JPH0490609A - Microstrip slot array antenna - Google Patents

Abstract

PURPOSE:To stabilize antenna characteristics by integrally including an antenna and a power feeding part in a substrate to which plural dielectric layers are laminated. CONSTITUTION:Integrated substrate is constructed by successively laminating first to fourth dielectric layers 10, 12, 14, 16. On the surface of this first dielectric layer 10, two approximately parallel power feeding strip line 18 is formed in the longitudinal direction of the dielectric layer. The slot array antenna is formed by arranging plural half-wave slots 22 in two lines along both sides of a power feeding strip line 18 so as to be almost vertical. Thus, the stable antenna characteristics can be obtained because the antenna and the power feeding part are included in the substrate integrated while plural dielectric layers are laminated.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a microstrip slot array antenna having a structure in which an antenna and a power feeding section are integrated into a substrate in which a plurality of dielectric layers are laminated. be.

(Prior Art! #) An example of a microstrip slot array antenna is described in Japanese Patent Publication No. 13163/1983. This technology forms a power supply stripline on one side of a single dielectric substrate, and arranges multiple half-wavelength slots along the power supply stripline on a conductive film placed on the other side. Power is sequentially supplied to these plurality of slots from the power supply strip line in a dependent manner.

In addition, when feeding power to a slot from the middle part of an array where the slots are arranged, the tip of one power supply strip line led to the middle part is branched into two, and two power supply strips are connected to each other. 2 in the middle by the line branch
A technique for powering multiple slots in each block is shown.

(Problem to be Solved by the Invention) By the way, in the technique disclosed in Japanese Patent Publication No. 57-13163, in which the power supply strip line is branched into two at the middle part to supply power, the power supply strip line Since a bent portion is formed in the bending portion, unnecessary radiation is likely to occur from this bent portion, and the side lobe health is worsened accordingly.

Therefore, if the microwave signal is fed to the middle part of the linear feed strip line by a coaxial line perpendicular to the board, unnecessary radiation will be reduced because there is no bend in the feed strip line.

However, in a power feeding structure using a coaxial line perpendicular to the substrate, the structure of the power feeding section becomes complicated, and the antenna characteristics tend to become unstable. Furthermore, the power supply section requires a large space and has a complicated structure, which results in an increase in cost.

The present invention was made in view of the above-mentioned circumstances of the conventional microstrip slot array antenna, and uses a substrate on which a plurality of dielectric layers are laminated to provide stable antenna characteristics and a microstrip slot array antenna that can be manufactured at low cost. The present invention aims to provide a strip slot array antenna.

(Means for Solving the Problems) In order to achieve this object, the microstrip slot array antenna of the present invention has first, second and third
dielectric layers are laminated in order, a power supply strip line is formed on the surface of the first dielectric layer, and a power supply strip line is formed on a conductive film disposed between the first and second dielectric layers. A plurality of slots are arranged along the same line, and a feed strip line for a power divider serving as a feed point at one end is arranged between the second and third dielectric layers so as to intersect the feed strip line; The power feed strip line for power divider and the power feed strip line are connected by a through hole penetrating the first and second dielectric layers, and the power feed strip line for power divider is connected to the back surface of the third dielectric layer. It is constructed by arranging opposing substrate conductors.

Further, a fourth dielectric layer is further laminated on the laminate of the first, second, and third dielectric layers, and a substrate conductor is provided in a small area on the back surface of the third dielectric layer. , a reflective conductor may be arranged on the entire back surface of the fourth dielectric layer.

The substrate conductor may also be arranged on the entire back surface of the third dielectric layer.

Furthermore, a reflective plate made of a conductive metal may be arranged parallel to and apart from the back surface of the third dielectric layer.

Further, first, second, and third dielectric layers are sequentially laminated, and a power supply strip line is formed between the first and second dielectric layers, and is disposed on the surface of the first dielectric layer. A plurality of slots are arranged along the power supply strip line in the conductive film, and a power supply strip line for a power dehyder, which serves as a power supply point, is connected to the power feeder between the second and third dielectric layers. The feed strip line for the power divider is connected to the feed strip line by a through hole penetrating the second dielectric layer, and the feed strip line for the power divider is connected to the feed strip line by a through hole penetrating the second dielectric layer. It is also possible to arrange a substrate conductor facing the power feed strip line for the power divider on the back surface.

