o-toluidine, m-toluidine, p-toluidine, 2,3-xylidine, 2,4-xylidine, 2,5-xylidine, 2,
6-xylidine, 3,4-xylidine, 3,5-xylidine, o-chloroaniline, m-chloroaniline, p-
Chloroaniline, o-bromoaniline, m-bromoaniline, p-bromoaniline, o-nitroalinine, m-
Nitroaniline, p-nitroaniline, o-aminophenol, m-aminophenol, p-aminophenol, o-anisidine, m-anisidine, p-anisidine, o-phenetidine, m-phenetidine, p-phenetidine, o-amino. Benzaldehyde, m-aminobenzaldehyde, p-aminobenzaldehyde, o-aminobenzonitrile, m-aminobenzonitrile, p-aminobenzonitrile, 2-aminobiphenyl, 3-aminobienyl, 4-aminobiphenyl, 2-amino Phenol phenyl ether, 3-aminophenol phenyl ether, 4-aminophenol phenyl ether, 2
-Aminobenzophenone, 3-aminobenzophenone,
4-aminobenzophenone, 2-aminophenol phenyl sulfide, 3-aminophenol phenyl sulfide, 4-aminophenol phenyl sulfide, 2-
Aminophenol phenyl sulfone, 3-aminophenol phenyl sulfone, 4-aminophenol phenyl sulfone, α-naphthylamine, β-naphthylamine,
1-amino-2-naphthol, 2-amino-1-naphthol, 4-amino-1-naphthol, 5-amino-1-
Naphthol, 5-amino-2-naphthol, 7-amino-2-naphthol, 8-amino-1-naphthol, 8-
Amino-2-naphthol, 1-aminoanthracene, 2
-Aminoanthracene, 9-aminoanthracene and the like can be mentioned. Usually, of these aromatic monoamines, preferably aniline is used. These aromatic monoamines may be used alone or in combination of two or more without any problem. There is no problem even if the above-mentioned dicarboxylic acid anhydride and aromatic monoamine are used in combination.

The polyimide formation reaction is usually carried out in an organic solvent. Examples of the organic solvent used in this reaction include N-methyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-dimethylformamide, 1,3
-Dimethyl-2-imidazolidinone, N, N-diethylacetamide, N, N-dimethylmethoxyacetamide, dimethylsulfoxide, pyridine, dimethylsulfone, hexamethylphosphoramide, tetramethylurea,
N-methylcaprolactam, putilolactam, tetrahydrofuran, 1,2-dimethoxyethane, bis (2-methoxyethyl) ether, 1,2-bis (2-methoxyethoxy) ethane, bis2- (2-methoxyethoxy) ethyl ether, tetrahydrofuran , 1,3-dioxane, 1,4-dioxane, pyridine, picoline, dimethyl sulfoxide, dimethyl sulfone, o-cresol,
m-cresol, p-cresol, cresylic acid, p-
Examples include chlorophenol, phenol and anisole. These organic solvents may be used alone or in combination of two or more.

The polyamic acid and / or polyimide relating to the heat-resistant adhesive of the present invention comprises the above-mentioned aromatic diamine compound and aromatic tetracarboxylic dianhydride in the presence of an aromatic dicarboxylic acid anhydride or an aromatic monoamine. Is synthesized as follows.

(A) APB of the formula (4), aromatic tetracarboxylic acid dianhydride of the formula (5), and aromatic dicarboxylic acid anhydride of the formula (1) are reacted in the above organic solvent to give a polyimide. A polyamic acid that is a precursor of is obtained. The amount of the aromatic tetracarboxylic acid dianhydride used is 0.8 to 0.999 mol per mol of APB, and the amount of the aromatic dicarboxylic acid anhydride used is the difference in the number of moles of APB and tetracarboxylic acid dianhydride. In this case, it is preferable to use a molar number of 2a or more and 8a or less. If the number of moles of the aromatic tetracarboxylic acid dianhydride used is less than 0.8 moles relative to 1 mole of APB, the degree of polymerization of the polymer will be insufficient and the heat resistance will be impaired. It becomes difficult to seal the ends, and low temperature / low pressure bonding becomes impossible. On the other hand, if the amount of the aromatic dicarboxylic acid anhydride used is less than 2 amol, the end capping of the polymer cannot be sufficiently performed and an adhesive capable of adhering at low temperature / low pressure cannot be obtained. Heat resistance is impaired. Particularly preferably, the amount of the aromatic tetracarboxylic dianhydride used is 0.9 per mol of APB.
The amount of the aromatic dicarboxylic acid anhydride used is 2a to 4a mol, where a is the difference in the number of moles of APB and the aromatic tetracarboxylic acid dianhydride used.

As a method of adding APB, aromatic tetracarboxylic acid dianhydride, and aromatic dicarboxylic acid anhydride to an organic solvent and reacting them, (a) reacting aromatic tetracarboxylic acid dianhydride with APB After that, a method of continuing the reaction by adding an aromatic dicarboxylic acid anhydride (b) After adding an aromatic dicarboxylic acid anhydride to APB to cause a reaction, adding an aromatic tetracarboxylic acid dianhydride,
A method for continuing the reaction (c) A method in which an aromatic tetracarboxylic dianhydride, APB, and an aromatic dicarboxylic acid anhydride are simultaneously added and reacted, and the like, and any addition / reaction method may be used.

