JPH051076Y2 - - Google Patents
Info
- Publication number
- JPH051076Y2 JPH051076Y2 JP1983126029U JP12602983U JPH051076Y2 JP H051076 Y2 JPH051076 Y2 JP H051076Y2 JP 1983126029 U JP1983126029 U JP 1983126029U JP 12602983 U JP12602983 U JP 12602983U JP H051076 Y2 JPH051076 Y2 JP H051076Y2
- Authority
- JP
- Japan
- Prior art keywords
- hemispherical
- case
- electrode plate
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 25
- 239000002184 metal Substances 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000005219 brazing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000789 Aluminium-silicon alloy Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12602983U JPS6033438U (ja) | 1983-08-13 | 1983-08-13 | 半導体マウント用ケ−ス |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12602983U JPS6033438U (ja) | 1983-08-13 | 1983-08-13 | 半導体マウント用ケ−ス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6033438U JPS6033438U (ja) | 1985-03-07 |
| JPH051076Y2 true JPH051076Y2 (ru) | 1993-01-12 |
Family
ID=30286714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12602983U Granted JPS6033438U (ja) | 1983-08-13 | 1983-08-13 | 半導体マウント用ケ−ス |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6033438U (ru) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5626948B2 (ru) * | 1974-06-04 | 1981-06-22 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS593580Y2 (ja) * | 1979-08-03 | 1984-01-31 | サンケン電気株式会社 | 半導体チツプ支持装置 |
-
1983
- 1983-08-13 JP JP12602983U patent/JPS6033438U/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5626948B2 (ru) * | 1974-06-04 | 1981-06-22 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6033438U (ja) | 1985-03-07 |
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