JPH05111900A - Divider of substrate - Google Patents

Abstract

PURPOSE:To increase the dividing speed, and reduce the maintenance cost by forming a substrate carrier route between two rollers out of a carrier belt, by arranging a back-up roller above and in the front end in the carrying direction, and by providing a press belt between the back-up roller and a roller on the upper surface side in the middle of the carrier route. CONSTITUTION:A carrier belt between rollers 2 and 3 is let run at constant speed in an arrow direction, while a press belt wound on a back-up roller 8 and a roller 9 is let run, and when a rod-shaped substrate A3 is put on and supplied to the rear end side of a carrier route 7, the substrate A3 is sandwiched between a carrier belt 6 and the press belt 10, and proceeds while it is pressed by the roller 2 and the back-up roller 8 through the belts 6, 10. Since the outer diameter of the roller 2 functioning as a dividing roller is small, bending force are given by elastic layers 11, 12 of both of the rollers when they are compressed and deformed, and a laterally divided groove A2 of the substrate A3 is broken thereby. Even when the speed of the carrier belt 6 becomes faster, substrate division is not affected, and the rollers 2, 8 will not be worm in a short period of time.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate dividing device, and for example, a chip resistor or the like is used to collectively form a large number of unit electronic components arranged in a plurality of rows and a plurality of columns using a substrate of a predetermined size. The present invention relates to a device for dividing the above-mentioned substrate along the dividing groove in a manufacturing process of an electronic component that takes the step of performing.

[0002]

2. Description of the Related Art Small resistors such as chip resistors are used.
The chip-type electronic components are manufactured through the following manufacturing process.
Manufactured. As shown in Fig. 4, a plurality of evenly-spaced vertical grooves
A₁… And a plurality of horizontal dividing grooves A at equal intervals ₂… And by quadrature
Shaped unit areas are now formed in multiple rows and multiple columns
A material substrate A is used, and an electrode part and
After the resistors are collectively formed by thick film printing,
As shown in FIG.₁Along…
So that it is divided into bars A₃To form. Next, this rod-shaped group
Board A₃A predetermined electrode material was applied and baked on the side edge cut surface of
After that, as shown in FIG.₃Horizontal groove
A₂Divide along ... and finally unit chip resistor A
_FourTo get

By the way, the above-mentioned material substrate A is formed into the vertical dividing groove A.
₁ ... step of obtaining a rod-like substrate A ₃ is divided along, and to obtain a unit component A ₄ is divided along the rod-shaped substrate A ₃ next split groove A ₂ ... it is both substrate dividing apparatus Is done automatically by.

For example, the material substrate A is replaced by a rod-shaped substrate A ₃
As a conventional example of the substrate dividing device used for dividing into two, there is one shown in Japanese Patent Publication No. 63-32602. The board dividing device disclosed in the publication is the same as that of the third publication of the publication.
As shown in the figure, a small-diameter roller having an elastic layer made of rubber or the like on the outer periphery and a large-diameter roller having an elastic layer made of rubber or the like on the outer periphery are sequentially arranged between these rollers. In general, the material substrates to be fed are arranged so as to face each other so as to be sandwiched by a predetermined elastic force.
When one or both of the small-diameter roller and the large-diameter roller are driven so as to draw the material substrate between the rollers, the material substrate A in which the vertical dividing grooves A ₁ ... Since the roller and the small-diameter roller receive a local bending force, they are sequentially divided along the longitudinal split grooves A ₁ .

[0005]

The substrate dividing apparatus disclosed in the above publication has the following problems. That is, firstly, the material substrate to be introduced between the large-diameter roller and the small-diameter roller is simply sent to the gap between the small-diameter roller and the large-diameter roller by a conveyor device such as a conveyor belt. Therefore, the material substrate A
A very unstable situation is exhibited such that the rear end portion is lifted at the moment when is sandwiched between the small diameter roller and the large diameter roller. Such a situation becomes particularly remarkable when the driving rotation speeds of the small diameter roller and the large diameter roller are not synchronized. For example, when the rotation speed of the large-diameter roller is higher than the rotation speed of the small-diameter roller, the rear end portion of the material substrate is conveyed in the moment when the material substrate A is drawn into the gap between the rollers. A phenomenon such as floating up from the road may occur.