The reaction temperature for producing the polyamic acid is
It is usually 60 ° C. or lower, preferably 50 ° C. or lower. Further, the reaction pressure is not particularly limited, and it can be sufficiently carried out at normal pressure. The reaction time varies depending on the type of aromatic tetracarboxylic dianhydride used, the type of solvent, the reaction temperature, etc., and the reaction is usually performed for a time sufficient to complete the production of polyamic acid.
Usually, 4 to 24 hours is sufficient.

By this reaction, the precursor of polyimide, the formula (7)

[Chemical 37] (In the formula, X represents a direct bond, a divalent group of -CO- or -O-), and a polyamic acid represented by the formula is obtained. The polyamic acid thus obtained is further treated with 100 to 300
The polyimide is obtained by heating at ℃ and performing an imidization reaction.
In this case, the water generated by the imidization reaction may be removed by azeotropic distillation by adding an azeotrope such as toluene to the reaction system.

(B) Polyamic acid is obtained by the method of the above (A), and an imidizing agent such as acetic anhydride is used to chemically imidize it to obtain a polyimide. In this imidization reaction, tertiary amines such as pyridine, picoline, imidazole and triethylamine may be added as a base catalyst, if necessary. In this imidization reaction, the reaction temperature is usually room temperature to 200 ° C. or lower, preferably room temperature to 100 ° C. or lower, and the reaction time of 0.5 to 24 hours is sufficient.

(C) When the polyamic acid is obtained by the method described in (A) above, aromatic tetracarboxylic dianhydride and AP are used.
A polyimide is obtained by suspending or dissolving B and an aromatic dicarboxylic acid anhydride in an organic solvent, and then heating to imidize the polyamic acid at the same time as it is produced. In this imidization reaction, a base catalyst that can be used in the above method (B) may be used. Further, water generated by this imidization reaction may be removed by azeotropic distillation by adding an azeotrope such as toluene to the reaction system. In this imidization reaction, the reaction temperature is 80 ° C. to the reflux temperature of the solvent used at that time, preferably 100 ° C. to 200 ° C., and the reaction time is preferably 0.5 to 24 hours. ..

(D) APB of the formula (4), aromatic tetracarboxylic dianhydride of the formula (5), and aromatic monoamine of the formula (3) are reacted in the above organic solvent to produce a polyimide precursor. To obtain a polyamic acid. The amount of APB used is 0.8 to 1 per mol of the aromatic tetracarboxylic dianhydride.
Using 0.999 mol, the amount of the aromatic monoamine used is A
The molar difference between PB and the aromatic tetracarboxylic dianhydride is calculated as a
In this case, it is preferable to use a molar number of 2a or more and 8a or less. If the number of moles of APB used is less than 0.8 moles relative to 1 mole of aromatic tetracarboxylic dianhydride, the degree of polymerization of the polymer is not sufficient and heat resistance is impaired.
If it exceeds the molar amount, it becomes difficult to seal the polymer end, and the
Bonding at low pressure becomes impossible. Further, when the amount of the aromatic monoamine used is less than 2 amol, the polymer cannot be sufficiently blocked at the end and an adhesive capable of adhering at low temperature / low pressure cannot be obtained, and when it exceeds 8 a, heat resistance is impaired. .. Particularly preferably, the amount of APB used is 0.9 to 0.99 mol per mol of the aromatic tetracarboxylic dianhydride, and the amount of aromatic monoamine used is the same as APB and aromatic tetracarboxylic acid dianhydride. 2a when the difference in the number of moles of anhydride used is a
~ 4 amol.

Further, in this method, the organic solvent is AP
B, aromatic tetracarboxylic acid dianhydride, and aromatic monoamine are added and reacted as follows: (e) aromatic tetracarboxylic acid dianhydride and APB are reacted, and then aromatic monoamine is added and reacted. (F) Aromatic monocarboxylic acid dianhydride is added to and reacted with aromatic monoamine, APB is added, and the reaction is further continued. (G) Aromatic tetracarboxylic dianhydride, APB, Examples thereof include a method of simultaneously adding and reacting an aromatic monoamine, and any addition method may be used. The reaction temperature for producing the polyamic acid is usually 60 ° C. or lower,
It is preferably 50 ° C. or lower. Further, the reaction pressure is not particularly limited, and it can be sufficiently carried out at normal pressure. The reaction time varies depending on the type of aromatic tetracarboxylic dianhydride used, the type of solvent, the reaction temperature, etc., and the reaction is usually performed for a time sufficient to complete the production of polyamic acid. Usually, 4 to 24 hours is sufficient.

By this reaction, the polyamic acid represented by the above formula (7), which is a polyimide precursor, is obtained.
The polyamic acid thus obtained is further added to 100 to
The polyimide is obtained by heating at 300 ° C. to cause an imidization reaction. In this case, the water generated by the imidization reaction may be removed by azeotropic distillation by adding an azeotrope such as toluene to the reaction system.

(E) Polyamic acid is obtained by the method of the above item (D), and an imidation reaction such as acetic anhydride is used to chemically imidize the polyamic acid to obtain a polyimide. In this imidization reaction, tertiary amines such as pyridine, picoline, imidazole and toluethylamine may be added as a base catalyst, if necessary. In this imidization reaction, the reaction temperature is usually room temperature to 200 ° C. or lower, preferably room temperature to 100 ° C. or lower, and the reaction time is 0.5 to 24 hours.

