JPH048512B2 - - Google Patents
Info
- Publication number
- JPH048512B2 JPH048512B2 JP58013777A JP1377783A JPH048512B2 JP H048512 B2 JPH048512 B2 JP H048512B2 JP 58013777 A JP58013777 A JP 58013777A JP 1377783 A JP1377783 A JP 1377783A JP H048512 B2 JPH048512 B2 JP H048512B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- chemical
- solution
- copper plating
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 claims description 68
- 239000000126 substance Substances 0.000 claims description 46
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 38
- 229910052802 copper Inorganic materials 0.000 claims description 38
- 239000010949 copper Substances 0.000 claims description 38
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 19
- 229910001431 copper ion Inorganic materials 0.000 claims description 18
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 17
- -1 iron ions Chemical class 0.000 claims description 12
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical compound NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 8
- 239000008139 complexing agent Substances 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 7
- 229910052742 iron Inorganic materials 0.000 claims description 7
- 239000003638 chemical reducing agent Substances 0.000 claims description 6
- 230000000536 complexating effect Effects 0.000 claims description 3
- 150000002500 ions Chemical class 0.000 claims description 2
- 239000003381 stabilizer Substances 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims 1
- 239000000243 solution Substances 0.000 description 30
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 15
- 230000000694 effects Effects 0.000 description 12
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 10
- 239000003317 industrial substance Substances 0.000 description 10
- 239000012535 impurity Substances 0.000 description 5
- 235000011121 sodium hydroxide Nutrition 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000000084 colloidal system Substances 0.000 description 3
- 229910000365 copper sulfate Inorganic materials 0.000 description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- ROFVEXUMMXZLPA-UHFFFAOYSA-N Bipyridyl Chemical group N1=CC=CC=C1C1=CC=CC=N1 ROFVEXUMMXZLPA-UHFFFAOYSA-N 0.000 description 1
- ZGTMUACCHSMWAC-UHFFFAOYSA-L EDTA disodium salt (anhydrous) Chemical compound [Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC(O)=O)CC([O-])=O ZGTMUACCHSMWAC-UHFFFAOYSA-L 0.000 description 1
