JPH0496899U - - Google Patents

Info

Publication number
JPH0496899U
JPH0496899U JP802391U JP802391U JPH0496899U JP H0496899 U JPH0496899 U JP H0496899U JP 802391 U JP802391 U JP 802391U JP 802391 U JP802391 U JP 802391U JP H0496899 U JPH0496899 U JP H0496899U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP802391U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP802391U priority Critical patent/JPH0496899U/ja
Publication of JPH0496899U publication Critical patent/JPH0496899U/ja
Pending legal-status Critical Current

Links

JP802391U 1991-01-30 1991-01-30 Pending JPH0496899U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP802391U JPH0496899U (ja) 1991-01-30 1991-01-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP802391U JPH0496899U (ja) 1991-01-30 1991-01-30

Publications (1)

Publication Number Publication Date
JPH0496899U true JPH0496899U (ja) 1992-08-21

Family

ID=31740190

Family Applications (1)

Application Number Title Priority Date Filing Date
JP802391U Pending JPH0496899U (ja) 1991-01-30 1991-01-30

Country Status (1)

Country Link
JP (1) JPH0496899U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08316691A (ja) * 1995-05-23 1996-11-29 Nec Corp 半導体装置のテーピング装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5222077A (en) * 1975-08-13 1977-02-19 Hatsuo Kawai Mold for preparing three-dimensionally patterned laminete and its prep aration
JPS59202700A (ja) * 1983-05-02 1984-11-16 ティーディーケイ株式会社 チツプ状電子部品装着機
JPH01289239A (ja) * 1988-05-17 1989-11-21 Nippon Chemicon Corp チップ形コンデンサの連続体
JPH02152674A (ja) * 1988-11-30 1990-06-12 Matsushita Electric Ind Co Ltd 電子部品集合体
JPH03212367A (ja) * 1990-01-11 1991-09-17 Matsushita Electric Ind Co Ltd 部品収納体

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5222077A (en) * 1975-08-13 1977-02-19 Hatsuo Kawai Mold for preparing three-dimensionally patterned laminete and its prep aration
JPS59202700A (ja) * 1983-05-02 1984-11-16 ティーディーケイ株式会社 チツプ状電子部品装着機
JPH01289239A (ja) * 1988-05-17 1989-11-21 Nippon Chemicon Corp チップ形コンデンサの連続体
JPH02152674A (ja) * 1988-11-30 1990-06-12 Matsushita Electric Ind Co Ltd 電子部品集合体
JPH03212367A (ja) * 1990-01-11 1991-09-17 Matsushita Electric Ind Co Ltd 部品収納体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08316691A (ja) * 1995-05-23 1996-11-29 Nec Corp 半導体装置のテーピング装置

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