(G) When obtaining the polyamic acid by the method of the above item (D), aromatic tetracarboxylic acid dianhydride and AP
A polyimide is obtained by suspending or dissolving B and the aromatic monoamine in an organic solvent and then heating to imidize the polyamic acid at the same time as it is produced. In this imidization reaction, a base catalyst that can be used in the above method (E) may be used. Furthermore, water generated by this imidization reaction may be removed by azeotropic distillation by inserting an azeotrope such as toluene into the reaction. In this imidization reaction, the reaction temperature is from 80 ° C to the reflux temperature of the solvent used at that time, preferably from 100 ° C to 200 ° C. A reaction time of 0.5 to 24 hours is sufficient.

By any of the above methods (A) to (G), a polyimide having a repeating structural unit represented by the formula (8) can be obtained.

[Chemical 38] (In the formula, X represents a direct bond, a divalent group of -CO- or -O-), and a polyimide having a repeating structural unit represented by the formula is obtained.

The adhesive of the present invention contains the polyamic acid and / or polyimide thus obtained, and can be put to practical use in the following modes. (1) A varnish containing substantially the polyamic acid according to the present invention and a solvent in which the polyamic acid is well dissolved is applied as a heat resistant adhesive. In this case, mainly the polyamic acid and the varnish containing a good solvent for the polyamic acid include a solution in which the polyamic acid is dissolved in an organic solvent. Usually, as the solvent for dissolving the polyamic acid, the reaction solvent for forming the polyamic acid is applied as it is. Therefore, as the varnish, APB, aromatic tetracarboxylic acid dianhydride, and aromatic dicarboxylic acid anhydride are used in the organic solvent. And / or a polyamic acid obtained by reacting with an aromatic monoamine as a main component, and a polyimide which is a cyclized product of the polyamic acid may be contained therein. Therefore, the polyamic acid-containing solution may be a solution or suspension partially containing polyimide. The adhesive of this aspect, after being applied to the adherend, converts the polyamic acid into polyimide by a method such as heating to exert an excellent adhesive effect.

(2) Further, the adhesive as polyimide is substantially polyimide itself which is formed into a film or powder by, for example, thermally or chemically dehydrating and ring-closing polyamic acid. Further, this adhesive may contain a part of the polyamic acid. This adhesive is used by a method of adhering it to an object to be adhered, heating it for melting, and pressing it.

(3) Whether the reaction mixture containing the polyimide obtained by any of the above-mentioned methods (A) to (G) is discharged into a poor solvent for the polyimide or the poor solvent is added into the reaction system. Of the reaction system mixture, that is, the solvent mixed in the reaction system other than the contained polyimide, that is, the catalyst, etc., is removed by heating or / and decompressing the polyimide. After isolation, the isolated polyimide may be dissolved in a solvent that dissolves the polyimide powder to adjust the polyimide solution, and the polyimide solution may be applied substantially as a heat resistant adhesive. Examples of the solvent used here include the solvents listed above as the polymerization solvent. Specifically, N-methyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-dimethylformamide, 1,3
-Dimethyl-2-imidazolidinone, N, N-diethylacetamide, N, N-dimethylmethoxyacetamide, dimethylsulfoxide, pyridine, dimethylsulfone, hexamethylphosphoramide, tetramethylurea,
N-methyl caplactam, pentylactam, tetrahydrofuran, 1,2-dimethoxyethane, bis (2-methoxyethyl) ether, 1,2-bis (2-methoxyethoxy) ethane, bis2- (2-methoxyethoxy) ethyl ether, Tetrahydrofuran, 1,3-dioxane, 1,4-dioxane, pyridine, picoline, dimethyl sulfoxide, dimethyl sulfone, o-cresol,
m-cresol, p-cresol, cresylic acid, p-
Examples include chlorophenol, phenol and anisole. These organic solvents may be used alone or in combination of two or more. A solvent suitable for the purpose of use is selected from these solvents and used. It is more preferable that the polyimide is isolated from the reaction system and then washed and dried.

The adhesive of the present invention contains the polyimide obtained as described above in an organic solvent in an amount of 0.1 to 50% by weight,
Preferably, it is used by containing 5 to 30% by weight.

(4) When a polyimide is obtained by any of the above-mentioned methods (A) to (G), if the resulting polyimide is dissolved in a solvent for polymerization / imidization reaction, the imidization reaction is completed. The latter reaction mixture may be applied as a heat resistant adhesive.

The bonding method using the heat resistant adhesive of the present invention is as follows. When a varnish containing a polyamic acid, for example, a polyamic acid obtained by the method of the above (A) or (E) or a polyamic acid containing a polyimide imidized with the polyamic acid is used as an adhesive,
A thin layer of this varnish is applied to the adherends to be laminated, and then the adherends adhered in air for the required time,
To remove excess solvent by heating to about 100-300 ℃,
When the polyamic acid is converted into a more stable polyimide, and then pressure-bonded at a pressure of 1 to 1000 kg / cm ² and a temperature of 100 to 400 ° C., and cured at a temperature of 100 to 400 ° C.,
The adherend can be firmly adhered.

