JPH0498821A - Rotational coater for manufacture of semiconductor - Google Patents
Rotational coater for manufacture of semiconductorInfo
- Publication number
- JPH0498821A JPH0498821A JP21609890A JP21609890A JPH0498821A JP H0498821 A JPH0498821 A JP H0498821A JP 21609890 A JP21609890 A JP 21609890A JP 21609890 A JP21609890 A JP 21609890A JP H0498821 A JPH0498821 A JP H0498821A
- Authority
- JP
- Japan
- Prior art keywords
- resist
- joint
- constant temperature
- temperature water
- tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 5
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 239000011248 coating agent Substances 0.000 claims abstract description 8
- 238000000576 coating method Methods 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 34
- 238000004528 spin coating Methods 0.000 claims description 3
- 229920002120 photoresistant polymer Polymers 0.000 claims description 2
- 238000004904 shortening Methods 0.000 claims description 2
- 239000004809 Teflon Substances 0.000 abstract description 10
- 229920006362 Teflon® Polymers 0.000 abstract description 10
- 230000000149 penetrating effect Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体製造用回転塗布装置に関し、特にフォト
レジスト（以下レジストと称す）塗布装置におけるレジ
スト温調付レジスト塗布ノズル部の構造に関するもので
ある。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a spin coating device for semiconductor manufacturing, and more particularly to the structure of a resist coating nozzle portion with resist temperature control in a photoresist (hereinafter referred to as resist) coating device. be.
従来のレジスト温調付レジスト塗布ノズル部は、第３図
の断面図に示すように、恒温水をリターンさせる為の恒
温水リターンボックス１と、レジストを供給するチュー
ブ５と、レジストチューブ５を二重管で覆い、恒温水を
供給する恒温水ＩＮチューブ７と、恒温水ＩＮチューブ
７と接続するための恒温水ＩＮ継手６と、リターンする
恒温水を流す為の恒温水リターン継手９及び恒温水リタ
ーンチューブ８と、レジストチューブ５を恒温水リター
ンボックス１に固定するための継手本体１２．継手Ａ１
３．継手Ｂ１４．継手Ｃ１５、そしてレジストチューブ
５の変形を防ぐためのインサートノズル１６とで構成さ
れている。As shown in the cross-sectional view of FIG. 3, a conventional resist coating nozzle unit with resist temperature control includes a constant temperature water return box 1 for returning constant temperature water, a resist supply tube 5, and a resist tube 5. A constant temperature water IN tube 7 that is covered with a heavy pipe and supplies constant temperature water, a constant temperature water IN joint 6 for connecting to the constant temperature water IN tube 7, a constant temperature water return joint 9 for flowing returning constant temperature water, and a constant temperature water A joint body 12 for fixing the return tube 8 and the resist tube 5 to the constant temperature water return box 1. Fitting A1
3. Joint B14. It consists of a joint C15 and an insert nozzle 16 for preventing deformation of the resist tube 5.
レジストチューブ５を覆って流れてきた恒温水は、恒温
水リターンボックス１において分岐され、恒温水リター
ンチューブ８から流れ出る。また、恒温水は継手本体１
２、継手Ａｌ ３．継手Ｂ１４、継手Ｃ１５によってシ
ールされノズル周囲から漏れない様になっている。The constant temperature water that has flowed over the resist tube 5 is branched at the constant temperature water return box 1 and flows out from the constant temperature water return tube 8. Also, for constant temperature water, the fitting body 1
2. Joint Al 3. It is sealed by the joint B14 and the joint C15 to prevent leakage from around the nozzle.
この従来のレジスト温調付レジスト塗布ノズル部では、
ノズル部の固定部分からの恒温水の漏れを防ぐ為に継手
を使用している。この為継手をねじ込む為に必要な恒温
水リターンボックスの肉厚及び継手の長さ、つまり第３
図に示す長さＣの部分において、レジストチューブ５は
恒温水によって温調されていないこととなる。これがレ
ジストの粘度を変化させ、ウェーハ面内のレジストの膜
厚のばらつきを大きくしてしまうという問題があった。In this conventional resist coating nozzle with resist temperature control,
A joint is used to prevent constant temperature water from leaking from the fixed part of the nozzle. For this reason, the wall thickness of the constant temperature water return box and the length of the joint required for screwing the joint, that is, the third
In the portion of length C shown in the figure, the temperature of the resist tube 5 is not controlled by the constant temperature water. There was a problem in that this changed the viscosity of the resist and increased the variation in the thickness of the resist within the wafer surface.
