JPH05104164A - Die for working lead of semiconductor equipment - Google Patents

Abstract

PURPOSE:To improve the quality of a semiconductor equipment by preventing a transverse bend of a lead, a solder adhesion or a scratch. CONSTITUTION:A bending punch 1 constitutes a working die for an external lead of the semiconductor equipment and the tip of the external lead is bent by it. Straightening grooves 2 having a width each a little larger than the lead width are provided on the bending punch 1 corresponding to the lead, therefore, the lead is prevented being bent transversely by this groove 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead processing die for a semiconductor device comprising a bending punch and a bending die.

[0002]

2. Description of the Related Art FIG. 4 (a) is a perspective view of a conventional first tip bending punch 11, FIG. 4 (b) is a perspective view of a conventional second tip bending punch 12, and FIG. 5 (a) is a J bend. Bending die 1
3 is a perspective view, and FIG. 3B is a side view of the same. FIG. 6 is a side view of the semiconductor device 6, and 7 is an external lead before being molded. In FIG. 7, the external lead 7 of the semiconductor device 6 is connected to the first and second tip bending punches 11 and 12 and the bending die 13.
FIG. 8 is an operation diagram showing a lead bend step of forming and processing by. In the figure, 15 is a first tip bending die, 1
6 is a second tip bending die, 17 is a 70 ° bending roller,
Reference numeral 18 is a 90 ° bending roller, and 19 is a stripper for pressing the semiconductor device 6.

Next, the operation will be described. First in FIG. 7 (a)
In the tip bending step, the semiconductor device 6 is held by the first tip bending punch 11 and the first tip bending mold die 15,
Bend the tip of the external lead 7. Next, in the second tip bending step of FIG. 7B, the semiconductor device 6 is held by the second tip bending punch 12 and the second tip bending die 16 to deepen the bending of the tip of the lead 7. .. Subsequently, in the 70 ° bend process of FIG. 7C, 70 °
The bending roller 17 causes the lead 7 to move 70 ° from the root.
Fold it in. Further, in the 90 ° bend process of FIG. 7D, the lead 7 is bent from the root portion to 90 ° by the 90 ° bending roller 18. Finally, in the J bend process of FIG. 7E, the semiconductor device 6 is held by the J bend bending die 13 and the stripper 19, and the external lead 7
Is molded into a J shape.

[0004]

By the way, in the above-mentioned conventional die for lead processing, when the external lead 7 is not formed symmetrically with respect to the CC line at the time of producing the lead frame, Does not apply an even force to the lead 7 in the bending process, so that the lead 7 is laterally deformed like the lead 22 shown in FIG.
There has been a problem that a short circuit occurs between adjacent leads. Further, in the J bend process, when the lead 7 bent at 90 ° enters the J bend die 3, the solder plating layer 8 which is in sliding contact with the side surface of the J bend die 3 and adheres to the surface of the lead 7 by the electroplating method. Are peeled off to generate solder scraps 21, and the solder scraps 21 are deposited on the J-bend die 3. Then, when the next semiconductor device 6 is molded by the J-bend die 3, the semiconductor device 6 adheres to the surface of the lead 7 and becomes an adhering substance 21 as shown in FIG. 9, which causes a short circuit, and is difficult to mount on the substrate. There was an inconvenience. The present invention has been made in view of the above conventional problems or inconveniences, and an object of the present invention is to prevent lateral bending of leads, solder adhesion, or scratches, and to improve the quality of semiconductor devices. To provide a die for lead processing.

[0005]

To achieve this object, a lead processing die according to the present invention is a semiconductor device lead comprising a bending punch and a bending die for bending the leads of the semiconductor device at a predetermined angle. In the processing die, the bending punch and the bending die are provided with lead straightening grooves corresponding to the leads of the semiconductor device. In addition, the lead processing die according to the present invention is provided with a guide portion having a gentle inclination of the groove at the entrance of the lead straightening groove of the bending die.

[0006]

In the present invention, the lead, which is asymmetrical when the lead frame is molded, is corrected into a predetermined shape by the groove for correcting the lead. Further, the reed is smoothly guided from the guiding portion to the correction groove.