- REYJJPSVUYRZGE-UHFFFAOYSA-N Octadecylamine Chemical compound CCCCCCCCCCCCCCCCCCN REYJJPSVUYRZGE-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical group O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Description
〔発明の利用分野〕
本発明は化学銅めつき液に関する。特に、安価
な薬品で調製しても高いめつき効率を得られる化
学銅めつき液に関する。
〔従来技術〕
化学銅めつき液は、純度の高い薬品を用いて調
製するに越したことはない。その方がめつき効率
が良く、液安定性が良くて、その寿命も長いから
である。しかし経済的な理由から、純度は低いが
安価な工業薬品を使用して銅めつき液を得ること
が、従来より行われている。この場合、液寿命や
液安定性の低下、めつき効率の低下をできるだけ
防止することが必要である。
即ち一般に、化学銅めつき液は２価銅イオン、
２価銅イオンの錯化剤、２価銅イオンの還元剤、
PH調整剤を主成分として含み、液安定化のため、
少量の１価銅イオンの錯化剤やポリオキシエチレ
ン鎖を有する非イオン界面活性剤などを添加して
使用する。このような化学銅めつきの反応メカニ
ズムは厳密には明らかではないが、上記添加物の
使用によつて、事実上、液が安定化されることが
わかつている。従つてめつき反応に基づく主成分
濃度の低下を来たすことが無いように常時主成分
濃度を管理すれば、連続的にめつきが可能とな
り、実用に供される。
しかし従来技術の化学銅めつき液においては、
前記の如く安価な薬品を用いることに伴い、以下
の欠点があつた。即ち化学銅めつき液は、めつき
反応によつて液中の２価銅イオン、水酸イオン、
還元剤が消費される。このため、液成分の濃度が
一定の最適値となるように、２価銅イオン、水酸
イオン、還元剤を常時、不足分だけ補給しなけれ
ばならない。これらの補給源としては一般に経済
的理由によつて、安価な薬品である硫酸銅、水酸
化ナトリウムなどの水溶液を用い、その中でも一
部工業薬品が用いられることがある。かつ還元剤
がホルムアルデヒドの場合は、ホルマリンが使用
される。
一方化学銅めつきは、前記のごとく少量の添加
物で液の安定性を確保しているので、必須成分以
外の成分が液中にもたらされると、めつきの反応
が鋭敏に影響を受ける。代表的には液の分解が生
じたり、めつきがめつき槽壁やフイルター表面上
で生じるなどの現象である。その結果、めつき装
置に付着した不要な銅をエツチング除去したり、
更にそのエツチング液を処理することなどを要す
ることになり、しかも液寿命が短くなり、また被
めつき物以外のめつきにより、銅のめつき効率が
理論値の100％に至らず、70〜90％にも低下する。
工業薬品等純度の低い薬剤を用いると、それに含
まれる不純物により、上記のような何らかの悪影
響が発生することが避けられない。しかし従来は
このように上記補給物は最純の薬品を用いること
が望ましいにもかかわらず、液の寿命、液の安定
性を犠性にして、純度は低いが、安価な工業薬品
を使用するものであつた。
〔発明の目的〕
本発明の目的は、純度の低い薬品を用いても、
不純物による悪影響が生じず、長寿命、高安定で
あつて、めつき効率も高い有利な化学銅めつき液
を提供することにある。
〔発明の概要〕
２価銅イオン、２価銅イオンの錯化剤、２価銅
イオンの還元剤、PH調整剤、更に液安定化剤を組
成とする化学銅めつき液において、少なくとも前
記液中のイオン濃度と同等またはそれ以上の添加
量のアミノカルボン酸からなる２価銅イオンの錯
化剤と、前記組成中に含有される鉄イオンを錯体
化させることができる微量のトリエタノールアミ
ンを含んでなるものである。
本発明者らは前記した化学銅めつき液の補給薬
品に基づく液寿命、液安定性の低下の原因を究明
し、その結果補給薬品中の不純物として含有され
る鉄イオンによるコロイドの生成にその原因があ
ることを見出した。本発明者らはこの知見に基づ
き、更に該コロイドの生成を防止する化合物を
種々の検討の結果、トリエタノールアミンの添加
が極めて効果があることを見出し、これにより本
発明に到達したものである。
すなわち、化学銅めつき液内に前記アミノカル
ボン酸と該アミノカルボン酸の添加量に比べて微
量のトリエタノールアミンが共存すると、２価銅
イオンに対するトリエタノールアミンの安定度定
数が極めて小さいことから、２価銅イオンは、該
２価銅イオンに対して安定度定数の極めて大きい
アミノカルボン酸と錯体を形成し、トリエタノー
ルアミンと錯体を形成することは無く、一方、３
価鉄イオンに対するトリエタノールアミンの安定
度定数は、アミノカルボン酸より大きく、そのた
め３価鉄イオンと極めて安定な錯体を形成するか
ら、３価鉄イオンはアミノカルボン酸と錯体を形
成することは無い。
このため、純度の低い補給薬品中の不純物とし
て持ち込まれる３価鉄イオンは、２価銅イオンと
アミノカルボン酸との間に形成される錯体を破壊
することなく、しかもコロイドを生成することな
く、選択的にトリエタノールアミンによつて錯体