本発明の半導体装置用回転塗布装置は、恒温水リターン
ボックスの底面を貫通する前記ノズル部を固定するため
のシール継手の長さを短くすることによって、恒温水リ
ターンボックスの底面から突出するノズル部の長さを短
縮したノズル構造を備えている。The spin coating device for semiconductor devices of the present invention has a nozzle portion protruding from the bottom surface of the constant temperature water return box by shortening the length of the seal joint for fixing the nozzle portion penetrating the bottom surface of the constant temperature water return box. It has a nozzle structure with a shortened length.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の第１の実施例に係るレジスト温調付レ
ジスト塗布ノズル部を示す断面図である。FIG. 1 is a sectional view showing a resist coating nozzle section with resist temperature control according to a first embodiment of the present invention.
恒温水リターンボックス１は、底面にテーバ穴部分とめ
ねじ部分が設けられている。テフロン継手３は円錐状の
形状で、円錐の下から上の方向にレジストチューブ５が
通る為の穴が開いており、テフロン継手押し込み継手２
をねじ込むことによって恒温水リターンボックス１のテ
ーパ穴部分に押し当てられている。テフロン継手３はテ
フロン継手押し込み継手２に押される事によってレジス
トチューブ５にくい込み、恒温水のノズルからの漏れを
防ぐ事が出来る。インサート４は、テフロン継手３がレ
ジストチューブ５にくい込む事によって、レジストチュ
ーブ５が変形しない様にしている。またレジストチュー
ブ５をそのままノズルとして使用している。The constant temperature water return box 1 is provided with a tapered hole part and a female thread part on the bottom surface. The Teflon joint 3 has a conical shape with a hole for the resist tube 5 to pass from the bottom to the top of the cone, and the Teflon joint push-in joint 2
It is pressed against the tapered hole part of the constant temperature water return box 1 by screwing it in. When the Teflon joint 3 is pushed by the Teflon joint push-in joint 2, it is embedded in the resist tube 5 and can prevent leakage of constant temperature water from the nozzle. The insert 4 prevents the resist tube 5 from being deformed by causing the Teflon joint 3 to sink into the resist tube 5. Further, the resist tube 5 is used as it is as a nozzle.
これにより、従来、ノズル先端からの未温調部分である
寸法Ｃを、恒温水リターンボックス１にテーパー穴部分
及びめねし部分をつけるための肉厚、つまりａの長さに
まで短かくする事が出来る。よって、ノズル先端まで温
調する事が出来る。As a result, the conventional dimension C, which is the untemperature-controlled part from the nozzle tip, can be shortened to the wall thickness for attaching the tapered hole part and the female part to the constant temperature water return box 1, that is, the length a. I can do things. Therefore, it is possible to control the temperature up to the tip of the nozzle.
次に本発明の第２の実施例について説明する。Next, a second embodiment of the present invention will be described.
第２図は本発明の第２の実施例を示す断面図である。恒
温水リターンボックス１の底面の穴に、０リング１１の
溝及びめねじ部分を備えている。Ｏリング押し込み継手
１０をめねじ部分にねじ込むことにより、Ｏリング１１
が押されて変形する。FIG. 2 is a sectional view showing a second embodiment of the invention. A hole in the bottom of the constant temperature water return box 1 is provided with a groove and a female thread for an O-ring 11. By screwing the O-ring push fitting 10 into the female thread, the O-ring 11
is pushed and deformed.
よってＯリング１１はＯリング渭とレジストチューブ５
に密着し、恒温水の漏れを防いでいる。第１の実施例に
比べ、第２の実施例は０リング１１によって恒温水の漏
れを防ぐようにしたため、ノズル先端からの未温調部分
の寸法をｂの様に更に短くする事が出来、よって更にノ
ズル先端まで温調する事が出来る。Therefore, the O-ring 11 is connected to the O-ring side and the resist tube 5.
to prevent constant temperature water from leaking. Compared to the first embodiment, in the second embodiment, the O-ring 11 prevents constant temperature water from leaking, so the dimension of the untemperature-controlled part from the nozzle tip can be further shortened as shown in b. Therefore, it is possible to further control the temperature up to the tip of the nozzle.
