JPH0484447A - Wire bonding device and manufacture of semiconductor device using the same - Google Patents

Abstract

PURPOSE:To obtain a stable wire tension aligned in its flow by composing a tension applying mechanism of a nozzle directed toward the wire, one guide plate, and suitable number of contact rods in contact with the wire. CONSTITUTION:According to a tension applying mechanism 30 of this invention for applying a predetermined tension to a wire 1 at the time of wire bonding, a stable flow of gas from an injection hole 32 in a nozzle 31 along a guide plate 33 is obtained. Thus, the wire 1 is applied by the stable tension in the flowing direction (an arrow B) of the gas. Further, since the wire 1 is pressed by a contact rod 34 by the gas pressing force in a direction A, its position is stabilized. Accordingly, a predetermined wire tension is obtained. Since the wire 1 is brought into point contact with the rod 34, even if the plate 33 and the rod 34 are contaminated due to use of a long time, the wire tension scarcely becomes unstable because the contact area of the wire 1 with the contaminated part is small.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a wire bonding device used in a semiconductor device assembly process and a method of manufacturing a semiconductor device using the wire bonding device.

[Conventional technology]

FIG. 4 is a main view showing a conventional wire bonding apparatus disclosed in, for example, Japanese Patent Publication No. 53-10425, and FIG. 5 is a perspective view showing the wire tensioning mechanism shown in FIG. 4.

As shown in FIGS. 4 and 5, the spool 2 around which the wire 1 is wound is loosely fitted onto the shaft 3, and air is blown out from inside the shaft 3 to the contacting inner surface of the spool 2. There is. Further, since the air is ejected in an inclined direction with respect to the radial direction of the shaft 3, a rotational force is always applied to the spool 2 in the direction of the arrow 4.

Further, the lower end portion of the wire 1 unwound from the spool 2 passes through a linog-shaped guide 5 and is held by a cylindrical capillary 6. Also, guide 5 and capillary 6
A clamper 7 is disposed between the clamper 7 and the clamper 7, which is closed when necessary to tighten and hold the wire 1. Further, a tension applying mechanism 8 is disposed facing the wire 1 between the capillary 6 and the spool 2. This tension applying mechanism 8 is the fifth
As shown in the figure, it consists of a nozzle 10 having an injection hole 9 at its tip for injecting gas, and two flat guide plates 11 and 12 attached to the tip of the nozzle 10.

The guide plates 11 and 12 are spaced apart from each other by a predetermined distance, and the injection hole 9 faces the gap 13 formed by these guide plates 11p12. The wire 1 is passed through this gap 13.

Next, to explain the usage condition, first, the tip of the wire 1 protruding from the tip @ (lower end) of the capillary 6 is
- The capillary 6 is heated by electric discharge to form a spherical lump 15 by the electrode 14, and then the clamper 7 is opened to release the wire, and the capillary 6 is connected to the electrode portion of the berets 1-17 on the tab 6, that is, the first bonding. Bonding is performed by lowering to point 18.

Next, the capillary 6 is raised and moved onto the lid 19, and lowered again to reach the second bonding point 2.
Press it to 0. Thereafter, the wire 1 is separated from the vicinity of the joint at the second bonding point 20 by raising the wire 1 with the wire 1 held by the wire 7 and the capillary 6. As a result, a wire loop 21 is formed as shown by the chain line in FIG. 4, and wire bonding is performed.

At this time, the wire 1 is blown away by the wind pressure of the gas ejected from the injection hole 9 of the tension applying mechanism 8, but the lower end is held by the clamper 7 or the spherical mass 15, and the upper end is held by the rotational force of the spool 2. It becomes a state where it can be pulled up.

Therefore, the wire 1 draws a curve as shown in FIG. 4 due to the balance between the supporting force at the upper end and the wind pressure. Therefore, when the capillary 6 suddenly descends, the wire 1 changes to the chain line curve 22 shown in FIG. 4, but the wire 1 returns to its original state again according to the above-mentioned principle. That is, as the wind pressure applied to the wire 1 increases, the spool 2
The wire 1 is unraveled against the rotational force of. Even if this unraveling operation cannot sufficiently follow the rapid descent of the capillary 6, it is compensated for by the movement and deformation of the curved portion of the wire 1 (chain line curve 22), and as a result, no sudden tension is generated in the wire 1. .

Further, since the gas flow is protected on both sides by the pair of guide plates 11 and 12, the flow velocity does not decrease even if the gas flow is far from the injection hole 9. Therefore, a constant tension is always applied to the wire 1. Since a constant tension (desired tension) is applied to the wire 1 in this way, the length of the wire extending from the tip of the capillary 6, which is longer than the required length 10 when forming the wire loop, is reduced just before the second bonding. 6) is pulled back into the capillary 6 by the tension. Therefore, a desired tall loop is formed without the wire loop 21 sagging.

[Problem to be solved by the invention]

Since the conventional wire bonding apparatus is configured as described above, when it is used for a long period of time, the inside of the guide plates 11 and 12 becomes dirty due to the gas ejected from the injection hole 9, and therefore the wire tension changes and the wire The loop shape becomes poor. Therefore, periodic re-leaning is required, but in conventional wire bonding equipment, the guide plate 1
It is difficult to see the state of dirt inside the guide plates 11 and 12, and cleaning is extremely difficult due to the narrow spacing between the guide plates 11 and 12, resulting in problems such as very poor maintainability.

This invention was made to solve the above-mentioned problems, and provides a wire bonding device that makes it easy to see the state of dirt on the guide plate, is easy to clean, and has good maintainability, and a semiconductor device using the same. The purpose is to obtain a manufacturing method for.

