JPH0499833U - - Google Patents
Info
- Publication number
- JPH0499833U JPH0499833U JP1991003992U JP399291U JPH0499833U JP H0499833 U JPH0499833 U JP H0499833U JP 1991003992 U JP1991003992 U JP 1991003992U JP 399291 U JP399291 U JP 399291U JP H0499833 U JPH0499833 U JP H0499833U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/0711—
-
- H10W72/07178—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991003992U JP2539807Y2 (ja) | 1991-02-06 | 1991-02-06 | ワイヤーボンダにおけるリードフレーム押さえ機構 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991003992U JP2539807Y2 (ja) | 1991-02-06 | 1991-02-06 | ワイヤーボンダにおけるリードフレーム押さえ機構 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0499833U true JPH0499833U (enExample) | 1992-08-28 |
| JP2539807Y2 JP2539807Y2 (ja) | 1997-07-02 |
Family
ID=31733406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1991003992U Expired - Lifetime JP2539807Y2 (ja) | 1991-02-06 | 1991-02-06 | ワイヤーボンダにおけるリードフレーム押さえ機構 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2539807Y2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017092313A (ja) * | 2015-11-12 | 2017-05-25 | 株式会社東芝 | 半導体製造装置。 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61241933A (ja) * | 1985-04-19 | 1986-10-28 | Hitachi Ltd | 半導体製造装置 |
| JPS6451628A (en) * | 1987-08-24 | 1989-02-27 | Hitachi Ltd | Wire bonding device |
-
1991
- 1991-02-06 JP JP1991003992U patent/JP2539807Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61241933A (ja) * | 1985-04-19 | 1986-10-28 | Hitachi Ltd | 半導体製造装置 |
| JPS6451628A (en) * | 1987-08-24 | 1989-02-27 | Hitachi Ltd | Wire bonding device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017092313A (ja) * | 2015-11-12 | 2017-05-25 | 株式会社東芝 | 半導体製造装置。 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2539807Y2 (ja) | 1997-07-02 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19970218 |