Further, the first, second and third dielectric layers are laminated in order, a power supply strip line is formed on the surface of the first dielectric layer, and a power strip line is formed between the first and second dielectric layers. A plurality of slots are arranged along the power supply strip line in the arranged conductive film, a reflective conductor is arranged on the entire surface between the second and third dielectric layers, and a reflective conductor is arranged on the entire surface between the second and third dielectric layers. A power feed strip line for a power divider serving as a feed point at one end of the layer is arranged so as to intersect with the power feed strip line, and this power divider feed strip line and the power feed strip line are connected to the first and second power feed strip lines. Furthermore, the first, second and third dielectric layers may be laminated in order, and the first and second dielectric layers may be connected by a through hole penetrating the third dielectric layer. A power supply strip line is formed between the layers, a plurality of slots are arranged along the power supply strip line in a conductive film disposed on the surface of the first dielectric layer, and a plurality of slots are arranged along the power supply strip line, and the second and third A reflective conductor is arranged on the entire surface between the dielectric layers, and a power feed strip line for a power divider with one end serving as a feed point is arranged on the back surface of the third dielectric layer so as to intersect with the power feed strip line. The power divider feeding stripline and the feeding stripline may be connected to each other by a through hole penetrating the second and third dielectric layers.

Further, a fourth dielectric layer is further laminated on the laminate of the first, second, and third dielectric layers, and a shielding conductor is disposed on the entire back surface of the fourth dielectric layer. It can also be configured.

(Function) The microwave signal is propagated from the power divider feed strip line placed between the dielectric layers so as to intersect with the feed strip line to the feed strip line via a through hole penetrating the dielectric layer. There are no bends in either the power supply stripline or the power supply stripline for the power divider, and no unnecessary radiation occurs. Moreover, since the antenna and feeder are built into a board made by laminating multiple dielectric layers into one, the structure is simpler and the antenna characteristics are more stable than when feeding using a coaxial line. .

Furthermore, if a fourth dielectric layer is laminated and a reflective conductor is arranged, the beams emitted from the slots arranged in the conductive film toward the reflective conductor are reflected and reflected from the first dielectric layer.
A radiation pattern is formed only in one direction on the surface of the dielectric layer.

If a substrate conductor is arranged over the entire back surface of the third dielectric layer, this substrate conductor also serves as a reflection plate, and a radiation pattern can be formed only in one direction with a simple configuration.

Furthermore, if a reflecting plate is provided parallel to the back surface of the third dielectric layer, a radiation pattern is similarly formed only in one direction.

Furthermore, if slots are arranged in a conductive film disposed on the surface of the first dielectric layer and a power supply strip line is formed between the first and second dielectric layers, the slots are covered with the dielectric layer. The radiation beam is not attenuated to the extent that it is not radiated, and power is radiated efficiently.

Further, a power supply strip line is formed on the surface of the first dielectric layer, slots are arranged in the conductive film disposed between the first and second dielectric layers, and a power supply strip line is formed on the surface of the first dielectric layer, and slots are arranged in the conductive film disposed between the first and second dielectric layers. If a reflective conductor is placed between the layers and a feed strip line for a power divider is formed on the back surface of the third dielectric layer,
Unnecessary radiation caused by the feeder strip line for the passivator is shielded by the reflective conductor, and since there is no metal conductor other than a through hole between the slot and the reflective conductor, the beam emitted from the slot toward the reflective conductor is reflected without disturbance. As a result, the radiation pattern on the surface side of the first dielectric layer is not affected by the power feeding section.