[0007]

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of a bending punch of a lead processing die according to the present invention, FIG. 2 (a) is a perspective view of a bending die, and FIG. 2 (b) is a side view thereof. In these figures,
The feature of the present invention resides in that the bending punch 1 and the bending die 3 are provided with several straightening grooves 2 and 4. These straightening grooves 2 and 4 are formed on the external leads 7 of the semiconductor device 6.
Is provided at a position corresponding to
Has a width slightly larger than that of the lead 7, and the grooves 2, 4
The slopes of the bottoms are formed in the same shape as the surface of the bending punch 1 or the bending die 3, respectively. Further, the upper portion of the groove 4 of the bending die 3 is formed more gently by an angle θ than the inclination of the surface of the bending die 3, and a guiding portion 4a for guiding and guiding the lead 7 below the groove 4 is provided. ..

Next, the operation will be described. Even when the external lead 7 is formed asymmetrical about the C-C line at the time of molding the lead frame, the first and second parts of FIGS. 7A and 7B are formed.
In the step of bending the tip of the
The outer lead 7 is processed into a predetermined shape because the groove 2 enters the groove 2 and the tip is bent, and at the same time, even if a lateral force acts on the lead 7, it is restrained by the groove 2 in a corrective manner. Subsequently, through the 70 ° and 90 ° bending steps of FIGS. 7C and 7D, in the J bend step of FIG. 7E, the external lead 7 enters the groove 4 of the bending die 3, and in this step. The lateral force on the lead 7 due to the asymmetrical shape is restrained by the groove 4 to prevent the lead 7 from bending laterally.

Further, in the present invention, since the guiding portion 4a is provided above the groove 4 of the bending die 3, FIG.
After the 90 ° bending step of (d), the leads 7 of the semiconductor device 6
When the solder enters the groove 4 of the bending die 3 in the J-bending process, the solder plating 8 on the side surface of the lead 7 smoothly enters the groove 4 in the vicinity of the entrance of the groove 4 of the bending die 3 as shown in FIG. As a result, the solder plating 8 does not peel off, so that the generation of solder scraps can be reduced and the solder adhesion to the external leads 7 can be prevented. In addition, although the example applied to the J-type package is shown in the present embodiment, the present invention is not limited to this, and by forming the groove similar to the above in the bending punch of the gull wing type package or the DIP type package, the same action and effect can be obtained. Of course, it can be obtained.

[0010]

As described above, according to the present invention, since the bending punch and the bending die of the lead processing die are provided with the straightening groove for receiving the external lead, the lateral bending of the lead is prevented during the lead processing. can do. Further, since the guiding portion is provided in the groove of the bending die, it is possible to prevent the lead surface from being scratched or the solder is adhered, which has the effect of improving the quality of the semiconductor device.

[Brief description of drawings]

FIG. 1 is a perspective view of a bending punch of a lead processing die according to the present invention.

2A and 2B show a bending die of a lead processing die according to the present invention, wherein FIG. 2A is a perspective view and FIG. 2B is a side view.

FIG. 3 is a side view showing a state in which a semiconductor device is inserted into a bending die according to the present invention.

FIG. 4 is a perspective view showing a conventional bending punch.

FIG. 5 shows a conventional bending die, (a) is a perspective view,
(B) is a side view.

FIG. 6 is a plan view of a semiconductor device.

FIG. 7 is a diagram showing a conventional external lead bending process.

FIG. 8 is a side view showing a state in which a semiconductor device is inserted into a conventional bending die.

FIG. 9 is a perspective view showing a state where the bending process of the leads of the conventional semiconductor device is completed.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Bending punch 2 Straightening groove 3 Bending die 4 Straightening groove 4a Guide part 6 Semiconductor device 7 External lead

Claims (2)

[Claims] 1. A lead processing die for a semiconductor device, comprising a bending punch and a bending die for bending the leads of the semiconductor device at a predetermined angle, wherein the bending punch and the bending die correspond to the leads of the semiconductor device. A lead processing die for a semiconductor device, which is provided with a groove for correcting a lead. 2. The lead processing die for a semiconductor device according to claim 1, wherein a lead-in portion having a gentle inclination is provided at an entrance portion of the lead straightening groove of the bending die. Mold for semiconductor device lead processing.