JPH05109869A - Die bonding apparatus - Google Patents

Abstract

PURPOSE:To prevent a semiconductor chip from being damaged when the semiconductor chip is pushed up defectively and it is pushed up by a method wherein the vibration in a direction which is parallel to and/or perpendicular to the axial-line direction of a pushing-up needle is applied to the pushing-up needle at a die bonding apparatus. CONSTITUTION:A needle holder 12 to which pushing-up needles 10 have been attached is situated at the lower part of a semiconductor chip 20 which has been attached to an adhesive sheet 30. A semiconductor chip situated around the semiconductor chip to be picked up is fixed. Then, the needle holder 12 is moved to the upper part; at the same time, the needle holder 12 is moved, at a frequency of 1 to 15kHz, to a direction which is parallel to or perpendicular to the axial-line direction of the pushing-up needles 10. The adhesive sheet 30 and the semiconductor chip 20 are pushed upward by means of the pushing-up needles 10. Then, the vibration which has been applied to the pushing-up needles 10 is transmitted to the adhesive sheet 30 and the semiconductor chip 20; one part of the semiconductor chip 20 is stripped from the adhesive sheet 30; the semiconductor chip 20 can be picked up easily.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die bonding apparatus having a protruding needle.

[0002]

2. Description of the Related Art A back surface bumping method is used in a die bonding process. This method is a method in which a semiconductor chip is directly picked up by a pickup tool after a dicing process in which an adhesive sheet is attached to the back surface of the wafer to separate the wafer into semiconductor chips, and a push-up needle is pushed up from the back surface of the adhesive sheet. The semiconductor chip picked up is sent to the next die bonding step.

[0003]

In the conventional die bonding apparatus, the semiconductor needle 20 is pushed up by the push-up needle 10 due to the adhesive force between the adhesive sheet 30 and the semiconductor chip 20 or the resistance of the adhesive sheet 30. In this case, as schematically shown in FIG. 4, the semiconductor chip 20 may not be picked up by a pickup tool (not shown), which may cause a semiconductor chip push-up failure.

Further, there is also a problem that when pushed up by the push-up needle 10, an elongated object such as a semiconductor chip for a CCD linear sensor is broken and damaged.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a die bonding apparatus having an improved thrusting needle which does not cause the semiconductor chip to be pushed up defectively or to be damaged during pushing up.

[0006]

The above object can be achieved by a die bonding apparatus characterized in that vibrations parallel and / or at right angles to the axial direction of the protruding needle are applied to the protruding needle. Vibration can be applied to the thrust needle electrically or mechanically.

[0007]

In the die bonding apparatus of the present invention, when the semiconductor chip 20 is pushed up by the push-up needle 10, the vibration applied to the push-up needle is transmitted to the semiconductor chip 20 and the adhesive sheet 30. As a result, a part or the whole surface of the semiconductor chip 20 is easily peeled off from the adhesive sheet 30, as schematically shown in FIG. Therefore, the push-up needle does not cause the push-up failure of the semiconductor chip.

Although it depends on the size of the semiconductor chip, the adhesive force between the semiconductor chip and the pressure sensitive adhesive sheet, the resistance of the pressure sensitive adhesive sheet, etc., the frequency of the vibration applied to the bump needle is shown from the results of various tests. Has been found to be preferably between 1 and 15 kHz. Moreover, it is desirable that the amplitude of the vibration applied to the tip of the protruding needle is 0.5 to 50 μm.

[0009]

EXAMPLE FIG. 2A shows an enlarged front view of a protruding needle portion of the die bonding apparatus of the present invention. Seven protruding needles 10 are attached to a needle holder 12. In FIG. 2A, 20 is a semiconductor chip and 30 is an adhesive sheet.

The needle holder 12 shown in FIG.
Are mounted on an XY table (not shown) for the thrust needle. The needle holder 12 is positioned below the semiconductor chip 20 attached to the adhesive sheet 30 by moving the XY table for the protruding needle. Then, the semiconductor chip around the semiconductor chip to be picked up is fixed by a vacuum holder (not shown).

