JPH05110215A - Power wiring board - Google Patents

Power wiring board

Info

Publication number
JPH05110215A
JPH05110215A JP3293654A JP29365491A JPH05110215A JP H05110215 A JPH05110215 A JP H05110215A JP 3293654 A JP3293654 A JP 3293654A JP 29365491 A JP29365491 A JP 29365491A JP H05110215 A JPH05110215 A JP H05110215A
Authority
JP
Japan
Prior art keywords
wiring board
foil pattern
copper
copper foil
power wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3293654A
Other languages
Japanese (ja)
Other versions
JP2856962B2 (en
Inventor
Motosumi Yura
元澄 由良
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Okuma Corp
Original Assignee
Okuma Machinery Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Okuma Machinery Works Ltd filed Critical Okuma Machinery Works Ltd
Priority to JP3293654A priority Critical patent/JP2856962B2/en
Publication of JPH05110215A publication Critical patent/JPH05110215A/en
Application granted granted Critical
Publication of JP2856962B2 publication Critical patent/JP2856962B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0263High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern

Landscapes

  • Structure Of Printed Boards (AREA)
  • Direct Current Feeding And Distribution (AREA)
  • Rectifiers (AREA)
  • Inverter Devices (AREA)

Abstract

PURPOSE:To provide a power wiring board which can suppress heat generation at a snubber circuit by making wiring inductance in an inverter device, etc., smaller. CONSTITUTION:A copper foil pattern 7 is connected with copper bars 2A and 2B and they are laid out in parallel. The copper foil pattern 7 is connected with the copper bar 2A.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、ACモータを可変速駆
動するインバータ装置等に使用されるパワー配線基板に
関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power wiring board used in an inverter device for driving an AC motor at a variable speed.

【0002】[0002]

【従来の技術】近年インバータ装置等の電力変換器に
は、印刷された銅箔パターンにより構成された通常電流
回路の配線と、貼着された銅バーにより構成された大電
流回路の配線とを有するパワー配線基板が一般的に用い
られている。図4はパワー配線基板を用いたインバータ
装置の一例を示す回路図である。ダイオードによって構
成されたコンバータ部9が交流電源を整流し、電解コン
デンサ3によって平滑する事によって一旦、直流電源を
作っている。この直流電源をIGBTやパワートランジ
スタ等によって構成されたインバータ部10において交
流に変換してモータ11を駆動制御している。この回路
から明らかなようにモータ11に流れる電流は、インバ
ータ部10を介して電解コンデンサ3とインバータ部1
0の間の直流電圧部を流れており、この直流電圧部では
インバータ素子(IGBT、パワートランジスタ)のス
イッチングによって不連続な電流となっている。またこ
の直流電圧部は電解コンデンサ3とインバータ素子の物
理的な大きさのために比較的大きな配線インダクタンス
12を持っている。
2. Description of the Related Art In recent years, a power converter such as an inverter device is provided with a wiring for a normal current circuit composed of a printed copper foil pattern and a wiring for a large current circuit composed of a pasted copper bar. The power wiring board which it has is generally used. FIG. 4 is a circuit diagram showing an example of an inverter device using a power wiring board. The converter unit 9 composed of a diode rectifies the AC power supply and smoothes it by the electrolytic capacitor 3 to once make a DC power supply. The DC power supply is converted into AC in the inverter unit 10 composed of an IGBT, a power transistor, etc. to drive and control the motor 11. As is clear from this circuit, the current flowing through the motor 11 is transmitted through the inverter unit 10 to the electrolytic capacitor 3 and the inverter unit 1.
It flows through the DC voltage section between 0, and the DC voltage section has a discontinuous current due to switching of the inverter element (IGBT, power transistor). The DC voltage section has a relatively large wiring inductance 12 due to the physical sizes of the electrolytic capacitor 3 and the inverter element.