When a film or powder adhesive consisting essentially of polyimide is used, the film or powder is inserted and adhered between the adherends, and the amount is 1 to 1000 kg / cm.
² pressure, pressure-bonded at a temperature of 100 ~ 400 ℃, 100 ~
When it is cured at a humidity of 400 ° C., the adherend substance can be firmly adhered.

When an adhesive consisting of a solution of polyimide dissolved in an organic solvent is used, this adhesive is applied to the adherends to be bonded, and then the required time is 100 to 300.
The solvent is removed by heating to about ℃. In the case of using the heat-resistant adhesive described in (4) above, in addition to the solvent,
The catalyst and the like existing in the system are also removed at the same time. Then, another object to be adhered is applied to the polyimide coated surface of the object to be adhered
The adherends can be firmly bonded to each other by pressure bonding at a pressure of 1000 kg / cm ² and a temperature of 100 to 400 ° C., preferably 150 to 300 ° C. When applying a heat-resistant adhesive to the adherends to be laminated, good adhesive effect can be obtained even if it is applied to only one adherend or both adherents respectively. it can.

When the heat-resistant adhesive of the present invention is used, a glass fiber cloth or a carbon fiber cloth is impregnated with the adhesive by a known method, and the adhesive is used to adhere the heat-resistant adhesive, or the heat-resistant adhesive of the present invention is applied to an adherend. A method of inserting a glass fiber cloth or a carbon fiber cloth into the adhesive layer and then adhering the same is also possible after applying the conductive adhesive. Further, it is possible to use a method in which the surface of the adherend is chemically or physically treated and then bonded. Examples of the surface treatment method include chemical etching with acid or alkali, corona treatment, ultraviolet irradiation, radiation irradiation, sandblasting, heat treatment, plasma treatment, chemical treatment, honing treatment, plating treatment, oxide film treatment, degreasing treatment and the like. These methods may be single or combined.

When the heat-resistant adhesive of the present invention is used, as long as the characteristics of the heat-resistant adhesive of the present invention are not impaired,
It is also possible to add another resin and bond them. Other resins added, nylons, polyacetal, polycarbonate, polyphenylene oxide, polyethylene terephthalate, polysulfone, polyether sulfone, polyarylate, polyamitoimide, polyetherimide, polyetheretherketone, polyimide other than the present invention, Fluorine resin, polybismaleimide, epoxy resin and the like.

One or more solid lubricants such as molybdenum disulfide, graphite, boron nitride, lead monoxide, and lead powder can be added to the heat-resistant adhesive of the present invention. Also, reinforcing materials such as glass fiber, carbon fiber,
One or more kinds of aromatic polyamide fiber, potassium titanate fiber, glass beads and the like can be added. Furthermore, one or more ordinary additives such as antioxidants, heat stabilizers, ultraviolet absorbers, flame retardants, flame retardant aids, antistatic agents, and colorants may be added within a range that does not impair the object of the present invention. You can

[0047]

EXAMPLES The present invention will be described in more detail below with reference to examples. Example 1 A was placed in a container equipped with a stirrer, a reflux condenser and a nitrogen inlet tube.
29.2 g (0.1 mol) of PB was charged with 183.9 g of N, N-dimethylacetamide, and 3,3 ', 4,4'-benzophenonetetracarboxylic dianhydride 30. 91 g (0.096 mol) was added in portions while paying attention to the rise in solution temperature, and the mixture was stirred at room temperature for about 20 hours. After that, 1.184 g of phthalic anhydride
(8 × 10 ⁻³ mol) was added, and the mixture was further stirred at room temperature for 4 hours. The polyamic acid thus obtained is 35
The inherent viscosity at a concentration of 0.5% in a solvent of N, N-dimethylacetamide at 0.49 dl / g. Kapton 2 obtained by washing the above polyamic acid adhesive solution with ethanol.
00H (manufactured by Du Pont't, trade name), and heat-dried in a nitrogen stream in air at 150 ° C. for 1 hour and 250 ° C. for 3 hours. It was thermocompression-bonded for 5 minutes to / cm ² . The thickness of the applied adhesive was 25 μm. The 180 ° peel adhesive strength of this product was 2.8 kg / cm at room temperature.
According to PCA-BOM01).

Further, the above polyamic acid solution was cast on a glass plate, and then 250 ° C. for 1 hour at 250 ° C. in nitrogen.
It was heated at ℃ for 2 hours to obtain a pale yellow transparent polyimide film. The glass transition temperature of this polyimide film is 1
It was 86 ° C. (TMA needle penetration method). This polyimide film is used for PI-X / CF composite board (1
(0 × 79 × 2.5 mm, Vf = 60%) (manufactured by Mitsui Toatsu Kagaku), and thermocompression bonded at 300 ° C. and a pressure of 50 kg / cm ² for 10 minutes. ASTM D273 using this test piece
When the compressive shear strength was measured according to 3, it was 3.7 kg /
It was mm ² . Furthermore, 75.4 g of this polyamic acid solution
After diluting with 50.2 g of N, N-dimethylacetamide, 12.3 g (0.12 mol) of acetic anhydride and 9.56 g (0.09 mol) of triethiamine were charged and stirring was continued. .. After stirring for about 10 hours, the mixture was discharged into 500 ml of methanol and the precipitate was filtered off. After washing the obtained polyimide powder with methanol and acetone, 180 ° C
After drying for 12 hours, 16.3 g of polyimide powder (yield 96
%) Was obtained. Cold rolled steel sheet (JIS G3141, spcc / S) obtained by preheating other polyimide powder to 130 ° C.
D25 × 100 × 1.6 mm) and thermocompression bonded at 290 ° C. and a pressure of 10 kg / cm ² for 10 minutes. The tensile shear strength of this product was 280 kg / cm ² .

