JPH05109872A - Method and apparatus for correction of position thin semiconductor device - Google Patents

Abstract

PURPOSE:To correct the position of many thin semiconductor devices simultaneously and with high accuracy. CONSTITUTION:The method to correct the position of a semiconductor device is constituted in the following manner: an energy is applied, in the oblique direction by means of a vibration and/or an air blower, to a position correction base 10 where many square thin holes 11 have been made by keeping their positions and their intervals with high accuracy in the row direction and the column direction; and semiconductor devices 1 which have been held in the holes 11 are pressed to two sides of the holes 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a position correction device used in the manufacture of thin semiconductor devices.

[0002]

2. Description of the Related Art In a thin type semiconductor device, as shown in a perspective view of FIG. 4, a main body of a package 2 of a semiconductor device 1 as a whole has a parallel and planar form, and leads 3 are provided on four sides of the package 2. Protruding QFP or TQF
Various semiconductor devices 1 have been announced as a representative of the semiconductor device 1 called P. Such a semiconductor device 1
For example, when the leads 3 are inserted into a socket (not shown) in the measurement step of determining the final quality of the product, one by one from the resin tray (not shown) used for shipping, the suction nozzle ( (Not shown), after being sucked and sucked, or once placed on the position correction station 4 as shown in FIGS. 5A and 5B, four position correction claws 5 of the mechanical mechanism are shown by arrows at the same time from four directions. Thus, the position of the package 2 is corrected, the semiconductor device 1 is correctly set in the socket by the suction nozzle, and the measurement is performed.

[0003]

As described above, when the position correction is performed by the mechanical mechanism that simultaneously moves from four directions, the mechanism of the mechanical mechanism becomes complicated, the manufacturing cost of the manufacturing equipment is increased, and the maintenance is very troublesome. Advanced technology is required. In addition, since the mechanical mechanism is complicated, the number of positions that can be simultaneously corrected is only one or two, which limits the number.

An object of the present invention is to provide a position correcting method and a position correcting device for a thin semiconductor device, which can simultaneously correct a large number of thin semiconductor devices at low cost with a simple member.

[0005]

In order to solve the above-mentioned problems, the present invention provides a positioning member having a large number of rectangular thin holes arranged in the row and column directions, and a positioning member of the positioning member. Energy adding means for moving the thin semiconductor device housed in the hole in an oblique direction, the thin semiconductor device is moved in one direction of the hole by the energy adding means, and two sides of the lead portion of the thin semiconductor device are moved to the hole 2 A method for correcting the position of a thin semiconductor device is characterized in that the position of the thin semiconductor device is corrected by bringing it into contact with a side. Further, in a position correction device for a thin semiconductor device having a positioning member in which a large number of rectangular thin holes are arranged in the row direction and the column direction,
A position correction device for a thin semiconductor device, comprising an air blowing device arranged in a row direction and a column direction on an upper part of a positioning member, and / or a vibrating device on a lower part.

[0006]

According to the present invention, therefore, the thin semiconductor device is moved in one direction of the hole by the energy adding means in a state where the thin semiconductor device is randomly aligned with the hole of the positioning member, and the two sides of the lead portion are moved to the two positions of the hole. The plurality of thin semiconductor devices are simultaneously subjected to position correction while being brought into contact with the sides.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A position correcting method and a position correcting device for a thin semiconductor device according to the present invention will be described below with reference to FIGS. FIG. 1 is an overall perspective view of a position correcting device for a thin semiconductor device of the present invention, and FIG. 2 is an overall plan view.
3A and 3B are enlarged views of the hole portion of the position correction device for explaining the position correction method. FIG. 3A is a plan view and FIG. 3B is a sectional view. As shown in FIGS. 1 and 2, the position correcting device for a thin semiconductor device of the present invention has, for example, 10 rows in the row direction and 6 rows in the column direction.
A position correction base 10 provided with a total of 60 rectangular holes 11 for position correction in a row is attached to a position correction base mount 12. FIG. 1 shows an example in which a vibrating device 13 is attached to a position correction base mounting base 12 as an energy adding means, but a nozzle 14 as shown in FIG. Air may be ejected from the nozzle 14 by arranging it at two positions with respect to the hole 11. Moreover, it is also possible to use the vibration device 13 and the nozzle 14 together as an energy adding means.

As shown in FIGS. 2 and 3, the rectangular thin hole 11 for position correction, which is the feature of the position correcting apparatus of the present invention, has two sides A and B of the rectangular position correction base 10.
Are processed with reference to the E and F surfaces that are the reference surfaces, and the positions and intervals of the A and B surfaces of each hole 11 are processed with high dimensional accuracy. At the time of position correction, the package 2 or the lead 3 slides on the bottom surface C of the hole 11 to be positioned, so that both sides A and B of the hole 11 and the bottom surface C have high finishing accuracy. Required. For the reason described above, the material of the position correction base 10 is preferably stainless steel 303 that is resistant to rust and relatively easy to process. The size of the hole 11 is made larger than the hole of the resin tray used for shipping the semiconductor device 1. The reason for this is that the resin tray used for shipping is manufactured by molding, and the dimensional accuracy and spacing accuracy of the holes of the tray are not good, and for example, 60 trays that are sucked from the resin tray are used. This is because it is necessary to surely drop all the semiconductor devices 1 into the holes 11 of the position correction base 10. However, since the semiconductor device 1 must not rotate too much and the semiconductor device 1 rotates in the hole 11, the upper limit of the size of the hole 11 is regulated.