化され、めつき液の劣化を防止して液寿命、液の
安定性およびめつき効率を向上させることが可能
になつた。
〔発明の実施例〕
以下本発明の一実施例につき具体的に説明す
る。本例において化学銅めつきを実施した装置
は、容量5000のめつき槽で、めつき液は毎分
5000の流量で、5μmの細孔度を有するポリプロ
ピレン製フイルター、テフロン製熱交換器を通し
て循環させ、所定めつき温度に維持した。本循環
系路には硫酸銅、水酸化ナトリウムの水溶液、ホ
ルマリンなどを補給する注入系路が設けてあり、
液中の主成分濃度を自動的に分析、補給する装置
により、常時一定濃度となるようにした。液の案
定性は、銅のめつき効率を求めて判断した。な
お、めつき条件は、めつき速度を約2μm／ｈの一
定とし、被めつき物のめつき面積を1dm2／と
した。
本例の化学銅めつき液及び補給液の組成は次に
示す通りである。合せてめつき条件を記す。
〔〕化学銅めつき液組成、条件
CuSO4・5H2O（工業薬品） …10ｇ
EDTA−2Na（工業薬品） …30ｇ
NaOH（１級薬品） …PH：12.05となる量
ホルマリン（特級薬品） …３ml
α，α′−ジピリジル（特級薬品） …40mg
ポリエチレングリコールステアリルアミン（特
級薬品） …50mg
トリエタノールアミン（特級薬品）…次表の通り
イオン交換水 …全体を１とする量
めつき温度：75℃
〔〕補給液組成
○イ硫酸銅CuSO4・5H2O（工業薬品）
…200ｇ
イオン交換水…全体を１とする量
○ロ苛性ソーダNaOH（１級薬品）…40
0ｇ
イオン交換水…全体を１とする量
○ハホルマリンホルマリン（特級薬品
）…500ml
イオン交換水…全体を１とする量
上記のごときめつき薬品を用いて上記のめつき
組成、条件にて連続50時間めつきし、次に示す表
のごとくトリエタノールアミンを添加して銅のめ
つき効率を求めた。参照例として、全薬品に純度
の良い特級薬品を用いた場合を第１表のNo.１に示
した。この純度の良い特級薬品を用いた場合は、
トリエタノールアミンを添加すること無くめつき
を行つたが、そのめつき50時間後の銅のめつき効
率は約100％を得た。一方比較例として、前記し
た工業薬品を用い、トリエタノールアミンを添加
すること無くめつきしたところ、銅のめつき効率
は約87％となつた。表のNo.２で示す通りである。
この時めつき終了後、めつき槽底部とポリプロピ
レン製フイルター内のめつきの析出が認められ
た。前記した、必須成分以外の成分に起因する悪
影響の現れである。そこで、本発明の実施例とし
て、トリエタノールアミンを0.001ｇ/添加した
ところ、銅のめつき効率は90％に改善することが
できた（No.３）。トリエタノールアミンの添加量
増大とともに銅のめつき効率は増加し、0.01〜
0.5ｇ/の範囲で理論値に近い銅のめつき効率を
得た（No.４〜No.６）。この時得られためつき被膜
は全特級薬品のめつき被膜と同程度の光沢で、か
つ平滑なものであつた。なお、さらにトリエタノ
ールアミンの添加量も増加したところ、めつき液
の分解を認め、銅のめつき効率が低下した（No.
７）。
[Field of Application of the Invention] The present invention relates to a chemical copper plating solution. In particular, it relates to a chemical copper plating solution that can obtain high plating efficiency even when prepared with inexpensive chemicals. [Prior Art] It is best to prepare chemical copper plating solutions using chemicals of high purity. This is because the plating efficiency is better, the liquid stability is better, and the life is longer. However, for economical reasons, it has traditionally been the practice to obtain copper plating solutions using inexpensive industrial chemicals with low purity. In this case, it is necessary to prevent a decrease in the life of the solution, the stability of the solution, and the plating efficiency as much as possible. That is, in general, chemical copper plating solutions contain divalent copper ions,
Complexing agent for divalent copper ions, reducing agent for divalent copper ions,
Contains a PH adjuster as the main ingredient to stabilize the liquid.