Comparative Example 1 Exactly the same as Example 1 except that phthalic anhydride was not used.
To obtain a polyamic acid varnish. Of this polyamic acid
The logarithmic viscosity was 0.49 dl / g. This polyamic acid contact
Peel adhesion strength in the same manner as in Example 1 using the adhesive solution
Was measured and it was as low as 0.3 kg / cm. It
This polyamic acid solution was cast on a glass plate
Post nitrogen at 150 ° C for 1 hour, then at 250 ° C for 2 hours
By heating, a pale yellow transparent polyimide film was obtained. this
As in Example 1, using a polyimide film,
℃, pressure 50kg / cm ²Heat compression bonding for 10 minutes and compress
When the breaking strength was measured, it was 0.2 kg / mm²And the lower one
It was. In addition, when the bonding temperature is raised to 370 ° C
Compressive shear strength is 1.8 kg / mm²And low
It was

Example 2 A stirrer, a reflux condenser, a water separator and a nitrogen inlet tube were provided.
29.2 g (0.1 mol) of APB in the container
4,4'-benzophenone tetracarboxylic acid dianhydride 3
0.91 g (0.096 mol), phthalic anhydride 1.18
4 g (8 x 10 ^-3Mol), γ-picoline 1.40 g, m
-Add 245 g of cresol and stir in a nitrogen atmosphere.
The temperature was raised to 145 ° C. with stirring. During this period, about 3.5
Distillation of cc water was confirmed. Then cool to room temperature,
After discharging to about 3 l of methyl ethyl ketone, it was filtered off.
After washing this polyimide powder with methyl ethyl ketone,
After drying under reduced pressure at 180 ° C. for 12 hours, 56.5 g (yield 98
%) Polyimide powder was obtained. Carry out this polyimide powder
Inserted between the PI-X / CF composite plates similar to Example 1
Then, thermocompression bonding was performed under the same conditions as in Example 1. This test piece
When the compressive shear strength was measured using, it was 3.8 kg / mm.²
Met.

Examples 3 to 7 Polyamic acid varnishes were obtained in the same manner as in Example 1 except that the amounts of tetracarboxylic dianhydride and aromatic dicarboxylic acid anhydride shown in Table 1 were used. It was These polyamic acid adhesive solutions were applied to Kapton 200H, dried in the same manner as in Example 1, and then pressure-bonded to a Cu foil under the same conditions as in Example 1, and the 180 ° peel strength was measured. Table 1 shows the logarithmic viscosity and 180 ° peeling adhesive strength of the obtained polyamic acid.

Comparative Examples 2 to 5 By the same procedure as in Example 1, the amounts of tetracarboxylic dianhydride and aromatic dicarboxylic acid anhydride shown in Table 2 were used and the polyamic acid adhesive solution was prepared. Got After these adhesive solutions were applied to Kapton and dried in the same manner as in Example 1, Cu foil was pressure bonded under the same conditions as in Example 1 and the 180 ° peel strength was measured. The logarithmic viscosity and 180 ° peel adhesive strength of the obtained polyamic acid are shown in Table 1 together with Examples 3 to 7.

[0053]

[Table 1]

Example 8 A was placed in a container equipped with a stirrer, a reflux condenser and a nitrogen introducing tube.
29.2 g (0.1 mol) of PB and 245.6 g of N, N-dimethylacetamide were charged and dissolved by stirring at room temperature under a nitrogen atmosphere. To this, 31.87 g (0.099 mol) of 3,3 ', 4,4'-benzophenone tetracarboxylic acid dianhydride was added in portions while paying attention to the rise of the solution temperature, and 2
Stir for 0 hours. After that, 1.184 g of phthalic anhydride (8
(× 10 ⁻³ mol) was added, and the mixture was further stirred at room temperature for 4 hours. The polyamic acid thus obtained has an inherent viscosity of 0.
It was 75 dl / g (measurement was carried out at 35% in N, N-dimethylacetamide solvent at 0.5% concentration). 40.8 g (0.4 mol) of acetic anhydride and 20.2 g (0.2 mol) of triethylamine were added dropwise to the above polyamic acid solution, and stirring was continued at room temperature for 10 hours. The reaction mixture obtained was mixed with 10
The mixture was discharged into 00 g of methanol under strong stirring, and the precipitate was separated by filtration. The obtained powdery precipitate was further washed with methanol and then dried at 180 ° C. for 12 hours to obtain 56.9 g (yield 99%) of polyimide powder. The glass transition temperature of the obtained polyimide powder was 192 ° C. (measured by DSC), the logarithmic viscosity was 0.76 dl / g (measured in a mixed solvent of p-chlorophenol / phenol = 9/1 weight ratio, 0.
5% concentration, performed at 35 ° C.). 20 g of the thus obtained polyimide powder is added to 80 g of N-methyl-2-pyrrolidone.
It was dissolved in (concentration 20%) to obtain a polyimide varnish.
Kapto obtained by cleaning this polyimide varnish with ethanol.
n 200H (manufactured by Dupon't), dried by heating at 250 ° C. for 30 minutes in a nitrogen stream, and then rolled with a rolled copper foil with a thickness of 25 μm, and at 250 ° C. under a pressure of 50 kg / cm ^2.
Hold for minutes and crimp. The thickness of the applied polyimide layer was 10 μm. The 180 ° C peel adhesion strength of this product was 3.3 kg / cm at room temperature (measurement method was JP
According to CA-BOM 01). In addition, the polyimide varnish of this embodiment was cold rolled steel sheet (JIS, G3141, sp
cc / SD25 × 100 × 1.6 mm) and heat-dried under a nitrogen stream at 250 ° C. for 30 minutes, and then stack the same cold-rolled steel sheets at 250 ° C. under a pressure of 50 kg / cm ² for 5 minutes. Hold and crimp (measurement method is JIS K6
848 and 68501). The tensile shear strength of this product was 320 kg / cm ² .