[Means to solve the problem]

The wire bonding apparatus according to claim (1) of the invention includes a tension applying mechanism that includes a nozzle directed toward the wire and a single sheet provided along the flow direction of the gas ejected from the nozzle. It is composed of a guide plate and an appropriate number of contact rods that are fixed in parallel to the guide plate and make contact with the wire.

Further, the wire bonding method according to claim (2) of the present invention uses the wire bonding apparatus according to claim (1), holds the wire unwound from the spool by a capillary, and uses a tension applying mechanism to hold the wire by a capillary. The wire at the tip of the capillary is bonded to a predetermined bonding position while applying tension to the capillary.

[Effect]

In the invention described in claim (1) of the present invention, the tension applying mechanism is configured so that the gas flows along one guide plate, and the tension applying mechanism is configured such that the tension is applied to the wire.
As a result, stable wire tension with an even flow can be obtained.

Further, in the invention as set forth in claim (2), since the tension applying mechanism applies tension to the wire and performs bonding, stable wire bonding can be performed with a desired wire loop shape.

〔Example〕

FIG. 1 is a perspective view showing a wire bonding apparatus according to an embodiment of the present invention, and FIG. 2 is a front m1 view showing a state of contact between a wire and a contact rod. Moreover, FIG. 3 is a side view showing the state of gas flow.

In FIG. 1, 30 is a tensioner 4a according to the present invention, 31 is a nozzle, 32 is an injection hole formed in the nozzle 31, and 33 is a guide plate attached to the tip of the nozzle 31. In the example, it is composed of one guide plate 33. Two contact rods 34 are attached along the guide plate 33 and are in contact with the wire 1.

Note that since the other parts are the same as the conventional wire bonding apparatus, the explanation thereof will be omitted.

Further, since the wire bonding operation is performed in the same manner as in the past, a description thereof will be omitted, but according to the tension applying mechanism 30 of the present invention that applies a predetermined tension to the wire 1 during wire bonding, as shown in FIG. Since a stable gas flow is obtained from the injection hole 32 in the nozzle 31 along the guide plate 33, the wire 1 is given a stable tension in the gas flow direction (arrow B). Further, since the wire 1 is pressed against the contact rod 34 in the direction A by the pressing force of the gas, its position is also stabilized. Therefore, a predetermined wire tension is obtained.

Furthermore, as shown in FIG. 3, since the wire 1 and the contact rod 34 are in point contact, even if the guide plate 33 and the contact rod 34 become dirty due to long-term use, the dirty parts Since the contact area with the wire 1 is small, the wire tension is less likely to become unstable.

In the above embodiment, two contact rods 34 are provided, but the number of contact rods 34 may be one or more, and the same effect as in the above embodiment can be obtained.

Further, although the guide plate 33, the contact rod 34, and the nozzle 31 are shown as separate pieces, they may be all or partially integrated.

〔Effect of the invention〕

As explained above, the invention according to claim (1) of the present invention has a tension applying mechanism that is arranged in the direction of the flow of gas ejected from the nozzle directed toward the wire and the nozzle B/L. The structure consists of one guide plate installed along the guide plate and an appropriate number of contact rods that are fixed parallel to this guide plate and contact the wire, so that stable wire tension can be obtained and the tension of the guide plate and contact rods can be increased. The state of dirt can be easily seen, cleaning can be done easily, and maintenance efficiency is improved.

Since the wire is configured to make point contact with the contact rod, even if the guide plate and the contact rod become dirty, the contact area is small, so that the effect is obtained that the dirt hardly affects the guide plate and the contact rod.

Further, the invention described in claim (2) uses the wire bonding apparatus described in claim (1), holds the wire uncoiled from the spool by a capillary, and applies tension to the wire by a tension applying mechanism. Since the wire at the tip of the capillary is bonded to a predetermined bonding position, maintenance is easy, and since the wire is in point contact with the contact rod of the tensioning mechanism, dirt will not affect the wire tension. Even if it gets dirty, the dirt can be cleaned appropriately. Therefore, there is an advantage that high quality wire bonding can be realized.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a tension applying mechanism of a wire bonding device according to an embodiment of the present invention, FIG. 2 is a front view showing a state of contact between a wire and a contact rod, and FIG. 3 is a tension applying mechanism according to the present invention. FIG. 4 is a side view showing the gas flow of the mechanism; FIG. 4 is a diagram showing a schematic configuration of a conventional wire bonding device;
The figure is a perspective view showing a conventional mechanism for applying tension to a wire. In the figure, 1 is a wire, 30 is a tension applying mechanism, 31 is a nozzle, 32 is an injection hole, 33 is a guide plate, and 34 is a contact rod. Note that the same reference numerals in each figure indicate the same or corresponding parts. Agent Masuo Oiwa (2 others) Fig.

Claims (2)

[Claims] (1) In a wire bonding device that includes a spool for unwinding the wire, a capillary that holds the wire extending downward from the spool, and a tension applying mechanism that blows gas onto the wire extending between the spool and the capillary. , the tension applying mechanism is fixed to a nozzle directed toward the wire, a guide plate provided along the direction of the flow of gas ejected from the nozzle, and parallel to the guide plate, A wire bonding device comprising an appropriate number of contact rods that come into contact with the wire. (2) Using the wire bonding apparatus according to claim (1), the wire uncoiled from the spool is held by a capillary, and the wire at the tip of the capillary is held in a predetermined position while applying tension to the wire by a tension applying mechanism. A method for manufacturing a semiconductor device, characterized in that bonding is performed at a bonding position.