【0003】この様に不連続な電流が流れる経路に配線
インダクタンス12が含まれる場合、その配線インダク
タンス12両端には大きなサージ電圧が発生する。そし
て、このサージ電圧はインバータ素子に印加されるた
め、一般的にインバータ素子の近傍にスナバ回路である
スナバコンデンサ5を設け、サージ電圧がインバータ素
子を破壊することの無い様にしている。図2は従来のパ
ワー配線基板の一例を示す斜視図である。パワー配線基
板1の表面には銅箔パターン6が印刷されており、銅箔
パターン6に例えばスナバコンデンサ5の端子が接続さ
れる。パワー配線基板1の裏面には直流電圧部の正電圧
部及び負電圧部を成す銅バー2A,2Bが貼着されてお
り、銅バー2A,2Bに例えば電解コンデンサ3やIG
BTモジュール4A,4B,4Cの各端子が接続され
る。この接続は図3に示すように各端子に埋込まれた埋
込ナット14に、銅バー2Aを貫装しているネジ15を
螺合することにより成される。
When the wiring inductance 12 is included in the path through which the discontinuous current flows, a large surge voltage is generated across the wiring inductance 12. Since this surge voltage is applied to the inverter element, a snubber capacitor 5 which is a snubber circuit is generally provided near the inverter element to prevent the surge voltage from destroying the inverter element. FIG. 2 is a perspective view showing an example of a conventional power wiring board. A copper foil pattern 6 is printed on the surface of the power wiring board 1, and the terminals of the snubber capacitor 5, for example, are connected to the copper foil pattern 6. Copper bars 2A, 2B forming a positive voltage portion and a negative voltage portion of a DC voltage portion are attached to the back surface of the power wiring board 1, and the copper bars 2A, 2B are, for example, electrolytic capacitors 3 and IG.
The terminals of the BT modules 4A, 4B, 4C are connected. This connection is made by screwing a screw 15 penetrating the copper bar 2A into an embedded nut 14 embedded in each terminal as shown in FIG.

【0004】[0004]

【発明が解決しようとする課題】上述した従来のパワー
配線基板を用いたインバータ装置等では、配線インダク
タンスが大きいため、発生するサージ電圧も大きくな
る。従って、このサージ電圧を吸収するために設けたス
ナバ回路の発熱が著しくなるという欠点があった。本発
明は上述した事情から成されたものであり、本発明の目
的は、インバータ装置等における配線インダクタンスを
小さくしてスナバ回路の発熱を抑制することができるパ
ワー配線基板を提供することにある。
In the above-mentioned conventional inverter device using the power wiring board, since the wiring inductance is large, the surge voltage generated is also large. Therefore, there is a drawback that the snubber circuit provided for absorbing this surge voltage remarkably generates heat. The present invention has been made in view of the above-mentioned circumstances, and an object of the present invention is to provide a power wiring board capable of suppressing the heat generation of a snubber circuit by reducing the wiring inductance in an inverter device or the like.

【0005】[0005]

【課題を解決するための手段】本発明は、印刷された銅
箔パターンにより構成された通常電流回路の配線と、直
流電圧部の正電圧部若しくは負電圧部の一方を成す貼着
された第1の銅バー及び前記正電圧部若しくは負電圧部
の他方を成す貼着された第2の銅バーにより構成された
大電流回路の配線とを有するパワー配線基板に関するも
のであり、本発明の上記目的は、前記銅箔パターンと前
記第1及び第2の銅バーとを近接させかつ平行となるよ
うに配設し、前記銅箔パターンと前記第1の銅バーとを
接続することによって達成される。
According to the present invention, the wiring of a normal current circuit composed of a printed copper foil pattern and one of a positive voltage portion and a negative voltage portion of a DC voltage portion are attached. The present invention relates to a power wiring board having a large current circuit wiring composed of one copper bar and a second copper bar which is adhered and forms the other of the positive voltage portion and the negative voltage portion. The object is achieved by arranging the copper foil pattern and the first and second copper bars so as to be close to and parallel to each other, and connecting the copper foil pattern and the first copper bar. It

【0006】[0006]

【作用】本発明にあっては、銅箔パターンに接続された
銅バーの配線を配線インダクタンスの小さな別の経路で
補助的に接続することができるので、直流電圧部に流れ
る不連続な電流の高周波成分は速やかに銅箔パターンを
流れる。この結果、スナバ回路に流れる電流の大部分が
銅箔パターンを通って電解コンデンサに流れるようにな
り、スナバ回路の発熱を大幅に低減することができる。
In the present invention, the wiring of the copper bar connected to the copper foil pattern can be supplementarily connected by another path having a small wiring inductance, so that the discontinuous current flowing in the DC voltage section can be prevented. The high frequency component quickly flows through the copper foil pattern. As a result, most of the current flowing in the snubber circuit will flow into the electrolytic capacitor through the copper foil pattern, and the heat generation of the snubber circuit can be significantly reduced.