Examples 9 and 10 The 3,3 ', 4,4'-benzophenone tetracarboxylic acid dianhydride in Example 8 was replaced with the tetracarboxylic acid dianhydride shown in Table 2 in the same manner as in Example 8. Then, a polyamic acid and a polyimide powder were synthesized, a polyimide solution was prepared, and the same evaluation as in Example 1 was performed. The results are shown in Table 2.

Comparative Example 6 A polyamic acid was synthesized in exactly the same manner as in Example 8. Kapton washed with this polyamic acid solution with ethanol
After being coated on 200H (Dupont's company) and heated under a nitrogen stream at 150 ° C. for 1 hour and 250 ° C. for 3 hours, 25
It was overlapped with a rolled copper foil of μm and held at 250 ° C. under a pressure of 50 kg / cm ² for 5 minutes for pressure bonding. The thickness of the applied adhesive is 25
was μm. The 180 ° peel adhesive strength of this product was 2.6 kg / cm 2 at room temperature. Moreover, the same polyamic acid solution was applied to a cold-rolled steel sheet and the temperature was adjusted to 1 at 150 ° C under a nitrogen stream.
After heating for 3 hours at 250 ° C for 3 hours, the same cold-rolled steel sheets are stacked and heated at 250 ° C under a pressure of 50 kg / cm ² for 5 hours.
Hold for minutes and crimp. The tensile shear strength of this product is 27
It was 0 kg / cm ² .

Comparative Examples 7 and 8 The same evaluation as in Comparative Example 6 was conducted using the tetracarboxylic dianhydride shown in Table 2 as the 3,3 ′, 4,4′-benzophenonetetracarboxylic acid in Comparative Example 6. .. The results are shown in Table 2.

Comparative Example 9 A polyamic acid having a logarithmic viscosity of 0.75 dl / g was obtained in the same manner as in Example 8. After casting this on a glass plate, it was heated in nitrogen at 150 ° C. for 1 hour and 250 ° C. for 2 hours to obtain a yellow transparent polyimide film. The glass transition temperature of this polyimide film was 187 ° C. (TMA penetration method). The thickness of the polyimide film was 10 μm. Using the polyimide film obtained here, a copper foil similar to that used in Example 8 was used for adhesion by holding it at 250 ° C. under a pressure of 50 kg / cm ² for 5 minutes to measure 180 ° peel adhesion strength. Further, the polyimide film formed in this Comparative Example was sandwiched between cold rolled steel sheets similar to those in Example 8,
It was held at 250 ° C. under a pressure of 50 kg / cm ² for 5 minutes for pressure bonding, and the tensile shear strength was measured. The results are shown in Table 2.

Comparative Example 10 10 g of methanol was added to 10 g of the polyimide powder obtained in Example 8 to prepare a paste-like suspension. This was applied onto the rolled copper foil and cold rolled steel sheet used in Example 1, dried at 70 ° C. for 20 minutes to remove methanol, and then bonded under the same bonding conditions as in Example 8. 180 ° peel strength and tensile shear strength were measured. The results are shown in Table 2.

Comparative Example 11 Polyamic acid was synthesized without adding 1.184 g (8 × 10 ⁻³ mol) of phthalic anhydride used in the synthesis of polyamic acid in Example 8. The polyamic acid thus obtained had an inherent viscosity of 0.74 dl / g. Further, in the same manner as in Example 8, 56.7 g (yield 99%) of polyimide powder was obtained.
The logarithmic viscosity of this polyimide powder was 0.75 dl / g.
A polyimide solution was prepared using N-methyl-2-pyrrolidone in exactly the same manner as in Example 8 except that the polyimide powder obtained in this Comparative Example was N-methyl-2. -Pyrrolidone was insoluble and no polyimide solution was obtained.

Example 11 Phthalic anhydride 1.184 (8 × 1) in Example 8
The same operation as in Example 8 was carried out except that 2,85- (naphthalenedicarboxylic acid anhydride) 1.585 (8 × 10 ⁻³ ) was used instead of 0 ⁻³ ), and the logarithmic viscosity was 0.75 dl / g. Polyamic acid and its solution, and polyimide powder having a logarithmic viscosity of 0.76 dl / g (glass transition temperature 192 ° C.) were obtained. Furthermore, a polyimide solution of N-methyl-2-pyrrolidone was prepared in the same manner as in Example 8, and the adhesive strength of this was measured in the same manner as in Example 8. The results are shown in Table 2.

