JPH048947B2 - - Google Patents
Info
- Publication number
- JPH048947B2 JPH048947B2 JP25592688A JP25592688A JPH048947B2 JP H048947 B2 JPH048947 B2 JP H048947B2 JP 25592688 A JP25592688 A JP 25592688A JP 25592688 A JP25592688 A JP 25592688A JP H048947 B2 JPH048947 B2 JP H048947B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat pipe
- block
- cooling device
- cooled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001816 cooling Methods 0.000 claims description 19
- 238000001704 evaporation Methods 0.000 claims description 13
- 230000008020 evaporation Effects 0.000 claims description 8
- 230000005855 radiation Effects 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 239000012530 fluid Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25592688A JPH02103957A (ja) | 1988-10-13 | 1988-10-13 | ヒートパイプ式冷却装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25592688A JPH02103957A (ja) | 1988-10-13 | 1988-10-13 | ヒートパイプ式冷却装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02103957A JPH02103957A (ja) | 1990-04-17 |
JPH048947B2 true JPH048947B2 (US06312121-20011106-C00033.png) | 1992-02-18 |
Family
ID=17285492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP25592688A Granted JPH02103957A (ja) | 1988-10-13 | 1988-10-13 | ヒートパイプ式冷却装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02103957A (US06312121-20011106-C00033.png) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2544701B2 (ja) * | 1993-08-24 | 1996-10-16 | アクトロニクス株式会社 | プレ―ト形ヒ―トパイプ |
US7812604B2 (en) * | 2007-11-14 | 2010-10-12 | General Electric Company | Thermal management system for cooling a heat generating component of a magnetic resonance imaging apparatus |
JP2010267912A (ja) * | 2009-05-18 | 2010-11-25 | Furukawa Electric Co Ltd:The | 冷却装置 |
JP6266044B2 (ja) * | 2016-07-01 | 2018-01-24 | 古河電気工業株式会社 | ヒートシンク構造 |
-
1988
- 1988-10-13 JP JP25592688A patent/JPH02103957A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH02103957A (ja) | 1990-04-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3792318A (en) | Cooling apparatus for flat semiconductors using one or more heat pipes | |
US7090001B2 (en) | Optimized multiple heat pipe blocks for electronics cooling | |
US5293930A (en) | Surface-to-air heat exchanger for electronic devices | |
JP3199384B2 (ja) | 電子部品冷却用液冷ヒートシンクとその形成方法 | |
US4012770A (en) | Cooling a heat-producing electrical or electronic component | |
US4145708A (en) | Power module with isolated substrates cooled by integral heat-energy-removal means | |
US3852806A (en) | Nonwicked heat-pipe cooled power semiconductor device assembly having enhanced evaporated surface heat pipes | |
US4928756A (en) | Heat dissipating fin and method for making fin assembly | |
JP2005114341A (ja) | ヒートパイプを備えたヒートシンクおよびその製造方法 | |
US20190373761A1 (en) | Heatsink and method of manufacturing a heatsink | |
US3416597A (en) | Heat sink for forced air or convection cooling of semiconductors | |
US3826957A (en) | Double-sided heat-pipe cooled power semiconductor device assembly using compression rods | |
US20100218512A1 (en) | Heat exchanger for thermoelectric applications | |
KR100232810B1 (ko) | 절첩식 권선 와이어 열전도 부재를 갖춘 흡열 구조물 | |
US7401642B2 (en) | Heat sink with heat pipes | |
JPH048947B2 (US06312121-20011106-C00033.png) | ||
CN114096134A (zh) | 散热器及电子设备 | |
JPH11243289A (ja) | 電子機器 | |
JPH0714029B2 (ja) | 電力用半導体素子 | |
JPS6126781Y2 (US06312121-20011106-C00033.png) | ||
JP3334308B2 (ja) | ヒートパイプ及びヒートパイプ式放熱器 | |
JPS6322685Y2 (US06312121-20011106-C00033.png) | ||
JPH07176661A (ja) | ヒートシンク | |
JPH0629434A (ja) | 放熱装置 | |
JPH07103675A (ja) | ヒートパイプ式放熱器 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090218 Year of fee payment: 17 |
|
EXPY | Cancellation because of completion of term | ||
FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 17 Free format text: PAYMENT UNTIL: 20090218 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090218 Year of fee payment: 17 |