JPH049752B2 - - Google Patents
Info
- Publication number
- JPH049752B2 JPH049752B2 JP5064384A JP5064384A JPH049752B2 JP H049752 B2 JPH049752 B2 JP H049752B2 JP 5064384 A JP5064384 A JP 5064384A JP 5064384 A JP5064384 A JP 5064384A JP H049752 B2 JPH049752 B2 JP H049752B2
- Authority
- JP
- Japan
- Prior art keywords
- active metal
- active
- layer
- film
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 27
- 239000002184 metal Substances 0.000 claims description 27
- 238000005219 brazing Methods 0.000 claims description 14
- 239000000919 ceramic Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 239000006104 solid solution Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 15
- 229910000679 solder Inorganic materials 0.000 description 14
- 239000010408 film Substances 0.000 description 13
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 229910004353 Ti-Cu Inorganic materials 0.000 description 4
- 230000005496 eutectics Effects 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 229910017944 Ag—Cu Inorganic materials 0.000 description 3
- 229910020220 Pb—Sn Inorganic materials 0.000 description 3
- 230000003064 anti-oxidating effect Effects 0.000 description 3
- 239000003963 antioxidant agent Substances 0.000 description 3
- 230000003078 antioxidant effect Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910015363 Au—Sn Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910017309 Mo—Mn Inorganic materials 0.000 description 1
- 229910016287 MxOy Inorganic materials 0.000 description 1
- 229910003126 Zr–Ni Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000002779 inactivation Effects 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5064384A JPS60195068A (ja) | 1984-03-16 | 1984-03-16 | セラミックス接合方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5064384A JPS60195068A (ja) | 1984-03-16 | 1984-03-16 | セラミックス接合方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60195068A JPS60195068A (ja) | 1985-10-03 |
| JPH049752B2 true JPH049752B2 (enrdf_load_html_response) | 1992-02-21 |
Family
ID=12864627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5064384A Granted JPS60195068A (ja) | 1984-03-16 | 1984-03-16 | セラミックス接合方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60195068A (enrdf_load_html_response) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09181423A (ja) * | 1990-04-16 | 1997-07-11 | Denki Kagaku Kogyo Kk | セラミックス回路基板 |
| EP0480038B1 (en) * | 1990-04-16 | 1997-07-09 | Denki Kagaku Kogyo Kabushiki Kaisha | Ceramic circuit board |
| JP2594475B2 (ja) * | 1990-04-16 | 1997-03-26 | 電気化学工業株式会社 | セラミックス回路基板 |
-
1984
- 1984-03-16 JP JP5064384A patent/JPS60195068A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60195068A (ja) | 1985-10-03 |
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