A small amount of a monovalent copper ion complexing agent or a nonionic surfactant having a polyoxyethylene chain is used. Although the reaction mechanism of such chemical copper plating is not strictly clear, it is known that the use of the above additives actually stabilizes the liquid. Therefore, if the concentration of the main component is constantly controlled so as not to cause a decrease in the concentration of the main component due to the plating reaction, continuous plating becomes possible and is put to practical use. However, in the conventional chemical copper plating solution,
The use of inexpensive chemicals as described above has the following drawbacks. In other words, the chemical copper plating solution removes divalent copper ions, hydroxide ions, and
Reducing agent is consumed. Therefore, it is necessary to constantly replenish divalent copper ions, hydroxide ions, and reducing agents in the amount necessary to maintain the concentration of the liquid components at a constant optimum value. For economic reasons, aqueous solutions of inexpensive chemicals such as copper sulfate and sodium hydroxide are generally used as supply sources for these, and among these, some industrial chemicals may be used. And when the reducing agent is formaldehyde, formalin is used. On the other hand, in chemical copper plating, the stability of the solution is ensured with a small amount of additives as described above, so if components other than essential components are introduced into the solution, the plating reaction is acutely affected. Typical phenomena include decomposition of the liquid and plating on the tank wall or filter surface. As a result, unnecessary copper adhering to the plating equipment can be removed by etching,
Furthermore, it is necessary to process the etching solution, which shortens the life of the solution, and due to plating on objects other than those to be plated, the copper plating efficiency does not reach 100% of the theoretical value, and the It drops to 90%.
If a chemical with low purity, such as an industrial chemical, is used, the impurities contained therein will inevitably cause the above-mentioned adverse effects. However, conventionally, although it is desirable to use the purest chemicals for the above-mentioned supplies, low-purity but inexpensive industrial chemicals are used at the expense of the lifespan and stability of the solution. It was hot. [Object of the invention] The object of the present invention is that even if a chemical with low purity is used,
It is an object of the present invention to provide an advantageous chemical copper plating solution that is free from the adverse effects of impurities, has a long life, is highly stable, and has high plating efficiency. [Summary of the Invention] A chemical copper plating solution comprising divalent copper ions, a complexing agent for divalent copper ions, a reducing agent for divalent copper ions, a PH adjuster, and a solution stabilizer, which includes at least the aforementioned solution. A complexing agent for divalent copper ions consisting of an aminocarboxylic acid in an amount equal to or greater than the ion concentration in the composition, and a trace amount of triethanolamine capable of complexing the iron ions contained in the composition. It includes. The present inventors have investigated the cause of the decrease in the lifespan and stability of the chemical copper plating solution due to the replenishment chemicals mentioned above, and have found that colloid formation due to iron ions contained as impurities in the replenishment chemicals. I discovered that there is a reason. Based on this knowledge, the present inventors further investigated various compounds that prevent the formation of the colloid, and found that the addition of triethanolamine was extremely effective, and thereby arrived at the present invention. . In other words, if the aminocarboxylic acid and triethanolamine, which is a trace amount compared to the amount of the aminocarboxylic acid added, coexists in the chemical copper plating solution, the stability constant of triethanolamine with respect to divalent copper ions is extremely small. , divalent copper ion forms a complex with aminocarboxylic acid, which has an extremely large stability constant for the divalent copper ion, and does not form a complex with triethanolamine;
The stability constant of triethanolamine for valent iron ions is larger than that of aminocarboxylic acids, so it forms extremely stable complexes with trivalent iron ions, so trivalent iron ions do not form complexes with aminocarboxylic acids. . Therefore, trivalent iron ions brought in as impurities in low-purity supplementary chemicals do not destroy the complex formed between divalent copper ions and aminocarboxylic acids, and without forming colloids. By selectively complexing with triethanolamine, it has become possible to prevent the deterioration of the plating solution and improve the solution life, solution stability, and plating efficiency. [Embodiment of the Invention] An embodiment of the present invention will be specifically described below. The equipment used for chemical copper plating in this example is a plating tank with a capacity of 5000, and the plating solution is pumped every minute.