Furthermore, slots are arranged in the conductive film disposed on the surface of the first dielectric layer, a power supply strip line is formed between the first and second dielectric layers, and a power strip line is formed between the second and third dielectric layers. If a reflective conductor is placed between the layers and a feed strip line for a power divider is formed on the back surface of the third dielectric layer,
Unnecessary radiation from the feed strip line for the power divider is blocked by the reflective conductor, and since there is no metal conductor other than a through hole between the slot and the reflective conductor, the beam emitted from the slot toward the reflective conductor is reflected undisturbed. Furthermore, the microwave signal can be efficiently propagated to the feed strip line as the length of the through hole is shortened, and the emitted beam is not attenuated because the slot is not covered by the 3a body layer. As a result, the radiation pattern on the surface side of the first dielectric layer is not affected by the power feeding section, and power is radiated efficiently.

Furthermore, if a fourth dielectric layer is laminated and a shielding conductor is placed on the entire back surface of the fourth dielectric layer, unnecessary radiation from the power feed strip line for the power divider can be blocked by the shielding conductor. , the front-to-back ratio is improved.

(Example) Hereinafter, the structure of an example of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 is an exploded perspective view of a first embodiment of the microstrip slot array antenna of the present invention, and FIG. 2 is a sectional view taken along the line A--A in FIG. 1 in a stacked state.

In FIGS. 1 and 2, first, second, third and fourth dielectric layers 10, 12, 14.16 having the same rectangular planar shape and having a low dielectric constant are laminated in sequence. An integrated board is constructed. On the surface of this first dielectric layer 10,
Two substantially parallel feed striplines 18.18 are formed in the longitudinal direction of the dielectric layer. In addition, a plurality of half-wavelength conductors M20 disposed over almost the entire surface between the first and second dielectric layers 10.12 are arranged such that their long sides are substantially perpendicular to the power supply strip line 18.18. The main slot 22.22- is the feed strip line 18. ] 8 are arranged in two rows along both sides to form a slot array antenna. The mutual spacing of these slots 22.22-. is effectively one wavelength in the first dielectric layer IO, and the spacing of the two feed strip lines 18.18 is equal to the first (7) It is effectively an integral multiple of one wavelength within the dielectric layer 10.

Further, a slot 22.22 is provided between the second and third dielectric layers 12.14 at a position orthogonal to the center of the feed strip line 18.18 and from the center of the spacing in the arrangement direction of the slots 22.22-. A power feed strip line 24 for power divider is formed at a position offset by 1/4 wavelength in the arrangement direction of 22-. A small-area substrate conductor 26 is placed between the third and fourth dielectric layers 14.16, facing the power feed strip line 24 for power divider. Further, a reflective conductor 28 is arranged on the entire back surface of the fourth dielectric layer 16.

Further, the feed strip line 18.18 and the power feed strip line 24 for power divider are electrically connected at their intersection via a through hole 30.30 that penetrates the first and second dielectric layers 10.12. Ru.

It goes without saying that these through holes 30, 30 and the conductive film 2° are insulated.

And the power supply strip line 24 for power divider
The center conductor 34 of the coaxial line 32 is electrically connected to one end of the
An external conductor 36 is electrically connected to the conductive film 20, the substrate conductor 26, and the reflective conductor 28.

In such a configuration, the power feed strip line 24 for power divider has the second and third dielectric layers 12, 14 above and below.
A micro-triplate line is formed in which the conductive film 2o and the substrate conductor 26 are placed on both sides of the line, and the microwave signal fed through the coaxial line 32 is propagated to the power divider feed strip line 24, and further through the through hole 30.3.
0 to the feed stripline 18.18. Then, the microwave signal is propagated toward both ends by the feed strip line 18.18, and the slot 22.
22-... are successively supplied with power and excited. Here, the excited slots 22, 22- radiate beams to both sides of the conductive film 20, but the beams radiated to the reflective conductor 28 side are reflected by the reflective conductor 28 and the first
The beam is superimposed on the beam emitted toward the surface side of the dielectric layer lO. Note that the reflective conductor 28 and the slot 22.
The distance between the conductive film 20 and the conductive film 22 where the conductive films 22- and 22-.

