JPH0497398U - - Google Patents
Info
- Publication number
- JPH0497398U JPH0497398U JP511291U JP511291U JPH0497398U JP H0497398 U JPH0497398 U JP H0497398U JP 511291 U JP511291 U JP 511291U JP 511291 U JP511291 U JP 511291U JP H0497398 U JPH0497398 U JP H0497398U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP511291U JPH0497398U (enExample) | 1991-01-18 | 1991-01-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP511291U JPH0497398U (enExample) | 1991-01-18 | 1991-01-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0497398U true JPH0497398U (enExample) | 1992-08-24 |
Family
ID=31735412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP511291U Pending JPH0497398U (enExample) | 1991-01-18 | 1991-01-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0497398U (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004179561A (ja) * | 2002-11-28 | 2004-06-24 | Kyocera Corp | 電子装置 |
| JP2008288523A (ja) * | 2007-05-21 | 2008-11-27 | Fujitsu Media Device Kk | 電子部品，及びその製造方法 |
| JP2011187739A (ja) * | 2010-03-09 | 2011-09-22 | Mitsubishi Electric Corp | 高周波パッケージ |
| WO2012176646A1 (ja) * | 2011-06-23 | 2012-12-27 | Ｎｅｃカシオモバイルコミュニケーションズ株式会社 | シールドフレーム、シールドフレームの実装構造、及び電子携帯機器 |
| JP2022080826A (ja) * | 2020-11-18 | 2022-05-30 | 株式会社村田製作所 | 配線基板に実装する部品 |
-
1991
- 1991-01-18 JP JP511291U patent/JPH0497398U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004179561A (ja) * | 2002-11-28 | 2004-06-24 | Kyocera Corp | 電子装置 |
| JP2008288523A (ja) * | 2007-05-21 | 2008-11-27 | Fujitsu Media Device Kk | 電子部品，及びその製造方法 |
| US8199527B2 (en) | 2007-05-21 | 2012-06-12 | Taiyo Yuden Co., Ltd. | Electronic component and manufacturing method therefor |
| JP2011187739A (ja) * | 2010-03-09 | 2011-09-22 | Mitsubishi Electric Corp | 高周波パッケージ |
| WO2012176646A1 (ja) * | 2011-06-23 | 2012-12-27 | Ｎｅｃカシオモバイルコミュニケーションズ株式会社 | シールドフレーム、シールドフレームの実装構造、及び電子携帯機器 |
| JP2022080826A (ja) * | 2020-11-18 | 2022-05-30 | 株式会社村田製作所 | 配線基板に実装する部品 |