When such a phenomenon occurs, the supporting condition of the material substrate A becomes extremely unstable, which may cause a problem that the posture of the material substrate A in the conveying direction is changed. In this way, when the material substrate A has a wrong attitude with respect to the carrying direction, that is, when the direction of the lateral dividing grooves A ₂ ... Inclines with respect to the carrying direction of the substrate, the substrate A becomes a large diameter roller. When it is sandwiched between the small-diameter roller and the small-diameter roller, the direction of the vertical dividing groove A ₁ , which is the position to be divided, is distorted with respect to the axial direction of both rollers, and as a result, the material substrate A
Is not correctly divided along the vertical dividing groove A ₁ , and the horizontal dividing groove A
Unexpected division at ₂ is also caused, and eventually all the material substrates A are defective products.

As described above, the substrate distortion caused by the unstable state of the substrate in the moment when the substrate is sandwiched between the large-diameter roller and the small-diameter roller divides the rod-shaped substrate A ₃ along the lateral dividing groove A _2. If it does, it will appear more prominently.

As described above, the problem of the unstable state of the substrate that occurs when the substrate is drawn between the large and small rollers or the problem of substrate division resulting from this is as the substrate material conveying speed increases. In other words, the higher the rotation speed of the upper and lower rollers and the higher the division speed, the larger the speed.If such a problem is to be minimized, the substrate transfer speed, that is, the division speed is kept constant or less. There is no choice but to lower it. Therefore, the conventional substrate dividing apparatus cannot increase the dividing speed and cannot be said to be necessarily excellent in efficiency.

Secondly, the large-diameter roller and the small-diameter roller are subjected to a proper pressing and bending force on the substrate sandwiched between them to realize correct division along the split groove. An elastic layer made of rubber or the like is formed on the outer circumference. By the way, in the conventional substrate dividing apparatus, the elastic layers formed on the outer circumferences of the large-diameter roller and the small-diameter roller are in direct contact with the material substrate 2 to apply bending pressure thereto. It can be easily imagined that the elastic layer to be formed on the peripheral surface of each roller as described above should be formed with extremely high precision in order to maintain the dividing performance. Since the rubber elastic layer is in direct contact with the material substrate, in the conventional example, the abrasion of the rubber elastic layer is accelerated in a relatively short time, and therefore the same roller is continuously used for a long time. There was a problem that I could not. For that reason, the roller must always be provided as a maintenance component, and since such a roller is relatively expensive, and further, the labor for replacing the roller is required,
After all, the conventional substrate dividing device has been a cause of increasing the manufacturing cost of the chip type electronic component.

The present invention has been devised under the above circumstances, and it is possible to achieve correct substrate division even if the division speed is increased and to dramatically reduce the cost for maintenance. It is an object of the present invention to provide a new substrate dividing device capable of performing the above.

[0011]

In order to solve the above problems, the present invention takes the following technical means. That is, the substrate dividing apparatus of the present invention forms a horizontal or substantially horizontal substrate transport path by winding an endless transport belt between at least two rollers,
A backup roller is arranged above this roller so that the roller, which is located at the front end in the transport direction of the substrate transport path and around which the transport belt is wound, functions as a split roller.
In addition, an endless pressing belt is wound around a roller arranged on the upper surface side of an appropriate portion on the way of the conveying path and the backup roller.

[0012]

The backup roller is arranged above the roller around which the conveyor belt is wound and which should function as the split roller. Therefore, the substrate, which is directed to the front end direction of the transport path while riding on the transport belt, is subjected to the substrate split along the split groove while being substantially pressed between the split roller and the backup roller. Become.

By the way, in the present invention, first, an endless pressing belt is wound around a roller arranged on the upper surface of an appropriate portion of the conveying belt and the backup roller. Therefore, the board that is sent in a good shape on the transport path is
It will move forward while being sandwiched between the conveyor belt and the pressing belt. Therefore, even in the moment where the substrate is practically sandwiched between the split roller and the backup roller while being sandwiched between the transport belt and the pressing belt, the problem that the substrate, for example, the rear end part thereof floats up and loses its posture. Cannot happen.

Therefore, according to the substrate dividing apparatus of the present invention, an unstable state of the substrate, which is caused when the substrate is sandwiched between the two rollers, which is a problem in the related art, or the posture of the substrate is changed due to the unstable state, and Solves all the problems caused by the problem of substrate division. The substrate, which is substantially sandwiched between the dividing roller and the backup roller, has its posture defined by the shape of the belt being sandwiched between the two belts. Even if the rotation speed of the board is increased, the conventional problems associated with changes in the attitude of the board do not occur at all, and as a result, the board division speed can be significantly increased compared to the conventional method, and the manufacturing efficiency of electronic parts can be improved. Can be achieved.

