JPH0498881A - Led head - Google Patents
Led headInfo
- Publication number
- JPH0498881A JPH0498881A JP2216273A JP21627390A JPH0498881A JP H0498881 A JPH0498881 A JP H0498881A JP 2216273 A JP2216273 A JP 2216273A JP 21627390 A JP21627390 A JP 21627390A JP H0498881 A JPH0498881 A JP H0498881A
- Authority
- JP
- Japan
- Prior art keywords
- led array
- array chip
- light
- led
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims abstract description 9
- 230000000903 blocking effect Effects 0.000 abstract 3
- 230000001627 detrimental effect Effects 0.000 abstract 1
- 230000007547 defect Effects 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 108091008695 photoreceptors Proteins 0.000 description 2
- 239000000470 constituent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Led Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子写真系プリンタの露光用光源として使用す
るＬＥＤヘッドに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an LED head used as an exposure light source for an electrophotographic printer.
従来、この種のＬＥＤヘッドにおいては、その内部に数
１０〜数１００の発光部を有するＬＥＤアレイチップを
数１０チップ直列に並べることにより構成されている。Conventionally, this type of LED head is constructed by arranging several dozen LED array chips in series, each of which has several tens to several hundreds of light emitting parts inside.
上述した従来のＬＥＤヘッドでは、構成するＬＥＤアレ
イチップにおいて露光表面から発生する光以外に、ＬＥ
Ｄアレイチップの水平方向、即ちＬＥＤアレイチップの
切断面から漏れる光の発生が存在する。この水平方向に
漏れる光は、特にＬＥＤアレイチップを並べた継目の部
分で反射し、感光体に感光させ印字不良を形成し、また
、この部分での反射部分の形状は、感光体の方向と一致
しており、弱い光でも印字不良の発生する可能性を高く
するという欠点がある。In the conventional LED head described above, in addition to the light generated from the exposed surface of the constituent LED array chip, the LED
There is light leakage from the horizontal direction of the D array chip, that is, from the cut surface of the LED array chip. This horizontally leaking light is reflected particularly at the seam where the LED array chips are lined up, exposing the photoreceptor and causing printing defects, and the shape of the reflected portion in this area is different from the direction of the photoreceptor. This has the disadvantage that even weak light increases the possibility of printing defects.
本発明のＬＥＤヘッドは、第１の工程のＬＥＤアレイチ
ップのダイシング後に前記第１の工程のＬＥＤアレイチ
ップの切断面を覆うように前記第１の工程のＬＥＤアレ
イチップの上面に遮光膜を形成した最終工程のＬＥＤア
レイチップを有している。In the LED head of the present invention, after dicing the LED array chip in the first step, a light shielding film is formed on the upper surface of the LED array chip in the first step so as to cover the cut surface of the LED array chip in the first step. It has an LED array chip that has undergone the final process.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例の平面図である。FIG. 1 is a plan view of one embodiment of the present invention.
第１図において、本実施例のＬＥＤヘッド１のＬＥＤア
レイチップ２内には発光部１１と、アルミ電極１２と、
遮光膜１３とを有して構成している。In FIG. 1, the LED array chip 2 of the LED head 1 of this embodiment includes a light emitting part 11, an aluminum electrode 12,
A light shielding film 13 is also included.
−ＭにＬＥＤアレイチップ２は、発光部１１が直列で同
一ピッチとなるように並べられるが、本実施例のＬＥＤ
ヘッド１では継目の部分に遮光膜１３を形成することに
より、光の漏れ及び反射による印字不良を防止している
。-M, the LED array chips 2 are arranged so that the light emitting parts 11 are arranged in series and at the same pitch.
In the head 1, a light shielding film 13 is formed at the joint to prevent printing defects due to light leakage and reflection.
第２図（ａ）、（ｂ）ｔ （ｃ）はそれぞれ本実施例
の遮光膜の形成工程を示す第１図Ａ−Ａ’線断面図であ
る。FIGS. 2(a), 2(b) and 2(c) are sectional views taken along the line AA' in FIG. 1, respectively, showing the process of forming the light shielding film of this embodiment.
次に、第２図（ａ）、（ｂ）＋ （ｃ）を用いて本実
施例の遮光膜形成の製造工程について説明する。Next, the manufacturing process for forming the light shielding film of this example will be explained using FIGS. 2(a), 2(b) and 2(c).
第２図（ａ）において、ＬＥＤアレイチップ２は、まず
ダイシングラインに沿って溝１４をエツチングにより形
成し、第２図（ｂ）において、遮光膜１３を成長させる
。次にダイシングを行い、最終的に第１図のＡ−Ａ’線
断面図では第２図（Ｃ）のように切断する。即ち、溝１
４の切断面を覆うように遮光膜１３を形成する。In FIG. 2(a), in the LED array chip 2, grooves 14 are first formed by etching along the dicing lines, and in FIG. 2(b), a light shielding film 13 is grown. Next, dicing is performed, and finally the wafer is cut as shown in FIG. 2(C) in the sectional view taken along the line AA' in FIG. That is, groove 1
A light shielding film 13 is formed to cover the cut surface of 4.
以上説明したように本発明は、ＬＥＤアレイチップのダ
イシング面に遮光膜を形成することにより、有害な光の
発生を防止し、また、チップ整列時の欠は等の発生を防
止し、且つ印字不良の発生を防止することができる効果
がある。As explained above, the present invention prevents the generation of harmful light by forming a light shielding film on the dicing surface of the LED array chip, prevents the occurrence of chips etc. when aligning the chips, and also prevents printing. This has the effect of preventing the occurrence of defects.
第１図は本発明の一実施例を示す平面図、第２図（ａ）
、（ｂ）および（Ｃ）はそれぞれ本実施例の遮光膜を形
成する工程を示す第１図Ａ−Ａ’線断面図である。
１・・・ＬＥＤヘッド、２・・・ＬＥＤアレイチップ、
１１・・・発光部、１２・・・アルミ電極、１３・・・
遮光膜、１４・・・溝。Fig. 1 is a plan view showing an embodiment of the present invention, Fig. 2(a)
, (b) and (C) are sectional views taken along the line A-A' in FIG. 1, respectively, showing the process of forming the light-shielding film of this example. 1... LED head, 2... LED array chip,
11... Light emitting part, 12... Aluminum electrode, 13...
Light-shielding film, 14...groove.
Claims (1)
記第１の工程のＬＥＤアレイチップの切断面を覆うよう
に前記第１の工程のＬＥＤアレイチップの上面に遮光膜
を形成した最終工程のＬＥＤアレイチップを有して成る
ことを特徴とするＬＥＤヘッド。A final process LED array chip in which a light shielding film is formed on the upper surface of the first process LED array chip so as to cover the cut surface of the first process LED array chip after dicing the first process LED array chip. An LED head comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2216273A JPH0498881A (en) | 1990-08-16 | 1990-08-16 | Led head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2216273A JPH0498881A (en) | 1990-08-16 | 1990-08-16 | Led head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0498881A true JPH0498881A (en) | 1992-03-31 |
Family
ID=16685960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2216273A Pending JPH0498881A (en) | 1990-08-16 | 1990-08-16 | Led head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0498881A (en) |
-
1990
- 1990-08-16 JP JP2216273A patent/JPH0498881A/en active Pending
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