Example 12 29.2 g (0.1 mol) of APB and 24 m-cresol were placed in a container equipped with a stirrer, a reflux condenser and a nitrogen introducing tube.
5.6 g, γ-pyrroline 1.4 g, 3,3 ′, 4,4′-benzophenone tetracarboxylic dianhydride 31.87 (0.09
9 mol). The mixture was heated with stirring under a nitrogen stream. While raising the temperature, the temperature of the reaction system was raised to 150 ° C. while capturing the distilled water accompanying the imidization reaction with a waterless trap. While maintaining the temperature of the reaction system at 150 ° C., 1.184 g (8 × 10 ⁻³ mol) of phthalic anhydride was added after 2 hours, and the mixture was further stirred at the same temperature for 2 hours. After that, the heating was stopped and the temperature was cooled to room temperature. A part of the polyimide varnish obtained here was discharged into methanol, and the precipitated polyimide powder was further washed with methanol and then dried at 180 ° C. for 12 hours. The polyimide powder obtained had an inherent viscosity of 0.75 dl / g and a glass transition temperature by DSC of 191 ° C. The polyimide varnish of the reaction mixture obtained in this example was applied to Kapton 200H (Dupont's Co., Ltd.) washed with ethanol, heated and dried at 250 ° C. for 30 minutes under a nitrogen stream, and then 2
Rolled copper foils having a thickness of 5 μm were stacked and pressed at 250 ° C. under a pressure of 50 kg / cm ² for 5 minutes. The thickness of the applied polyimide layer was 10 μm. The 180 ° peel strength of this product was 32 kg / cm 2 at room temperature. The polyimide varnish of this example was applied to a cold-rolled steel sheet, heated and dried at 250 ° C. for 30 minutes in a nitrogen stream, and then overlaid with the same cold-rolled steel sheet, and at 250 ° C. under a pressure of 50 kg / cm ² , It was held for 5 minutes and crimped. The tensile shear strength of this product was 315 kg / cm ² .

Example 13 A container equipped with a stirrer, a reflux condenser, and a nitrogen introducing tube was placed in a container.
3 ', 4,4'-benzophenone tetracarboxylic dianhydride 3
2.2 g (0.1 mol), N, N-dimethylacetamide 2
45.6 g was charged and the mixture was stirred at room temperature under a nitrogen atmosphere. To this, 28.9 g (0.099 mol) of APB was added in portions while paying attention to the rise in solution temperature, and the mixture was stirred at room temperature for 20 hours. Thereafter, 0.745 (8 × 10 ⁻³ mol) of aniline was added and stirring was continued for 4 hours. The polyamic acid thus obtained had an inherent viscosity of 0.73 dl / g. The above polyamic acid solution was imidized with acetic anhydride and triethylamine in the same manner as in Example 8 to obtain polyimide powder 5
6.6 g (yield 98%) was obtained. The glass transition temperature of this polyimide powder was 191 ° C. and the logarithmic viscosity was 0.74 dl / g. Using the polyimide powder obtained here, a polyimide solution was obtained by dissolving in N-methyl-2-pyrrolidone in the same manner as in Example 8.
The 0 ° peel adhesion strength and tensile shear strength were determined. The results of this measurement are shown in Table 2.

Examples 14 and 15 Table 2 shows the benzophenonetetracarboxylic acid in Example 13. The procedure of Example 6 was repeated except that the tetracarboxylic dianhydride was used. The results are shown in Table 2.

Example 16 0.745 g (8 × 10 ⁻³⁾ of aniline in Example 13
1.578 g (8 ×) of 4-aminobenzophenone
The procedure of Example 13 was repeated, except that the amount was changed to 10 ⁻³ mol). The results are shown in Table 2.

Comparative Example 12 A polyamic acid was synthesized in exactly the same manner as in Example 13.
Kapto obtained by washing this polyamic acid solution with ethanol
n 200H (Dupont's Co., Ltd.) and heated under a nitrogen stream at 150 ° C. for 1 hour and 250 ° C. for 3 hours, and then 2
Rolled copper foil with a thickness of 5 μm was overlaid, and pressed at 250 ° C. under a pressure of 50 kg / cm ² for 5 minutes. The thickness of the applied adhesive was 25 μm. The 180 ° peel strength of this product was 2.5 kg / cm 2 at room temperature. Moreover, the same polyamic acid solution was applied to a cold-rolled steel sheet and the temperature was changed to 150 ° C under a nitrogen stream.
After heating for 1 hour at 250 ° C for 3 hours, the same cold-rolled steel sheets are overlaid, and at 250 ° C under a pressure of 50 kg / cm ² ,
It was held for 5 minutes and crimped. The tensile shear strength of this product is 2
It was 70 kg / cm ² .