Next, the position correcting method of the thin semiconductor device of the present invention will be described. The first position correction method is a method of performing position correction by using a vibrating device 13 as shown in FIG. 1 as an energy adding means. According to this method, the position correction base 1 mounted horizontally on the position correction base mount 12 is moved to the position correction base 1 by the vibration device 13.
0 is applied to the semiconductor device 1 in the hole 11 in a diagonal direction by moving in a diagonal direction from the upper left to the lower right in FIG. The lead 3 is pressed against the A side and B side of 11,
The position of the semiconductor device 1 is corrected by the A surface and the B surface of the hole 11. There is also a method of using the vibrating device 13 to correct the position by another method. In this method, the position correction base 10 mounted on the position correction base mounting base 12 at a slight angle so that the height decreases from the upper left to the lower right of FIG.
By applying vertical vibration to the position correction base 10 by the vibrating device 13, the semiconductor device 1 in the hole 11 moves by receiving a force in an oblique direction, and as shown in FIG. When the lead 3 is pressed against the B side, the semiconductor device 1
Is corrected by the A surface and the B surface of the hole 11. In the case of this method, when the position correction base 10 is tilted, the hole 11
It is necessary to process the positions and intervals of the holes so as to be the same as the positions and intervals of the holes 11 in the horizontal state.

In the second position correction method, the nozzle 14 as shown in FIG.
This is a method in which two holes 11 are arranged in the upper part of 0 and air is ejected from the nozzle 14 to correct the position. By this method, the semiconductor device 1 in the hole 11 is moved by receiving a force in an oblique direction by the pressure of air, and the leads 3 are pressed against the A surface and the B surface of the hole 11 as shown in FIGS. 2 and 3. Then, the position of the semiconductor device 1 is corrected by the A surface and the B surface of the hole 11.

The third position correcting method uses a vibrating device 13 as shown in FIG. 1 and a nozzle 14 as shown in FIG.
This is a method of ejecting air from the nozzle 14 to correct the position while applying vertical vibration to the semiconductor device 1 by the vibration device 13. In the case of this method, since the semiconductor device 1 is vertically vibrated by the vibrating device 13,
Even if the pressure of the air ejected from the nozzle 14 is weaker than the pressure of the air in the second position correction method, the semiconductor device 1 can be moved. Further, by utilizing the fact that the pressure of the air is weak, disposing two nozzles 14 at each hole 11 is stopped, and a thin strip shape is shown on the upper side and the left side in the drawing of the position correction base shown in FIG. It is possible to correct the position of the semiconductor device 1 by moving the semiconductor device 1 by the weak air pressure from the thin band-shaped air ejection port.

[0012]

According to the present invention, a large number of thin semiconductor devices are simultaneously subjected to position correction at the same time. Further, since the positioning is performed by the positioning device having the simple structure by using the positioning method of the simple method, the manufacturing equipment can be manufactured at a low cost, and the maintenance does not require a high technique.

[Brief description of drawings]

FIG. 1 is an overall perspective view of a position correction device for a thin semiconductor device according to the present invention.

FIG. 2 is an overall plan view of a position correction device for a thin semiconductor device of the present invention.

3A and 3B are enlarged views of a hole portion of a position correction device for explaining a position correction method, in which A is a plan view and B is a cross-sectional view.

FIG. 4 is a perspective view of a thin semiconductor device.

5A and 5B are explanatory views of a position correction method for a conventional thin semiconductor device, in which A is a plan view and B is a side view.

[Explanation of symbols]

 1 Semiconductor Device 2 Package 3 Lead 4 Position Correcting Station 5 Position Correcting Claw 10 Position Correcting Base 11 Hole 12 Position Correcting Base Mount 13 Vibrating Device 14 Nozzle

Claims (5)

[Claims] 1. A positioning member having a large number of rectangular thin holes arranged in a row direction and a column direction, and energy adding means for moving a thin semiconductor device housed in the hole of the positioning member in an oblique direction. The energy adding means moves the thin semiconductor device in one direction of the hole, and the two sides of the lead portion of the thin semiconductor device are brought into contact with the two sides of the hole to correct the position of the thin semiconductor device. A method for correcting the position of a thin semiconductor device, which comprises: 2. The position correction method for a thin semiconductor device according to claim 1, wherein the energy adding means is based on vibration. 3. The position correction method for a thin semiconductor device according to claim 1, wherein the energy adding means is provided by blowing air. 4. The position correcting method for a thin semiconductor device according to claim 1, wherein the energy adding means is a combination of vibration type and air blowing type. 5. A position correction device for a thin semiconductor device having a positioning member having a large number of rectangular thin holes arranged in a row direction and a column direction, wherein a vibrating device is provided below the positioning member, and / or an upper part. A position correction device for a thin semiconductor device, comprising an air blowing device arranged in a row direction and a column direction.