JPH0494589A - Adhesive coating apparatus for securing electronic component - Google Patents

Abstract

PURPOSE:To prevent cobwebbing by providing an adhesive dispenser for spraying in contact with a discharge hole on a printed board, and a suction nozzle unit for sucking near the hole at the end. CONSTITUTION:A suction nozzle unit 11 movable in a direction of an arrow and an adhesive dispenser 1 are mounted at a head 6. An adhesive discharge hole at the end of the dispenser is brought into contact with a printed board 2, coated with adhesive, and generated dribble is sucked by approaching the unit 1. A heater 15 is installed between a suction nozzle 14 and an adhesive storage syringe 12 to raise its temperature, and the viscosity of the sucked adhesive is reduced to be easily sucked. A filter 13 is provided in the syringe 12, the adhesive is accumulated, and invasion to a suction pump side is completely prevented. Thus, soldering malfunction can be reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an adhesive coating device for fixing electronic components, which applies adhesive for fixing electronic components onto a printed circuit board.

2. Description of the Related Art A conventional adhesive applicator for fixing electronic components will be described with reference to the drawings.

FIG. 3 is a perspective view illustrating the configuration of a conventional adhesive applicator for fixing electronic components. In the figure, 1 is an adhesive dispenser, 2 is a printed circuit board, 3 is a support stand, 4 is a Y-axis robot, 5 is an X-axis robot, and 6 is a head section. The adhesive dispenser 1 is attached to the head portion 6 via a mechanism not shown so as to be movable in the direction of the arrow, that is, in the vertical direction.

The operation will be described below with reference to the drawings. First, the head part 6 is positioned at a predetermined position by the X-axis robot 5 and the Y-axis robot 4, and then a constant pressure is applied to the syringe inside the dispenser 1 for a predetermined time to dispense adhesive. The adhesive is applied to a predetermined position on the printed circuit board by lowering it and bringing the adhesive discharge hole at the tip into contact with the printed circuit board. Fourth
Figures (a) to (j) show the adhesive applied twice.

Problems to be Solved by the Invention However, with conventional adhesive applicators for fixing electronic components,
When the dispenser rises after application, the viscosity of the adhesive causes adhesive dripping 7 at the adhesive discharge hole at the tip, as shown in Figure 4(d), and during the next application, the thread It causes scratches.

This threading will be explained with reference to FIG. In FIG. 5, 8 is a land for soldering a printed circuit board, 9 is a position of an electronic component, and 10 is an adhesive.

When the adhesive is applied onto the substrate, it usually takes the shape shown in Figure 5 (a), but if stringiness occurs, it will take the shape shown in Figure 5 (b).
). When the adhesive is applied to the land used for soldering electronic components due to stringing, there is a problem in that the soldering of the electronic components ends up being defective.

In view of the above-mentioned conventional problems, an object of the present invention is to provide an adhesive applicator for fixing electronic components that reduces the occurrence of defects when soldering electronic components by preventing the occurrence of adhesive stringing. shall be.

Means for Solving the Problems In order to achieve the above object, the present invention includes a suction nozzle device for sucking up adhesive strings. If a heater and a filter device are added to this suction nozzle device, its functionality will be further improved.

Function: The suction nozzle device described above sucks the adhesive dripping from the discharge port of the adhesive dispenser after application is completed to prevent stringing. Further, a heater provided as necessary increases the temperature of the suction port of the suction nozzle device, thereby lowering the viscosity of the adhesive and making it easier to inhale. Also, a filter device, which is also provided as necessary, accumulates the inhaled adhesive and prevents foreign matter from passing into the suction pump.

Embodiment Hereinafter, an embodiment of the present invention will be described with reference to the drawings. The same members as those in the conventional example described above are given the same numbers, and explanations thereof will be omitted. Fig. 1 is a perspective view showing the configuration of the device of the present invention;
Figures (a) to (d) are diagrams explaining the operation of the suction nozzle device. In FIG. 1, reference numeral 11 denotes a suction nozzle device, which is attached to the head section 6 via a mechanism not shown here, so as to be movable in the direction of the arrow shown in FIG. 1, next to the adhesive dispenser 1. . Since the adhesive dispenser 1 is also attached to the head part 6, movement of the head part 6 does not change the relative position of the two. In FIG. 2, 12 is an adhesive storage syringe, 13 is a filter device, 14 is a suction nozzle, 15 is a heater, and 16 is a pipe, the end of which is connected to a suction pump (not shown), and the suction nozzle 14 is connected to an external Aspirate air.

Next, the operation of this device will be explained. FIG. 2(a) shows the initial state. Next, the adhesive dispenser 1 descends, contacts the adhesive discharge hole at the tip with the printed circuit board 2 as shown in the figure (b), applies the adhesive, and returns to the original position as shown in the figure (C). Return to position. At this time, the adhesive drips as shown by the arrow in the figure, so the suction nozzle device 11 approaches and sucks in air as shown in FIG. 3(d), sucking in the adhesive dripping. Thereafter, the suction nozzle device 11 returns to its original position and returns to the initial state shown in FIG. In this way stringing of the adhesive is prevented.

A heater 15 is installed between the suction nozzle 14 and the adhesive storage syringe 12, and by increasing the temperature of the suction nozzle 14, the viscosity of the suctioned adhesive is lowered, making it easier to suction. The suctioned adhesive is accumulated in a filter device 13 in the adhesive storage syringe 12, completely preventing it from entering the suction pump side. The filter device 13 may be replaced when a large amount of adhesive accumulates and the suction capacity is reduced.

Effects of the Invention As is clear from the above embodiments, according to the adhesive applicator for fixing electronic components of the present invention, after the application is completed, the adhesive dripping into the adhesive discharge hole of the adhesive dispenser is sucked in by the suction nozzle. This prevents stringiness and reduces soldering defects by applying adhesive onto the lands.

[Brief explanation of drawings]

FIG. 1 is a perspective view of an adhesive applicator for fixing electronic components according to the present invention, FIGS. 2(a) to 2(d) are diagrams explaining the operation of the main parts of the device, and FIG. 3 is a diagram of a conventional device. Perspective view, Figure 4 (a
) to (j) are diagrams illustrating the occurrence of adhesive stringing, No. 5
Figures (a) and (b) are diagrams illustrating the relationship between adhesive stringiness and soldering defects. 1...Adhesive dispenser, 2...
Printed circuit board, 6...Head section, 11...
... Suction nozzle device, 13 ... Filter device, 15 ... Heater. Name of agent: Patent attorney Shigetaka Awano and 1 other person 11rl!
J! -・Revenge 1 Kidney 1 Dishemp 2- Printed circuit board 6- 7) 'Misaki tt-t' and entry Nosuru firing diagram

Claims (3)

[Claims] (1) Adhesive dispenser that has an adhesive discharge hole at its tip, is attached to a head section that positions it relative to the printed circuit board, and applies adhesive by bringing the adhesive discharge hole into contact with the printed circuit board. and a suction nozzle device that is connected to a suction pump at its end and that draws air at a position where the adhesive discharge hole of the adhesive dispenser is away from the printed circuit board and whose tip portion approaches the discharge port. Fixing adhesive applicator. (2) The adhesive applicator for fixing electronic components according to claim 1, wherein the suction nozzle device is equipped with a heater. (3) The adhesive applicator for fixing electronic components according to claim 1, wherein the suction nozzle device is provided with a filter device in the middle of the suction path up to the suction pump at the end.