JPH048463U - - Google Patents

Info

Publication number

JPH048463U

JPH048463U JP4867290U JP4867290U JPH048463U JP H048463 U JPH048463 U JP H048463U JP 4867290 U JP4867290 U JP 4867290U JP 4867290 U JP4867290 U JP 4867290U JP H048463 U JPH048463 U JP H048463U

Authority

JP

Japan

Prior art keywords

current circuit

circuit board

copper foil

bonded

conductor

Prior art date

1990-05-11

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004020 conductor Substances 0.000 claims description 5
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
• 239000011889 copper foil Substances 0.000 claims description 3
• 239000000853 adhesive Substances 0.000 claims description 2
• 230000001070 adhesive effect Effects 0.000 claims description 2
• 239000000758 substrate Substances 0.000 claims description 2
• 238000005476 soldering Methods 0.000 claims 1
• 239000011347 resin Substances 0.000 description 2
• 229920005989 resin Polymers 0.000 description 2
• 239000006071 cream Substances 0.000 description 1
• 238000013007 heat curing Methods 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1