The microstrip slot array antenna of the present invention configured as described above has an antenna and a power feeding section built into a substrate in which a plurality of dielectric layers are laminated and integrated, and also uses highly accurate printed wiring technology. Since the antenna can be manufactured using the same method, stable antenna characteristics can be obtained, it is suitable for mass production, and it can be manufactured at low cost. Furthermore, since it has an integrated, simple and robust structure, it has excellent vibration resistance.

In addition, in the first embodiment, the coaxial line 3 connected in the same direction to the power feed strip line 24 for power divider
Although the microwave signal is supplied by using a microstrip line or a waveguide, the power supply is not limited to this, and it is also possible to supply power by using a microstrip line or a waveguide as appropriate.

3 and 4 show a second embodiment of the microstrip slot array antenna of the present invention, FIG. 3 is an exploded perspective view of the second embodiment, and FIG. 4 is an exploded perspective view of the second embodiment. FIG. 3 is a sectional view taken along line B-B in a laminated state in FIG. 3; In FIGS. 3 and 4, the same members as those in FIGS. 1 and 2 are given the same reference numerals, and redundant explanations will be omitted.

In FIGS. 3 and 4, the differences between the second embodiment and the first embodiment are as follows. The first, second and third dielectric layers 10, 12, 14 are laminated, but the fourth dielectric layer 16 is not laminated. And the third
A substrate conductor 26 is arranged on the entire back surface of the dielectric layer 14 . Note that this board conductor 26 and the slot 22.22-
The distance from the conductive film 20 where the conductive film 20 is arranged is effectively an integral multiple of 1/4 wavelength within the dielectric layer.

In this configuration, the substrate conductor 26 and the conductive film 20 make the power divider feed strip line 24 a micro-triplate line, and the slot 22
．． It also acts as a reflector for the beam emitted from 22- toward the third dielectric layer 14 side. In this second embodiment, since the fourth dielectric layer 16 is not laminated, the integrated substrate is thinner, which is advantageous for miniaturization.

5 and 6 show a third embodiment of the microstrip slot array antenna of the present invention, FIG. 5 is an exploded perspective view of the third embodiment, and FIG. It is a sectional view taken along the line C-C in a laminated state in the figure. In FIGS. 5 and 6, the same members as those in FIGS. 1 to 4 are given the same reference numerals, and redundant explanations will be omitted.

In FIGS. 5 and 6, the differences between the third embodiment and the first embodiment are as follows. The first, second and third dielectric layers 10.12.14 are laminated, but the fourth dielectric layer 16 is not laminated. And the third
A small-area substrate conductor 26 is arranged on the back surface of the third dielectric layer 14 facing the power feed strip line 24 for the power divider, and the third dielectric layer 14 is made of a conductive metal and is spaced apart and parallel to the back surface of the third dielectric layer 14. A reflecting plate 38 is arranged. The distance between this reflective plate 38 and the conductive film 2o in which the slots 22, 22- are arranged is effectively an integral multiple of a quarter wavelength in the dielectric layer and in space. Furthermore, the reflector 3
Both ends of the dielectric layer 8 are bent by 90 degrees and brought into contact with both ends of the first, second, and third dielectric layers 10, 12, and 14 to be electrically connected to the conductive film 20.

In this configuration, the same effects as in the first embodiment can be obtained, and it is convenient to fix the integrated substrate using the reflector plate 38.

7 and 8 show a fourth embodiment of the microstrip slot array antenna of the present invention, FIG. 7 is an exploded perspective view of the fourth embodiment, and FIG. 8 is an exploded perspective view of the fourth embodiment. It is a sectional view taken along the line DD in a laminated state in the figure. In FIGS. 7 and 8, the same members as those in FIGS. 1 to 6 are given the same reference numerals, and redundant explanation will be omitted.

In FIGS. 7 and 8, the differences between the fourth embodiment and the first embodiment are as follows. Feed strip line 18 between the first and second dielectric layer +042
．． 18 are formed, and slots 22° 22.- are arranged in the conductive film 2o disposed on the surface of the first dielectric layer 10. Note that the feed strip line 18.18 and the power feed strip line 24 for power divider are electrically connected by through poles 30.30 penetrating the second dielectric layer 12.

