JPH0497360U - - Google Patents
Info
- Publication number
- JPH0497360U JPH0497360U JP130691U JP130691U JPH0497360U JP H0497360 U JPH0497360 U JP H0497360U JP 130691 U JP130691 U JP 130691U JP 130691 U JP130691 U JP 130691U JP H0497360 U JPH0497360 U JP H0497360U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991001306U JP2576383Y2 (ja) | 1991-01-21 | 1991-01-21 | 光半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991001306U JP2576383Y2 (ja) | 1991-01-21 | 1991-01-21 | 光半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0497360U true JPH0497360U (pm) | 1992-08-24 |
| JP2576383Y2 JP2576383Y2 (ja) | 1998-07-09 |
Family
ID=31728572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1991001306U Expired - Lifetime JP2576383Y2 (ja) | 1991-01-21 | 1991-01-21 | 光半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2576383Y2 (pm) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007035758A (ja) * | 2005-07-25 | 2007-02-08 | Rohm Co Ltd | 受光ジュール |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100511633B1 (ko) * | 2002-10-28 | 2005-09-02 | 전홍수 | 전신주용 까치퇴치장치 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5980979A (ja) * | 1982-10-29 | 1984-05-10 | Matsushita Electric Ind Co Ltd | 光電変換装置 |
| JPH02133038U (pm) * | 1989-04-12 | 1990-11-05 |
-
1991
- 1991-01-21 JP JP1991001306U patent/JP2576383Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5980979A (ja) * | 1982-10-29 | 1984-05-10 | Matsushita Electric Ind Co Ltd | 光電変換装置 |
| JPH02133038U (pm) * | 1989-04-12 | 1990-11-05 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007035758A (ja) * | 2005-07-25 | 2007-02-08 | Rohm Co Ltd | 受光ジュール |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2576383Y2 (ja) | 1998-07-09 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |