JPH048582Y2 - - Google Patents

Info

Publication number

JPH048582Y2

JPH048582Y2 JP2764687U JP2764687U JPH048582Y2 JP H048582 Y2 JPH048582 Y2 JP H048582Y2 JP 2764687 U JP2764687 U JP 2764687U JP 2764687 U JP2764687 U JP 2764687U JP H048582 Y2 JPH048582 Y2 JP H048582Y2

Authority

JP

Japan

Prior art keywords

sheet

cover sheet

electrode

thickness

conductive

Prior art date

1987-02-26

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
• Discuss

• 125000006850 spacer group Chemical group 0.000 claims description 8
• 230000005611 electricity Effects 0.000 description 9
• 230000003068 static effect Effects 0.000 description 9
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
• 229910052782 aluminium Inorganic materials 0.000 description 5
• HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
• 239000004020 conductor Substances 0.000 description 3
• 230000000694 effects Effects 0.000 description 3
• 229920003002 synthetic resin Polymers 0.000 description 3
• 239000000057 synthetic resin Substances 0.000 description 3
• 235000008331 Pinus X rigitaeda Nutrition 0.000 description 2
• 235000011613 Pinus brutia Nutrition 0.000 description 2
• 241000018646 Pinus brutia Species 0.000 description 2
• 239000013013 elastic material Substances 0.000 description 2
• 239000000463 material Substances 0.000 description 2
• 229920000728 polyester Polymers 0.000 description 2
• 229920005989 resin Polymers 0.000 description 2
• 239000011347 resin Substances 0.000 description 2
• 238000009823 thermal lamination Methods 0.000 description 2
• 238000007740 vapor deposition Methods 0.000 description 2
• OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
• 239000000853 adhesive Substances 0.000 description 1
• 230000001070 adhesive effect Effects 0.000 description 1
• 230000002411 adverse Effects 0.000 description 1
• 238000005452 bending Methods 0.000 description 1
• 239000011230 binding agent Substances 0.000 description 1
• 229910052799 carbon Inorganic materials 0.000 description 1
• 239000011248 coating agent Substances 0.000 description 1
• 238000000576 coating method Methods 0.000 description 1
• 229910052802 copper Inorganic materials 0.000 description 1
• 239000010949 copper Substances 0.000 description 1
• 239000002537 cosmetic Substances 0.000 description 1
• 230000006866 deterioration Effects 0.000 description 1
• 239000003792 electrolyte Substances 0.000 description 1
• 238000005530 etching Methods 0.000 description 1
• 230000001678 irradiating effect Effects 0.000 description 1
• 238000000034 method Methods 0.000 description 1
• 230000001590 oxidative effect Effects 0.000 description 1
• 229920001225 polyester resin Polymers 0.000 description 1
• 239000004645 polyester resin Substances 0.000 description 1
• 229920013716 polyethylene resin Polymers 0.000 description 1
• 239000000843 powder Substances 0.000 description 1
• 238000009958 sewing Methods 0.000 description 1
• 235000011121 sodium hydroxide Nutrition 0.000 description 1
• 229920002803 thermoplastic polyurethane Polymers 0.000 description 1

Cited By (1)