【0007】[0007]

【実施例】図1は本発明のパワー配線基板の一例を図2
に対応させて示す斜視図であり、同一構成箇所は同符号
を付して説明を省略する。パワー配線基板1の表面には
銅バー2A,2Bに重なり合うように銅箔パターン7が
印刷されている。そして、銅箔パターン7部分に穿設さ
れたスルーホール13A,13B,13C,13Dによ
って、銅箔パターン7と銅バー2Aとが接続されてい
る。また、パワー配線基板1の裏面にはスナバコンデン
サ5の一端子が接続される裏面銅箔パターン8が印刷さ
れている。このように、銅箔パターン7と銅バー2A,
2Bとは近接しかつ平行となっており、銅箔パターン7
と銅バー2A,2Bによって直流電圧部の配線回路を構
成しているので、配線インダクタンスを非常に小さくす
ることができる。なお、本実施例ではスナバ回路として
コンデンサを使用したが、例えばコンデンサとダイオー
ドや抵抗器とを組合せたスナバ回路であっても同様の効
果を奏する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows an example of a power wiring board according to the present invention.
It is a perspective view shown corresponding to, and the same components are denoted by the same reference numerals and the description thereof is omitted. A copper foil pattern 7 is printed on the surface of the power wiring board 1 so as to overlap the copper bars 2A and 2B. The copper foil pattern 7 and the copper bar 2A are connected by the through holes 13A, 13B, 13C and 13D formed in the copper foil pattern 7 portion. On the back surface of the power wiring board 1, a back surface copper foil pattern 8 to which one terminal of the snubber capacitor 5 is connected is printed. In this way, the copper foil pattern 7 and the copper bar 2A,
2B is close and parallel to the copper foil pattern 7
Since the wiring circuit of the DC voltage section is constituted by the copper bars 2A and 2B, the wiring inductance can be made extremely small. Although the capacitor is used as the snubber circuit in this embodiment, the same effect can be obtained even if the snubber circuit is a combination of a capacitor and a diode or a resistor.

【0008】[0008]

【発明の効果】以上のように本発明のパワー配線基板に
よれば、インバータ装置等においてスナバ回路の発熱を
大幅に軽減することができるため、従来に比べて簡単で
安価なスナバ回路によってスイッチング周波数の高周波
化を実現することができる。
As described above, according to the power wiring board of the present invention, the heat generation of the snubber circuit in the inverter device or the like can be greatly reduced, so that the switching frequency can be reduced by the snubber circuit which is simpler and cheaper than the conventional one. It is possible to realize higher frequency.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明のパワー配線基板の一例を示す斜視図で
ある。
FIG. 1 is a perspective view showing an example of a power wiring board of the present invention.

【図2】従来のパワー配線基板の一例を示す斜視図であ
る。
FIG. 2 is a perspective view showing an example of a conventional power wiring board.

【図3】パワー配線基板における配線接続部の一例を示
す断面図である。
FIG. 3 is a cross-sectional view showing an example of a wiring connection portion of a power wiring board.

【図4】パワー配線基板を用いたインバータ装置の一例
を示す回路図である。
FIG. 4 is a circuit diagram showing an example of an inverter device using a power wiring board.