In this configuration, the power feed strip line 24 for power divider is formed as a microstrip line by the substrate conductor 26 sandwiching at least the third dielectric layer 14 . Then, the microwave signal fed to one end of the power feed strip line 24 for the power divider is propagated, propagated to the feed strip line 18.18 via the through ball 30.
is excited.

In such a structure, the slots 22, 22...
Since it is not covered with a dielectric layer, the slot 22°22
The beam radiated from .

9 and 10 show a fifth embodiment of the microstrip slot array antenna of the present invention, FIG. 9 is an exploded perspective view of the fifth embodiment, and FIG. 10 is an exploded perspective view of the fifth embodiment. It is a sectional view taken along the line E-E in a laminated state in the figure. In FIGS. 9 and 10, the same members as those in FIGS. 1 to 8 are given the same reference numerals and redundant explanations will be omitted.

In FIGS. 9 and 10, the differences between the fifth embodiment and the first embodiment are as follows. A reflective conductor 28 is provided on the entire surface between the second and third dielectric layers 12.14.
is placed. and third and fourth dielectric layers 14.1
Feed strip line 24 for power divider between 6
are arranged, and the power divider feed strip line 24 and the feed strip line 18.18 are provided with through holes 30.18 passing through the first, second and third dielectric layers to, 12.14. :t.

electrically connected. Further, a shielding conductor 40 is arranged on the entire back surface of the fourth dielectric layer 16. Note that the through holes 30 and 30 are connected to the conductive film 20 and the reflective conductor 28.
Of course, it is insulated from the

In this configuration, the power feed strip line 24 for power divider is formed as a microtriplate line in which the reflective conductor 28 and the shielding conductor 40 are arranged with the third and fourth dielectric layers 14, 16 in between, and is coaxial. The microwave signal fed by the line 32 is propagated by the power divider feed strip line 24, further propagated to the feed strip line 18.18 via the through hole 30.30, and the slot 22.22- is excited. Ru.

In such a structure, unnecessary radiation from the power feed strip line 24 for the power divider is shielded by the reflective conductor 28 arranged between the slot 22, 22- and the power feed strip line 24 for the power divider. Furthermore, since there is no conductor other than the through hole 30.30 between the slot 22.22- and the reflective conductor 28, the beam emitted from the slot 22.22- to the reflective conductor 28 is Reflective conductor 2 without disturbance
It is reflected at 8. As a result, the radiation pattern on the surface side of the first dielectric layer IO is not affected by the power feeding section. Also,
The shielding conductor 40 shields unnecessary radiation from the power feed strip line 24 for the power divider radiated to the back side of the fourth dielectric layer I6, and the front-to-back ratio can be improved. , shows the sixth embodiment of the microstrip slot array antenna of the present invention, and the first embodiment
FIG. 1 is an exploded perspective view of the sixth embodiment, and FIG. 12 is a sectional view taken along the line FF in FIG. 11 in a stacked state.

In FIGS. 11 and 12, the same members as those in FIGS. 1 to 10 are given the same reference numerals and redundant explanations will be omitted.

11 and 12, the sixth embodiment is shown in the fourth embodiment.
The differences from the embodiment are as follows. Second
and the third dielectric layer 12.14, a reflective conductor 2 is provided on the entire surface between
8 is placed. and third and fourth dielectric layers 14.
Feed strip line 2 for power divider between 16
The power feed strip line 24 for power divider and the feed strip line 18.
and a through hole 3 passing through the third dielectric layer 12.14.
Electrical connection is made at 0.30. Further, a shielding conductor 40 is arranged on the entire back surface of the fourth dielectric layer 16. It goes without saying that the through holes 30, 30 and the reflective conductor 28 are insulated.

With this configuration, the same effects as in the fourth embodiment can be obtained, and unnecessary radiation from the power feed strip line 24 for power divider is blocked by the reflective conductor 28. Furthermore, the length of the through holes 30, 30 is shortened, and the power supply strip line 18.
A microwave signal is propagated to 18, and power radiation with good layer efficiency is possible.

