JPH0485744U - - Google Patents
Info
- Publication number
- JPH0485744U JPH0485744U JP12876690U JP12876690U JPH0485744U JP H0485744 U JPH0485744 U JP H0485744U JP 12876690 U JP12876690 U JP 12876690U JP 12876690 U JP12876690 U JP 12876690U JP H0485744 U JPH0485744 U JP H0485744U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- molded body
- resin molded
- external leads
- tips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａは本考案の一実施例の正面図、同図ｂ
は底面図、同図ｃは側面図である。第２図ａは従
来のＳＯＪ型集積回路装置の正面図、同図ｂは底
面図、同図ｃは側面図である。
１，１１……樹脂封止体、１ａ……底面の凹部
、２，１２……外部リード。
Figure 1a is a front view of an embodiment of the present invention, Figure 1b
is a bottom view, and c is a side view. 2A is a front view of a conventional SOJ type integrated circuit device, FIG. 2B is a bottom view, and FIG. 2C is a side view. 1, 11...Resin sealing body, 1a...Concave portion on bottom, 2, 12...External lead.
Claims (1)
底面に、この樹脂封止体の側面から外部に引出さ
れさらにＪ字形に内側に曲げられた多数の外部リ
ードのそれぞれに対応した凹部が設けられ、この
凹部に前記外部リードの先端がそれぞれ入り込ま
されていることを特徴とする集積回路装置。 A recess is provided on the bottom surface of the resin molded body that houses an integrated circuit chip therein, each corresponding to a large number of external leads that are drawn out from the side of the resin molded body and bent inward in a J-shape. , an integrated circuit device characterized in that the tips of the external leads are respectively inserted into the recesses.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12876690U JPH0485744U (en) | 1990-11-29 | 1990-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12876690U JPH0485744U (en) | 1990-11-29 | 1990-11-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0485744U true JPH0485744U (en) | 1992-07-24 |
Family
ID=31876209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12876690U Pending JPH0485744U (en) | 1990-11-29 | 1990-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0485744U (en) |
-
1990
- 1990-11-29 JP JP12876690U patent/JPH0485744U/ja active Pending
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