Next, the division of the substrate along the split groove is performed by substantially sandwiching the substrate between the dividing roller and the backup roller. In the present invention, the dividing roller also A belt is wound around both the backup roller and the substrate is sandwiched between the two rollers via these belts. In other words, in the present invention, the split roller and the backup roller do not directly contact the substrate and apply a pressing force thereto, but contact the substrate via the belt.

Therefore, in the present invention, even if the split roller and the backup roller both have the rubber elastic layer formed on their peripheral surfaces, the rubber elastic layer is worn out in a short period of time and needs to be replaced. Therefore, the life of these rollers can be dramatically extended. As a result, it is not necessary to store a large number of relatively expensive split rollers or backup rollers as maintenance parts as in the past, and the frequency of replacement is reduced, which reduces the cost for roller maintenance. It can be dramatically reduced.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described.
A specific description will be given with reference to the drawings. Figure 1 shows the chip resistance
The above-mentioned rod-shaped substrate A in the manufacturing process of the anti-static device₃Divided horizontally
Groove A ₂Are continuously divided along the unit chip resistor A
_FourIt is an embodiment configured to obtain.

On a side wall of the vertical support plate 1, a first roller 2 having a relatively small diameter, a second roller horizontally spaced from the first roller 2 by a predetermined distance, and a second roller 3 are provided below the second roller 3. A third roller 4 located and a fourth roller 5 located substantially below the first roller are supported so as to be rotatable around a horizontal axis. The first roller 2 has a smaller diameter than the other rollers, and this functions as a split roller as described later. An endless conveyor belt 6 is wound around these first, second, third, and fourth rollers 2, 3, 4, 5. Also,
By driving at least the first roller 2, the conveyor belt 6 is made to travel in the direction of the arrow.

The conveyor belt 6 running between the first roller 2 and the second roller 3 constitutes a horizontal conveyor path 7, and its rear end side is longitudinally moved by a substrate supply mechanism (not shown). The rod-shaped substrates A ₃ whose postures are determined so that their axes coincide with the transport direction of the transport path are sequentially placed and supplied.

On the other hand, a backup roller 8 having a relatively large diameter is supported above the first roller 2 so as to be rotatable around a horizontal axis with respect to the support plate 1. Further, another roller 9 is supported on the upper surface side of the transport path 7 substantially at the center in the longitudinal direction so as to be rotatable with respect to the support plate 1 about a horizontal axis. An endless pressing belt 10 is wound around the backup roller 8 and the roller 9. The backup roller 8 is rotationally driven by a drive device (not shown) so that the peripheral speed thereof matches the peripheral speed of the first roller 2 (divided roller).

As shown in detail in FIG. 2, the first roller 2 is
Each of the backup rollers 8 is provided with elastic layers 11 and 12 made of rubber or the like having a predetermined thickness. Also,
The distance between the axes of the first roller 2 (divided roller) and the backup roller 8 is set in consideration of the thickness of the conveyor belt 6 and the pressing belt 10.
A rod-shaped substrate A sandwiched between both rollers 2 and 8 via
₃ is set so that the pressing force is applied by the compressive deformation of the elastic layers 11 and 12 on the peripheral surface of each roller.

Further, as for the position of the roller 9, the portion running toward the backup roller 8 after being wound around this roller cooperates with the conveyor belt 6 so that the rod-shaped substrate A
₃ is set so as to be clamped and held with an appropriate holding force.

In the above-described structure, the rear end of the conveying path 7 is moved in a state where the conveying belt 6 is moved in the direction of the arrow at a constant speed and the backup roller 8 is driven to move the pressing belt 10 wound around the backup roller 8. When the rod-shaped substrate A ₃ is placed and supplied to the side, the rod-shaped substrate A ₃ is transferred to the transport path 7
On the front end side of the sheet, the sheet is further advanced while being sandwiched between the conveyor belt 6 and the pressing belt 10. The rod-shaped substrate A ₃ thus reaching the front end of the transport path 7
Is further pushed forward while being elastically pressed from above and below by the first roller 2 and the peripheral elastic layers 11 and 12 of the backup roller 8 via the belts 6 and 10, respectively.