[0067]

[Table 2]

[Table 3]

[0068]

The heat-resistant adhesive of the present invention comprises 1,3-bis (3-aminophenoxy) benzene as the aromatic diamine component and 3,4-bis (3-aminophenoxy) benzene as the tetracarboxylic dianhydride.
3'4,4'-biphenyltetracarboxylic dianhydride,
3,3 ′, 4,4′-benzophenone tetracarboxylic acid dianhydride and / or 3,3 ′, 4,4′-diphenyl ether tertetocarboxylic acid dianhydride is used, and the polymer terminal is a dicarboxylic acid anhydride or An adhesive containing a polyamic acid and / or a polyimide sealed with a monoamine compound, or an adhesive containing a polyimide solution containing a polyimide dissolved in a solvent in which the polyimide is dissolved. These adhesives of the present invention,
It is a heat resistant adhesive that can be bonded under low temperature and low pressure bonding conditions, and a polyimide solution adhesive is applied to the material to be adhered and heated under pressure to apply the desired adhesion with a simple operation. It is possible, and its adhesiveness is excellent. Therefore, the heat-resistant adhesive of the present invention is extremely useful for adhesion between structural materials, electronic materials, and other industrial materials.

 ─────────────────────────────────────────────────── (72) Inventor Saburo Kawashima, 1190 Kasama-cho, Sakae-ku, Yokohama-shi, Kanagawa Mitsui Toatsu Chemical Co., Ltd. (72) Masaru Asanuma 1190, Kasama-cho, Sakae-ku, Yokohama, Kanagawa Prefecture Incorporated (72) Inventor Akihiro Yamaguchi 1190 Kasama-cho, Sakae-ku, Yokohama-shi, Kanagawa Mitsui Toatsu Chemicals, Inc.

Claims (12)

[Claims] 1. A polymer molecule terminal is represented by the formula (1): (In the formula, Z is selected from the group consisting of a monocyclic aromatic group, a condensed polycyclic aromatic group, and a non-condensed polycyclic aromatic group in which the aromatic groups are connected to each other directly or by a bridging member. (Which represents a divalent group) is sealed with an aromatic dicarboxylic acid anhydride represented by
Formula (2) [In the formula, Y is Or (Wherein X represents a direct bond, a divalent group of —CO— or —O—), and a heat resistant adhesive containing a polyamic acid and / or a polyimide having a repeating structural unit represented by Agent. 2. The heat-resistant adhesive according to claim 1, wherein the aromatic dicarboxylic acid anhydride represented by the formula (1) is phthalic anhydride. 3. The polymer molecule terminal is represented by the formula (3): (In the formula, Q is selected from the group consisting of a monocyclic aromatic group, a condensed polycyclic aromatic group, and a non-condensed polycyclic aromatic group in which the aromatic groups are connected to each other directly or by a bridging member. A monovalent group), which is sealed with an aromatic monoamine represented by the formula (2): [In the formula, Y is Or (Wherein X represents a direct bond, a divalent group of —CO— or —O—), and a heat resistant adhesive containing a polyamic acid and / or a polyimide having a repeating structural unit represented by Agent. 4. The heat resistant adhesive according to claim 3, wherein the aromatic monoamine represented by the formula (3) is aniline. 5. The polymer molecule terminal is represented by the formula (1): (In the formula, Z is selected from the group consisting of a monocyclic aromatic group, a condensed polycyclic aromatic group, and a non-condensed polycyclic aromatic group in which the aromatic groups are connected to each other directly or by a bridging member. (Which represents a divalent group) is sealed with an aromatic dicarboxylic acid anhydride represented by
Formula (2) [In the formula, Y is (Wherein, X represents a direct bond, a divalent group of —CO— or —O—), and a polyimide having a repeating structural unit represented by Heat resistant polyimide adhesive. 6. The heat resistant adhesive according to claim 5, wherein the aromatic dicarboxylic acid anhydride represented by the formula (1) is phthalic anhydride. 7. The polymer molecule terminal is represented by the formula (3): (In the formula, Q is selected from the group consisting of a monocyclic aromatic group, a condensed polycyclic aromatic group, and a non-condensed polycyclic aromatic group in which the aromatic groups are connected to each other directly or by a bridging member. A monovalent group), which is sealed with an aromatic monoamine represented by the formula (2): [In the formula, Y is (Wherein X represents a direct bond, a divalent group of —CO— or —O—), and a polyimide having a repeating structural unit represented by Heat resistant polyimide adhesive. 8. The heat resistant adhesive according to claim 7, wherein the aromatic monoamine represented by the formula (3) is aniline. 9. The polymer molecule end is represented by the formula (1): (In the formula, Z is selected from the group consisting of a monocyclic aromatic group, a condensed polycyclic aromatic group, and a non-condensed polycyclic aromatic group in which the aromatic groups are connected to each other directly or by a bridging member. (Which represents a divalent group) is sealed with an aromatic dicarboxylic acid anhydride represented by
Formula (2) [In the formula, Y is (Wherein X represents a direct bond, a divalent group of —CO— or —O—), and a polyimide solution having a repeating unit represented by the formula: A bonding method characterized by using. 10. The bonding method according to claim 9, wherein the aromatic dicarboxylic acid anhydride represented by the formula (1) is phthalic anhydride. 11. A polymer molecule terminal is represented by the formula (3): (In the formula, Q is selected from the group consisting of a monocyclic aromatic group, a condensed polycyclic aromatic group, and a non-condensed polycyclic aromatic group in which the aromatic groups are connected to each other directly or by a bridging member. A monovalent group), which is sealed with an aromatic monoamine represented by the formula (2): [In the formula, Y is (Wherein, X represents a direct bond, a divalent group of —CO— or —O—), and a polyimide having a repeating structural unit represented by the formula: An adhesive method characterized by using a solution. 12. The adhesion method according to claim 11, wherein the aromatic monoamine represented by the formula (3) is aniline.