By the way, in the fifth and sixth embodiments described above, the shielding conductor 40 is arranged on the entire back surface of the fourth dielectric layer I6 to improve the front-to-front ratio. If not required, the power divider feed strip line 24 may be formed on the back surface of the third dielectric layer 14, and the fourth dielectric layer 16 and the shielding conductor 40 may be omitted. Even in the case where the power divider feeding strip line 24 is bent, a microstrip line is formed by the reflective conductor 4o with the third dielectric layer 14 in between, and the microwave signal can be propagated.

In the above embodiment, the first, second, third, and fourth dielectric layers 10, 12, 14, and 16 may have the same dielectric constant, or may have different dielectric constants. It may be laminated.

(Effects of the Invention) Since the present invention is configured as described above, it produces the effects described below.

First, in the microstrip slot array antenna according to claim 1, the antenna and the power feeding part are incorporated in a substrate made by laminating a plurality of dielectric layers and are manufactured with high precision using printed wiring technology. Therefore, the antenna characteristics are stable and the vibration resistance is excellent. Moreover, by manufacturing using printed wiring technology, it is suitable for mass production and can be manufactured at low cost.

Further, in the microstrip slot array antenna according to claim 2, since the reflective conductor is disposed on the back surface of the substrate formed by laminating and integrating a plurality of dielectric layers, only one direction of the surface of the substrate is provided. A radiation beam can be formed efficiently.

In the microstrip slot array antenna according to claim 3, the same effect as the microstrip slot array antenna according to claim 2 can be obtained, and the substrate is thinner due to the fact that the fourth dielectric layer is not laminated. This is advantageous for downsizing.

Furthermore, in the microstrip slot array antenna according to claim 4, the same effect as the microstrip slot array antenna according to claim 2 can be obtained, and the substrate can be easily fixed using a reflector made of conductive metal. can do.

Further, in the microstrip slot array antenna according to claim 5, the same effect as the microstrip slot array antenna according to claim 1 can be obtained, and since the slot is not covered with a dielectric layer, the radiation beam Therefore, efficient power radiation is achieved without causing any attenuation.

Furthermore, in the microstrip slot array antenna according to claim 6, since a reflective conductor is arranged between the slot and the power feed strip line for the power divider, unnecessary radiation and reflection by the power feed strip line for the power divider can be avoided. shielded by conductors. Further, since there is no conductor other than a through hole between the slot and the reflective conductor, the beam emitted from the slot toward the reflective conductor is reflected without being disturbed. Therefore, the radiation pattern on the surface side of the first dielectric layer is not affected by the power feeding section, and a radiation pattern with a low sidelobe level corresponding to an appropriate design value can be easily obtained.

Furthermore, in the microstrip slot array antenna according to claim 7, the same effect as the microstrip slot array antenna according to claim 6 can be obtained, and the microstrip slot array antenna according to claim 7 can be efficiently microstriped by reducing the length of the through hole. The wave signal can be propagated to the feeding stripline, and since the slot is not covered by the dielectric layer, the radiation beam is not attenuated, and the radiation beam on the surface side of the first dielectric layer is not affected by the feeding part. This results in more efficient power radiation.

Furthermore, in the microstrip slot array antenna according to claim 8, the shield conductor disposed on the entire back surface of the fourth dielectric layer shields unnecessary radiation from the power feed strip line for the power divider, and Improvements will be made.

[Brief explanation of drawings]