At this time, as shown in detail in FIG. 3, the outer diameter of the first roller 2 functioning as a split roller is overwhelmingly smaller than the outer diameter of the backup roller 8. The elastic layers 11 and 12 of the backup roller 8 and the split roller 2 are indicated by arrows M in FIG. 3 in a fixed length section in the longitudinal direction of the rod-shaped substrate A ₃ which is sandwiched between the elastic layers 11 and 12 when compressed. Such bending force will be applied. On the other hand, since the bar-shaped substrate A ₃ is provided with the lateral dividing groove A _2, when the bending moment M as described above is applied, the bending stress caused by the bending moment M is concentrated in the lateral dividing groove A ₂ . It causes a break in the lateral dividing groove A ₂ . Such action is continuously performed in accordance with feeding of the rod-shaped substrate A _3, as a result, the rod-shaped substrate A ₃ is split by the horizontal split grooves A ₂ ... while passing between the split roller 2 and the backup roller 8 Thus, the unit chip resistor A ₄ is obtained.

By the way, in the present invention, when the rod-shaped substrate A ₃ is sandwiched between the peripheral surfaces of the split roller 2 and the backup roller 8 as described above, it is sandwiched between the conveyor belt 6 and the pressing belt 10. Therefore, even if there is a difference in the peripheral speed of both rollers in the moment when the front end tries to enter between the rollers 2 and 8,
The rear end portion does not float and the posture does not collapse, and the posture defined by the substrate supply unit (not shown), that is, the state in which the longitudinal axis coincides with the transport direction of the transport belt is maintained. Therefore, according to the present invention, the substrate posture becomes unstable when it is sandwiched between the dividing roller 2 and the backup roller 8 as in the conventional case, which causes the substrate posture to be misaligned and the normal substrate division. The problem of not being done is completely gone. Also,
Even if the transport speed of the transport belt 6 is increased, no inconvenience is caused in dividing the substrate, and as a result, the efficiency of electronic component manufacturing is dramatically improved.

Further, in the present invention, since the dividing roller 2 or the backup roller 8 does not directly contact the substrate to be divided, a rubber elastic layer is formed on the peripheral surfaces of these rollers 2, 8. Also, in this case, it is not necessary to replace the rollers due to abrasion in a short period of time, and the maintenance cost of the backup roller 8 or the split roller 2 which is costly because of its relatively high accuracy is significantly reduced.

Of course, the scope of the present invention is not limited to the above embodiments. In the embodiment, is obtained by a device for dividing a bar-shaped substrate A _3, the material substrate A shown in FIG. 4, the vertical split groove A ₁ ... rod-like substrate A ₃ is divided along the The present invention can also be configured as a dividing device for obtaining. For that purpose, the axial length of each roller may be expanded according to the substrate width, and the belt width may be set to the width corresponding to the substrate width.

In order to form the transport path 7 by the transport belt 6, four rollers 2, 3, as shown in FIG.
Although the conveyor belt 6 may be wound around the conveyor belt 4 and 5, it is possible to form the conveyor path if there are at least two rollers. In addition to the rollers 2, 3, 4, 5 rotating at the fixed position, the tension of the conveying path is kept constant in order to give an appropriate tension to the conveying belt 6 or by absorbing the time-dependent extension of the conveying belt. In order to realize this, a so-called tension roller that elastically presses a part of the conveyor belt 6 may be provided, but it goes without saying that this case is also included in the present invention. In the same way,
There may be a case where a mechanism for applying tension to the pressing belt 10 is provided, and this case is of course included in the scope of the present invention.

[Brief description of drawings]

FIG. 1 is a schematic overall perspective view showing an embodiment of the present invention.

FIG. 2 is a sectional view showing a main part of the embodiment shown in FIG.

FIG. 3 is an explanatory diagram of a substrate dividing operation.

[Figure 4]

[Figure 5]

FIG. 6 is a plan view showing a mode of substrate division.

[Explanation of symbols]

 2 1st roller (divided roller) 3 2nd roller 6 Conveyor belt 7 Conveying path 8 Backup roller 9 Roller 10 Holding belt

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Hidemi Kubo, Inventor, 21 Mizozaki-cho, Saiin, Ukyo-ku, Kyoto ROHM Stock Company

Claims (1)

[Claims] 1. A horizontal or substantially horizontal substrate transport path is formed by winding an endless transport belt between at least two rollers, while the substrate transport path is located at the front end of the substrate transport path in the transport direction. In order for the roller around which the conveyor belt is wound to function as a split roller, a backup roller is arranged above this roller, and between the backup roller and the roller arranged on the upper surface side of an appropriate part of the conveying path. An apparatus for dividing a substrate, characterized in that an endless holding belt is wrapped around.