【符号の説明】[Explanation of symbols]

1 パワー配線基板 2A,2B 銅バー 6,7,8 銅箔パターン 1 Power wiring board 2A, 2B Copper bar 6, 7, 8 Copper foil pattern

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 印刷された銅箔パターンにより構成され
た通常電流回路の配線と、直流電圧部の正電圧部若しく
は負電圧部の一方を成す貼着された第1の銅バー及び前
記正電圧部若しくは負電圧部の他方を成す貼着された第
2の銅バーにより構成された大電流回路の配線とを有す
るパワー配線基板において、前記銅箔パターンと前記第
1及び第2の銅バーとを近接させかつ平行となるように
配設し、前記銅箔パターンと前記第1の銅バーとを接続
するようにしたことを特徴とするパワー配線基板。
1. A wire for a normal current circuit composed of a printed copper foil pattern, a first copper bar attached to form one of a positive voltage portion and a negative voltage portion of a DC voltage portion, and the positive voltage. Part or a negative voltage part, the power wiring board having a wiring of a large current circuit composed of the adhered second copper bar which forms the other of the copper foil pattern and the first and second copper bars. Are arranged so as to be close to and parallel to each other, and the copper foil pattern and the first copper bar are connected to each other.
【請求項2】 前記銅箔パターンと前記第1及び第2の
銅バーとを基板の表裏に重なり合うように配設した請求
項1に記載のパワー配線基板。
2. The power wiring board according to claim 1, wherein the copper foil pattern and the first and second copper bars are arranged so as to overlap with the front and back of the board.
JP3293654A 1991-10-14 1991-10-14 Power wiring board Expired - Fee Related JP2856962B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3293654A JP2856962B2 (en) 1991-10-14 1991-10-14 Power wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3293654A JP2856962B2 (en) 1991-10-14 1991-10-14 Power wiring board

Publications (2)

Publication Number Publication Date
JPH05110215A true JPH05110215A (en) 1993-04-30
JP2856962B2 JP2856962B2 (en) 1999-02-10

Family

ID=17797518

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3293654A Expired - Fee Related JP2856962B2 (en) 1991-10-14 1991-10-14 Power wiring board

Country Status (1)

Country Link
JP (1) JP2856962B2 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10285950A (en) * 1997-04-03 1998-10-23 Fuji Electric Co Ltd Main circuit for three-level power converter
JP2005094887A (en) * 2003-09-16 2005-04-07 Toyota Motor Corp Power transformer
JP2006190972A (en) * 2004-12-08 2006-07-20 Mitsubishi Electric Corp Power semiconductor device
WO2008108022A1 (en) * 2007-03-01 2008-09-12 Mitsubishi Heavy Industries, Ltd. Integrated electric compressor
JPWO2011016360A1 (en) * 2009-08-03 2013-01-10 株式会社安川電機 Power converter
JP2013172620A (en) * 2012-02-22 2013-09-02 Mitsubishi Electric Corp Power module
JP2015223047A (en) * 2014-05-23 2015-12-10 三菱電機株式会社 Semiconductor device
CN114446643A (en) * 2020-11-05 2022-05-06 三菱电机株式会社 Power conversion device

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10285950A (en) * 1997-04-03 1998-10-23 Fuji Electric Co Ltd Main circuit for three-level power converter
JP2005094887A (en) * 2003-09-16 2005-04-07 Toyota Motor Corp Power transformer
JP2006190972A (en) * 2004-12-08 2006-07-20 Mitsubishi Electric Corp Power semiconductor device
US9909578B2 (en) 2007-03-01 2018-03-06 Mitsubishi Heavy Industries, Ltd. Integrated electric compressor
JP2008220005A (en) * 2007-03-01 2008-09-18 Mitsubishi Heavy Ind Ltd Integrated electric compressor
WO2008108022A1 (en) * 2007-03-01 2008-09-12 Mitsubishi Heavy Industries, Ltd. Integrated electric compressor
JPWO2011016360A1 (en) * 2009-08-03 2013-01-10 株式会社安川電機 Power converter
JP5678884B2 (en) * 2009-08-03 2015-03-04 株式会社安川電機 Power converter
JP2013172620A (en) * 2012-02-22 2013-09-02 Mitsubishi Electric Corp Power module
JP2015223047A (en) * 2014-05-23 2015-12-10 三菱電機株式会社 Semiconductor device
CN114446643A (en) * 2020-11-05 2022-05-06 三菱电机株式会社 Power conversion device
JP2022074617A (en) * 2020-11-05 2022-05-18 三菱電機株式会社 Power conversion device
CN114446643B (en) * 2020-11-05 2024-01-19 三菱电机株式会社 Power conversion device

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