Next, the needle holder 12 is moved upward by a micrometer head (not shown), and at the same time, the needle holder 12 is vibrated by a vibrator (not shown). The vibrator is disposed below the needle holder, is connected to the needle holder, and is vibrated by the oscillator. The direction of vibration is horizontal or vertical to the axial direction of the ascending needle. The frequency is 1 to 50 kHz, and the amplitude of vibration applied to the tip of the protruding needle is 15 μm.

When the needle holder 12 is moved upward, the push-up needle 10 pushes up the adhesive sheet 30 and the semiconductor chip 20. The vibration applied to the protrusion needle 10 is transmitted to the adhesive sheet 30 and the semiconductor chip 20, and a part of the semiconductor chip 20 is peeled off from the adhesive sheet 30 (see FIG. 1A). The semiconductor chip 20 pushed up is easily picked up by a pickup tool (not shown) and sent to the next die bonding step.

Alternatively, when the push-up needle 10 pushes the adhesive sheet 30 and the semiconductor chip 20 upward, the push-up needle 10 penetrates the adhesive sheet 30, and the entire surface of the semiconductor chip 20 is peeled off from the adhesive sheet 30. It may be pushed up by the upper needle 10 (see FIG. 1B). The semiconductor chip 20 pushed up is
It is easily picked up by a pick-up tool (not shown) and sent to the next die bonding step.

The protruding needles 10 in the needle holder 12 may be arranged in one row as shown in the enlarged plan view of FIG. 3A, or may be arranged in a plurality of rows.
They may be arranged in a staggered manner as shown in the enlarged plan views of (B) to (F). When the protruding needles are arranged in one row, the straight line connecting the tips of the plurality of protruding needles may be parallel to the horizontal plane as shown in FIG.
In addition, as shown in the enlarged front view, it may be inclined at a constant angle θ. In FIG. 2 (B), L is a straight extension line connecting the tips of the protruding needles, and H is a horizontal line.
If the protruding needles are arranged in multiple rows or in a staggered pattern,
The plane including the tips of the plurality of protruding needles is shown in FIG.
As shown in (B), it may be parallel to the horizontal plane or may be inclined at a constant angle.

Although the present invention has been described based on the preferred embodiments, the die bonding apparatus of the present invention is not limited to these embodiments. Number of thrust needles,
The position of the push-up needle is appropriately changed depending on the size of the semiconductor chip, the arrangement state of the semiconductor chips, the adhesive force between the adhesive sheet and the semiconductor chip, the resistance of the adhesive sheet, the size of the die bonding device, etc. be able to.

A piezoelectric element or the like can be used as an electric means for applying vibration to the protruding needle, and the protruding needle can be set on the piezoelectric element. Further, as a mechanical means, a vibration motor, a vibrator or the like can be used. Further, the direction of vibration may be in a direction perpendicular to the axial direction of the protruding needle, or in both directions parallel and perpendicular.

[0017]

In the die bonding apparatus of the present invention, when the semiconductor chip is pushed up by the push-up needle, the vibration applied to the push-up needle is transmitted to the adhesive sheet and the semiconductor chip. As a result, a part or the whole surface of the semiconductor chip is easily peeled off from the adhesive sheet, so that it is possible to prevent the push-up needle from causing the semiconductor chip to be pushed up. Further, since damage to the semiconductor chips can be prevented, the yield is improved. Furthermore, the time required to pick up the semiconductor chip can be shortened.

[Brief description of drawings]

FIG. 1 is a schematic view showing a state where a semiconductor chip is pushed up by a die bonding apparatus of the present invention.

FIG. 2 is an enlarged plan view of a protrusion needle and a needle holder of the die bonding apparatus of the present invention.

FIG. 3 is an enlarged plan view showing an array state of the thrust needles.

FIG. 4 is a schematic view showing a semiconductor chip push-up failure state in a conventional die bonding apparatus.

[Explanation of symbols]

 10 Projection needle 12 Needle holder 20 Semiconductor chip 30 Adhesive sheet

Claims (2)

[Claims] 1. A die bonding apparatus, wherein vibrations parallel and / or perpendicular to the axial direction of the protruding needle are applied to the protruding needle. 2. The die bonding apparatus according to claim 1, wherein the vibration frequency applied to the bump needle is 1 to 15 kHz.