JPH0497856U - - Google Patents

Info

Publication number
JPH0497856U
JPH0497856U JP33891U JP33891U JPH0497856U JP H0497856 U JPH0497856 U JP H0497856U JP 33891 U JP33891 U JP 33891U JP 33891 U JP33891 U JP 33891U JP H0497856 U JPH0497856 U JP H0497856U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP33891U
Other languages
Japanese (ja)
Other versions
JP2538705Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP33891U priority Critical patent/JP2538705Y2/ja
Publication of JPH0497856U publication Critical patent/JPH0497856U/ja
Application granted granted Critical
Publication of JP2538705Y2 publication Critical patent/JP2538705Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
JP33891U 1991-01-10 1991-01-10 めっき処理装置 Expired - Lifetime JP2538705Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33891U JP2538705Y2 (ja) 1991-01-10 1991-01-10 めっき処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33891U JP2538705Y2 (ja) 1991-01-10 1991-01-10 めっき処理装置

Publications (2)

Publication Number Publication Date
JPH0497856U true JPH0497856U (en, 2012) 1992-08-25
JP2538705Y2 JP2538705Y2 (ja) 1997-06-18

Family

ID=31727012

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33891U Expired - Lifetime JP2538705Y2 (ja) 1991-01-10 1991-01-10 めっき処理装置

Country Status (1)

Country Link
JP (1) JP2538705Y2 (en, 2012)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001316887A (ja) * 2000-05-08 2001-11-16 Tokyo Electron Ltd メッキ処理装置
JP2002093834A (ja) * 2000-09-18 2002-03-29 Sharp Corp 噴流式バンプ形成装置
JP2014051697A (ja) * 2012-09-05 2014-03-20 Mitomo Semicon Engineering Kk カップ式めっき装置及びこれを用いるめっき方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2320278C (en) * 1998-02-12 2006-01-03 Acm Research, Inc. Plating apparatus and method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001316887A (ja) * 2000-05-08 2001-11-16 Tokyo Electron Ltd メッキ処理装置
JP2002093834A (ja) * 2000-09-18 2002-03-29 Sharp Corp 噴流式バンプ形成装置
JP2014051697A (ja) * 2012-09-05 2014-03-20 Mitomo Semicon Engineering Kk カップ式めっき装置及びこれを用いるめっき方法

Also Published As

Publication number Publication date
JP2538705Y2 (ja) 1997-06-18

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Legal Events

Date Code Title Description
A01 Written decision to grant a patent or to grant a registration (utility model)

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Effective date: 19970128

R250 Receipt of annual fees

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R250 Receipt of annual fees

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EXPY Cancellation because of completion of term