以上説明したように本発明は、レジスト塗布ノズル先端
までの温調が可能となったのでレジストの粘度を一定に
保つことができ、レジスト膜厚のウェーハ面内ばらつき
を小さくする事が出来る。As explained above, in the present invention, it is possible to control the temperature up to the tip of the resist coating nozzle, so the viscosity of the resist can be kept constant, and the variation in resist film thickness within the wafer surface can be reduced.
第１図は本発明の第１の実施例におけるノズル部の断面
図、第２図は本発明の第２の実施例におけるノズル部の
断面図、第３図は従来のノズル部を示す断面図である。
１・・・恒温水リターンボックス、２・・・テフロン継
手押し込み継手、３・・・テフロン継手、４・・・イン
サート、５・・・レジストチューブ、６・・・恒温水Ｉ
Ｎ継手、７・・・恒温水ＩＮチューブ、８・・・恒温水
リターンチューブ、９・・・恒温水リターン継手、１０
・・・Ｏリング押し込み継手、１１・・・０リング、１
２・・・継手本体、１３・・・継手Ａ、１４・・・継手
Ｂ、１５・・・継手Ｃ１１６・・・インサートノズル。FIG. 1 is a sectional view of a nozzle part in a first embodiment of the present invention, FIG. 2 is a sectional view of a nozzle part in a second embodiment of the invention, and FIG. 3 is a sectional view of a conventional nozzle part. It is. 1... Constant temperature water return box, 2... Teflon joint push-in joint, 3... Teflon fitting, 4... Insert, 5... Resist tube, 6... Constant temperature water I
N fitting, 7... Constant temperature water IN tube, 8... Constant temperature water return tube, 9... Constant temperature water return joint, 10
...O-ring push-in joint, 11...0-ring, 1
2...Joint body, 13...Joint A, 14...Joint B, 15...Joint C116...Insert nozzle.
Claims (1)
温水を用いて温調する機構を備えた半導体装置用回転塗
布装置において、恒温水リターンボックスの底面を貫通
する前記ノズル部を固定するためのシール継手の長さを
短くすることによつて、恒温水リターンボックスの底面
から突出するノズル部の長さを短縮したことを特徴とす
る半導体製造用回転塗布装置。In a rotary coating device for semiconductor devices equipped with a mechanism for controlling the temperature of a resist application nozzle section that supplies photoresist using constant temperature water, a seal joint for fixing the nozzle section that penetrates the bottom surface of a constant temperature water return box is provided. A spin coating device for semiconductor manufacturing, characterized in that the length of a nozzle portion protruding from the bottom of a constant temperature water return box is shortened by shortening the length.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21609890A JPH0498821A (en) | 1990-08-16 | 1990-08-16 | Rotational coater for manufacture of semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21609890A JPH0498821A (en) | 1990-08-16 | 1990-08-16 | Rotational coater for manufacture of semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0498821A true JPH0498821A (en) | 1992-03-31 |
Family
ID=16683215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21609890A Pending JPH0498821A (en) | 1990-08-16 | 1990-08-16 | Rotational coater for manufacture of semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0498821A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6474425A (en) * | 1987-09-16 | 1989-03-20 | Nikon Corp | Photodetecting element for light measurement of camera |
| JPH0290934A (en) * | 1989-07-07 | 1990-03-30 | Hitachi Ltd | Liquid treating apparatus |
| JPH02132444A (en) * | 1988-05-27 | 1990-05-21 | Tokyo Electron Ltd | Coating device for coating semiconductor wafer with liquid |
-
1990
- 1990-08-16 JP JP21609890A patent/JPH0498821A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6474425A (en) * | 1987-09-16 | 1989-03-20 | Nikon Corp | Photodetecting element for light measurement of camera |
| JPH02132444A (en) * | 1988-05-27 | 1990-05-21 | Tokyo Electron Ltd | Coating device for coating semiconductor wafer with liquid |
| JPH0290934A (en) * | 1989-07-07 | 1990-03-30 | Hitachi Ltd | Liquid treating apparatus |
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