FIG. 1 is an exploded perspective view of a first embodiment of the microstrip slot array antenna of the present invention, and FIG. FIG. 3 is an exploded perspective view of a second embodiment of the microstrip slot array antenna of the present invention, and FIG.
5 is a cross-sectional view taken along the line B-B in a laminated state in FIG. 3;
6 is an exploded perspective view of a third embodiment of the microstrip slot array antenna of the present invention, FIG. 6 is a sectional view taken along the line C-C in the stacked state in FIG. 5, and FIG. 8 is an exploded perspective view of the fourth embodiment of the microstrip slot array antenna of the present invention, and FIG.
FIG. 9 is an exploded perspective view of the fifth embodiment of the microstrip slot array antenna of the present invention, and FIG.
FIG. 11 is an exploded perspective view of a sixth embodiment of the microstrip slot array antenna of the present invention, and FIG. FIG. 2 is a sectional view taken along line FF in a laminated state. 10: First dielectric layer, 12: Second dielectric layer, 142 Third dielectric layer, Fourth dielectric layer, Power supply strip line, Conductive film, Slot, Power supply substrate conductor for power divider , reflective conductor, through hole, reflector, shielding conductor. Tripline, patent applicant Tetsuo Moriyama, patent attorney and agent of Icom Co., Ltd.

Claims (1)

[Claims] 1. First, second and third dielectric layers are laminated in order,
A power supply stripline is formed on the surface of the first dielectric layer, and a plurality of slots are arranged along the power supply stripline in a conductive film disposed between the first and second dielectric layers. A power feed strip line for a power divider, one end of which serves as a feed point, is arranged between the second and third dielectric layers so as to intersect the power feed strip line, and the power feed strip line for a power divider and the power feed strip line for a power divider A power supply strip line is connected by a through hole penetrating the first and second dielectric layers, and a substrate conductor facing the power divider power supply strip line is arranged on the back surface of the third dielectric layer. Features a microstrip slot array antenna. 2. The microstrip slot array antenna according to claim 1, wherein the laminate of the first, second, and third dielectric layers includes:
Further, a fourth dielectric layer is laminated, a substrate conductor is provided in a small area on the back surface of the third dielectric layer, and a reflective conductor is arranged on the entire back surface of the fourth dielectric layer. Features a microstrip slot array antenna. 3. The microstrip slot array antenna according to claim 1, wherein the substrate conductor is arranged on the entire back surface of the third dielectric layer. 4. The microstrip slot array antenna according to claim 1, further comprising a reflective plate made of conductive metal arranged parallel to and apart from the back surface of the third dielectric layer. 5. Laminating the first, second and third dielectric layers in order,
A power supply stripline is formed between the first and second dielectric layers, and a plurality of slots are arranged along the power supply stripline in a conductive film disposed on the surface of the first dielectric layer. A power feed strip line for a power divider, one end of which serves as a feed point, is arranged between the second and third dielectric layers so as to intersect the power feed strip line, and the power feed strip line for a power divider and the power feed strip line for a power divider The power supply strip line is connected to the power supply strip line through a through hole penetrating the second dielectric layer, and a substrate conductor facing the power divider power supply strip line is arranged on the back surface of the third dielectric layer. Microstrip slot array antenna. 6. Laminating the first, second and third dielectric layers in order,
A power supply stripline is formed on the surface of the first dielectric layer, and a plurality of slots are arranged along the power supply stripline in a conductive film disposed between the first and second dielectric layers. A reflective conductor is arranged on the entire surface between the second and third dielectric layers, and a power feed strip line for a power divider with one end serving as a feed point is connected to the power feed strip on the back surface of the third dielectric layer. The power feed strip line for the power divider is connected to the power feed strip line by a through hole penetrating the first, second, and third dielectric layers. Microstrip slot array antenna. 7. Laminating the first, second and third dielectric layers in order,
A power supply stripline is formed between the first and second dielectric layers, and a plurality of slots are arranged along the power supply stripline in a conductive film disposed on the surface of the first dielectric layer. A reflective conductor is arranged on the entire surface between the second and third dielectric layers, and a power feed strip line for a power divider with one end serving as a feed point is connected to the power feed strip on the back surface of the third dielectric layer. A microstrip slot array, which is arranged to intersect with the line, and the power divider feeding strip line and the feeding strip line are connected by a through hole penetrating the second and third dielectric layers. antenna. 8. The microstrip slot array antenna according to claim 6 or 7, further comprising laminating a fourth dielectric layer on the laminate of the first, second and third dielectric layers,
A microstrip slot array antenna characterized in that a shielding conductor is arranged on the entire back surface of the fourth dielectric layer.