It was circulated at a flow rate of 5000 μm through a polypropylene filter with a porosity of 5 μm, a Teflon heat exchanger, and maintained at a given temperature. This circulation system is equipped with an injection system for supplying copper sulfate, an aqueous solution of sodium hydroxide, formalin, etc.
A device that automatically analyzes and replenishes the concentration of the main components in the liquid ensures a constant concentration at all times. The stability of the solution was determined by determining the copper plating efficiency. The plating conditions were such that the plating speed was constant at approximately 2 μm/h, and the plating area of the plated object was 1 dm 2 /h. The compositions of the chemical copper plating solution and replenishment solution in this example are as shown below. Also write down the plating conditions. [] Chemical copper plating solution composition, conditions CuSO 4・5H 2 O (industrial chemical)...10g EDTA-2Na (industrial chemical)...30g NaOH (first grade chemical)...Amount to give PH: 12.05 Formalin (special grade chemical)... 3ml α,α′-dipyridyl (special grade chemical)…40mg Polyethylene glycol stearylamine (special grade chemical)…50mg Triethanolamine (special grade chemical)…as shown in the table below Ion exchange water…amount equal to 1 Plating temperature: 75 °C [] Replenishment liquid composition ○Copper sulfate CuSO 4・5H 2 O (industrial chemical)
…200g Ion-exchanged water…amount considering the whole as 1 ○B Caustic soda NaOH (first class chemical)…40
0g Ion-exchanged water...amount that makes the whole 1 ○ Ha Formalin Formalin (special grade chemical)...500ml Ion-exchanged water...amount that makes the whole 1 Continuously under the above plating composition and conditions using the above-mentioned plating chemicals After plating for 50 hours, triethanolamine was added as shown in the table below to determine the copper plating efficiency. As a reference example, No. 1 in Table 1 shows a case where special grade chemicals with good purity were used as all chemicals. When using this special grade chemical with good purity,
Plating was performed without adding triethanolamine, and the copper plating efficiency after 50 hours of plating was approximately 100%. On the other hand, as a comparative example, when plating was performed using the above-mentioned industrial chemicals without adding triethanolamine, the copper plating efficiency was about 87%. As shown in No. 2 of the table.
At this time, after plating was completed, precipitation of plating was observed on the bottom of the plating tank and inside the polypropylene filter. This is a manifestation of the adverse effects caused by components other than the essential components mentioned above. Therefore, as an example of the present invention, when 0.001 g/g of triethanolamine was added, the copper plating efficiency could be improved to 90% (No. 3). As the amount of triethanolamine added increases, the copper plating efficiency increases, ranging from 0.01 to
A copper plating efficiency close to the theoretical value was obtained in the range of 0.5 g/(No. 4 to No. 6). The plating film obtained at this time had the same level of gloss as the plating film of all special grade chemicals, and was smooth. Furthermore, when the amount of triethanolamine added was further increased, decomposition of the plating solution was observed, and the copper plating efficiency decreased (No.
7).
以上述べたごとく、本発明のトリエタノールア
ミン添加による銅のめつき効率増加の効果は明白
である。よつて本発明によれば、工業薬品を使用
するなど、不純物を含有する可能性がある場合の
化学銅めつきの実用性を飛躍的に向上させること
ができ、低コストな化学銅めつきを達成できると
いう効果がある。この効果は著しく大きなもの
で、安価な工業薬品の使用、銅の使用効率の向上
などの経済的効果にとどまらず、めつき装置への
めつき付着等の悪影響を防止できる結果、従来大
規模な化学銅めつき装置内に付着した銅をエツチ
ング除去する必要があつたのを、その工程を不要
とし、そのエツチング液の廃液処理をも不要とす
る。従つて化学銅めつき全体の経済的効果まで及
ぼすほどである。
なお、トリエタノールアミンの添加効果は、上
記効果によるもので、化学銅めつきの組成と関係
するものではないことは説明するまでもない。
As described above, the effect of increasing copper plating efficiency by adding triethanolamine according to the present invention is obvious. Therefore, according to the present invention, the practicality of chemical copper plating in cases where there is a possibility of containing impurities, such as when industrial chemicals are used, can be dramatically improved, and low-cost chemical copper plating can be achieved. There is an effect that it can be done. This effect is extremely significant, and is not limited to economic effects such as the use of inexpensive industrial chemicals and improved efficiency in the use of copper, but also prevents negative effects such as adhesion of plating on plating equipment. To eliminate the need to remove copper adhering to a chemical copper plating device by etching, and also to eliminate the need for waste liquid treatment of the etching solution. Therefore, it even has an economical effect on chemical copper plating as a whole. It goes without saying that the effect of adding triethanolamine is due to the above effect and is not related to the composition of chemical copper plating.
Claims (1)
銅イオンの還元剤、PH調整剤、更に液安定化剤を
組成とする化学銅めつき液において、少なくとも
前記液中のイオン濃度と同等またはそれ以上の添
加量のアミノカルボン酸からなる２価銅イオンの
錯化剤と、前記組成中に含有される鉄イオンを錯
体化させることができる微量のトリエタノールア
ミンを含んでなることを特徴とする化学銅めつき
液。 ２ 前記化学銅めつき液内に含まれるアミノカル
ボン酸からなる２価銅イオンの錯化剤とトリエタ
ノールアミンとの重量比が、60〜3000：１である
特許請求の範囲第１項に記載の化学銅めつき液。[Scope of Claims] 1. A chemical copper plating solution comprising divalent copper ions, a complexing agent for divalent copper ions, a reducing agent for divalent copper ions, a PH adjuster, and a liquid stabilizer, at least A complexing agent for divalent copper ions made of aminocarboxylic acid in an amount equal to or greater than the ion concentration in the solution, and a trace amount of triethanol capable of complexing the iron ions contained in the composition. A chemical copper plating solution characterized by containing an amine. 2. Claim 1, wherein the weight ratio of the divalent copper ion complexing agent made of aminocarboxylic acid and triethanolamine contained in the chemical copper plating solution is 60 to 3000:1. chemical copper plating solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1377783A JPS59143058A (en) | 1983-02-01 | 1983-02-01 | Chemical copper plating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1377783A JPS59143058A (en) | 1983-02-01 | 1983-02-01 | Chemical copper plating solution |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59143058A JPS59143058A (en) | 1984-08-16 |
| JPH048512B2 true JPH048512B2 (en) | 1992-02-17 |
Family
ID=11842668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1377783A Granted JPS59143058A (en) | 1983-02-01 | 1983-02-01 | Chemical copper plating solution |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59143058A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2595319B2 (en) * | 1988-07-20 | 1997-04-02 | 日本電装株式会社 | Chemical copper plating solution and method for forming copper plating film using the same |
| US5965211A (en) * | 1989-12-29 | 1999-10-12 | Nippondenso Co., Ltd. | Electroless copper plating solution and process for formation of copper film |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5343890A (en) * | 1976-10-02 | 1978-04-20 | Nippon Telegr & Teleph Corp <Ntt> | Corrosion protective device for submarine coaxial cable, repeater frame |
| JPS5654386A (en) * | 1979-10-11 | 1981-05-14 | Hitachi Ltd | Fuel cladding tube with composit clad |
| JPS5852466A (en) * | 1981-09-21 | 1983-03-28 | Hitachi Chem Co Ltd | Electroless copper plating solution |
-
1983
- 1983-02-01 JP JP1377783A patent/JPS59143058A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5343890A (en) * | 1976-10-02 | 1978-04-20 | Nippon Telegr & Teleph Corp <Ntt> | Corrosion protective device for submarine coaxial cable, repeater frame |
| JPS5654386A (en) * | 1979-10-11 | 1981-05-14 | Hitachi Ltd | Fuel cladding tube with composit clad |
| JPS5852466A (en) * | 1981-09-21 | 1983-03-28 | Hitachi Chem Co Ltd | Electroless copper plating solution |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59143058A (en) | 1984-08-16 |
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